MANUFACTURING METHOD OF A MULTI-LAYER FOR A PROBE CARD

    公开(公告)号:US20200072873A1

    公开(公告)日:2020-03-05

    申请号:US16677581

    申请日:2019-11-07

    Abstract: A method of manufacturing a multi-layer for a probe card comprises providing first contact pads on an exposed face of a first dielectric layer and second contact pads on an exposed face of a last dielectric layer. Each dielectric layer is laser ablated to realize pass-through structures and the pass-through structures are conductively filled to realize conductive structures. The dielectric layers are superimposed in a way that each conductive structure contacts a corresponding conductive structure of a contiguous dielectric layer in the multi-layer and forms conductive paths electrically connected the first and second contact pads. The second contact pads having a greater distance between its symmetry centers than the first contact pads, the multi-layer thus performing a spatial transformation between the first and second contact pads connected through the connective paths.

    PROBE CARD FOR A TESTING APPARATUS OF ELECTRONIC DEVICES

    公开(公告)号:US20200057095A1

    公开(公告)日:2020-02-20

    申请号:US16664669

    申请日:2019-10-25

    Abstract: A probe card for a testing apparatus of electronic devices comprises a probe head housing a plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto contact pads of a device under test, as well as a main support and an intermediate support connected to the main support and adapted to realize a spatial transformation of distances between contact pads on its opposite faces as a space transformer, the probe card suitably also comprising at least one connecting element adapted to link the space transformer and the main support, this connecting element having a substantially rod-like body and being equipped with a first end portion comprising at least one terminal section adapted to be engaged in a corresponding housing realized in the space transformer and with a second terminal portion adapted to abut onto an abutment element linked to the main support.

    TESTING HEAD COMPRISING VERTICAL PROBES FOR REDUCED PITCH APPLICATIONS

    公开(公告)号:US20180052190A1

    公开(公告)日:2018-02-22

    申请号:US15801067

    申请日:2017-11-01

    Abstract: A testing head for testing the working of a device under test comprises a plurality of contact probes, each contact probe having a rod-like body of a predetermined length that extends between a first end and a second end and being housed in respective guide holes made in at least one plate-like lower guide and one plate-like upper guide that are parallel to each other and spaced apart by a bending zone. Suitably, at least one of the lower guide and upper guide is equipped with at least one recessed portion formed at a plurality of those guide holes and realizing lowered portions thereof adapted to reduce a thickness of the plurality of those guide holes.

    Probe card for an apparatus for testing electronic devices

    公开(公告)号:US09880202B2

    公开(公告)日:2018-01-30

    申请号:US14528774

    申请日:2014-10-30

    Abstract: A probe card for an apparatus for testing electronic devices comprises at least one probe head, a plurality of contact probes housed within the probe head, each contact probe having at least one contact tip suitable to abut against contact pads of a device to be tested, a supporting plate of the probe head, an interface plate, a stiffener associating the supporting plate and the interface plate, a plurality of connecting elements with clearance disposed between the supporting plate and the interface plate and housed in a floating manner in a plurality of respective seats made in the supporting plate, and a plurality of connecting elements without clearance disposed between the interface plate and the stiffener.

    CONTACT PROBE FOR A TESTING HEAD
    16.
    发明申请
    CONTACT PROBE FOR A TESTING HEAD 审中-公开
    联系人测试头

    公开(公告)号:US20170059612A1

    公开(公告)日:2017-03-02

    申请号:US15352448

    申请日:2016-11-15

    Abstract: A contact probe of a testing head of a testing apparatus of electronic devices comprises respective end portions adapted to contact respective contact pads and a body essentially extended in a longitudinal direction between the end portions, at least one end portion comprising an insert made of a first conductive material having a hardness being greater than a second conductive material making the contact probe which is supported by a section of the end portion, the section being made of the second conductive material and being shaped in a complementary way with respect to the insert and having respective abutting surfaces facing and adhering to respective abutting surfaces of the insert.

    Abstract translation: 电子装置的测试装置的测试头的接触探针包括适于接触相应接触垫的相应端部和在端部之间基本上沿纵向方向延伸的本体,至少一个端部包括由第一 所述导电材料具有大于第二导电材料的硬度,所述导电材料使所述接触探针由所述端部的一部分支撑,所述部分由所述第二导电材料制成并且相对于所述插入件以互补的方式成形,并具有 相应的邻接表面面向并粘附到插入件的相应的邻接表面。

    Flexible membrane adapted to carry high-frequency (RF) power signals and corresponding probe card for the high-frequency (RF) power test of electronic devices

    公开(公告)号:US12292457B2

    公开(公告)日:2025-05-06

    申请号:US18254044

    申请日:2021-11-18

    Inventor: Flavio Maggioni

    Abstract: A flexible membrane adapted to carry high-frequency power signals is described having a plurality of contact pads in a central portion of the flexible membrane connected to a plurality of micro contact probes and a plurality of contact structures connected to a support plate in a peripheral portion of the flexible membrane, as well as a plurality of conductive tracks connecting the contact pads with the contact structures. The flexible membrane further includes an intermediate portion between the central and peripheral portions. The elastic membrane is divided into a first area having a first total thickness and into a second area having a second total thickness. The first area is contiguous and adjacent to the second area. The first total thickness is less than or equal to 75 μm and the second total thickness is greater than the first total thickness.

    Testing head with an improved contact between contact probes and guide holes

    公开(公告)号:US12105118B2

    公开(公告)日:2024-10-01

    申请号:US17783452

    申请日:2020-12-18

    Inventor: Roberto Crippa

    CPC classification number: G01R1/073

    Abstract: A testing head for testing the functionality of an electronic device is disclosed having a plurality of contact probes including a probe body extended between respective end portions adapted to contact respective contact pads, a lower guide provided with guide holes for housing the contact probes, and a conductive portion in the lower guide. The conductive portion includes a group of the guide holes and is adapted to contact and short-circuit a corresponding group of contact probes housed in the group of holes. The contact probes housed in the group of holes include a deformable portion adapted to be partially inserted into the guide holes of the group. The deformable portion, when housed in the guide holes, is in a configuration in which it is deformed by the contact with a wall of the guide holes and exerts on the wall a reaction force ensuring a sliding contact during testing of the electronic device.

    Vertical probe head with improved contact properties towards a device under test

    公开(公告)号:US12085588B2

    公开(公告)日:2024-09-10

    申请号:US17308636

    申请日:2021-05-05

    Inventor: Stefano Felici

    CPC classification number: G01R1/07342

    Abstract: A probe head for testing a device under test includes an upper guide and a lower guide parallel to each other and spaced apart. Each of the guides is provided with a respective plurality of guide holes, a plurality of contact probes housed in the guide holes and provided each with a first end and with a second end, the first end being adapted to contact pads of a device under test. At least one additional guide is associated with one of the guides. The additional guide includes first guide holes, housing a first group of the contact probes, and second guide holes, housing a second group of the contact probes. The first and second guide holes are shifted with respect to the guide holes of the guide which said additional guide is associated with, and the shift of the first guide holes is in a direction opposite the shift of the second guide holes.

    Manufacturing method of a multi-layer for a probe card

    公开(公告)号:US12019111B2

    公开(公告)日:2024-06-25

    申请号:US16677581

    申请日:2019-11-07

    Abstract: A method of manufacturing a multi-layer for a probe card comprises providing first contact pads on an exposed face of a first dielectric layer and second contact pads on an exposed face of a last dielectric layer. Each dielectric layer is laser ablated to realize pass-through structures and the pass-through structures are conductively filled to realize conductive structures. The dielectric layers are superimposed in a way that each conductive structure contacts a corresponding conductive structure of a contiguous dielectric layer in the multi-layer and forms conductive paths electrically connected the first and second contact pads. The second contact pads having a greater distance between its symmetry centers than the first contact pads, the multi-layer thus performing a spatial transformation between the first and second contact pads connected through the connective paths.

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