Abstract:
The present invention provides to a liquid crystal panel, which comprises: a first substrate, a second substrate, a coplanar transparent electrode layer and a liquid crystal layer. The first and second substrates have a first and second alignment films, respectively. The coplanar transparent electrode layer is disposed onto the second alignment film. The liquid crystal layer is disposed in a space between the first alignment film of the first substrate and the coplanar transparent electrode layer of the second substrate. The liquid crystal film comprises positive liquid crystal molecules and reactive mesogens (RMs). The liquid crystal panel of the present invention can overcome the problems of pollution and static electricity generated from the rubbing alignment in the IPS mode. In comparison with the PSVA mode, the present invention can simplify the manufacturing process and provide the advantages of high contrast, high response speed and wide viewing angle.
Abstract:
The present invention provides a method of liquid crystal (LC) alignment and LC panel, which includes: providing first substrate, forming first alignment film on surface of first substrate; providing second substrate, disposed oppositely to first substrate, and forming common electrodes, pixel electrodes disposed with separating space, and second alignment film covering common electrodes and pixel electrodes on surface of second substrate; filling LC composite between first alignment film and second alignment film, LC composite comprising reactive monomers and LC molecules; applying high frequency alternating electric field to common electrodes and pixel electrodes so that reactive monomers and LC molecules arranged perpendicular to high frequency alternating electric field with pretilt angle; continuing applying high frequency alternating electric field and using UV radiation to fix pretilt angle to perform alignment. The present invention does not use rubbing to perform alignment, and avoids pollution to LC panel.
Abstract:
A diffusion barrier layer, a metal interconnect arrangement and a method of manufacturing the same are disclosed. In one embodiment, the metal interconnect arrangement may comprise a conductive plug/interconnect wire for electrical connection, and a diffusion barrier layer provided on at least a portion of a surface of the conductive plug/interconnect wire. The diffusion barrier layer may comprise insulating amorphous carbon.
Abstract:
The present invention provides a semiconductor structure comprising a substrate; a gate stack on the substrate; a spacer on the sidewalls of the gate stack; a source/drain junction extension formed in the substrate on both sides of the gate stack by epitaxial growth; and a source/drain region in the substrate on both sides of the source/drain junction extension. Accordingly, the present invention also provides methods for manufacturing the semiconductor structure. The present invention can provide a source/drain junction extension with a high doping concentration and a low junction depth, thereby effectively improving the performance of the semiconductor structure.
Abstract:
The present invention provides to an in-plane-switching (IPS) mode liquid crystal panel, which comprises: a first substrate, a second substrate, a coplanar transparent electrode layer and a liquid crystal layer. The first and second substrates have a first alignment film and a second alignment film, respectively. The coplanar transparent electrode layer is disposed onto the second alignment film. The liquid crystal layer is disposed in a space between the first alignment film of the first substrate and the coplanar transparent electrode layer of the second substrate. The liquid crystal layer comprises dual-frequency liquid crystal molecules and dual-frequency reactive mesogens/monomers. The liquid crystal panel of the present invention can overcome the problems of pollution and static electricity generated from the rubbing alignment in the in-plane-switching (IPS) mode, so as to simplify the manufacturing process and provide the advantages of high contrast, high response speed and wide viewing angle.
Abstract:
The present invention discloses a method for manufacturing a semiconductor device, which comprises: forming a plurality of fins on a substrate, which extend along a first direction and have rhombus-like cross-sections; forming a gate stack structure on each fin, which traverses the plurality of fins and extends along a second direction; wherein a portion in each fin that is under the gate stack structure forms a channel region of the device, and portions in each fin that are at both sides of the gate stack structure along the first direction form source and drain regions. The semiconductor device and its manufacturing method according to the present invention use rhombus-like fins to improve the gate control capability to effectively suppress the short channel effect, moreover, an epitaxial quantum well is used therein to better limit the carriers, thus improving the device drive capability.
Abstract:
The present invention discloses a semiconductor device, comprising a plurality of fins located on a substrate and extending along a first direction; a plurality of gate stack structures extending along a second direction and across each of the fins; a plurality of stress layers located in the fins on both sides of the gate stack structures and having a plurality of source and drain regions therein; a plurality of channel regions located in the fins below the gate stack structures; characterized in that the stress layers have connected parts in the fins and that the channel regions enclose the connected parts.
Abstract:
The present invention discloses a method for manufacturing a high mobility material layer, comprising: forming a plurality of precursors in/on a substrate; and performing a pulse laser processing such that the plurality of precursors react with each other to produce a high mobility material layer. Furthermore, the present invention also provides a method for manufacturing a semiconductor device, comprising: forming a buffer layer on an insulating substrate; forming a first high mobility material layer on the buffer layer using the method for manufacturing the high mobility material layer; forming a second high mobility material layer on the first high mobility material layer using the method for manufacturing the high mobility material layer; and forming trench isolations and defining active regions in the first and second high mobility material layers.
Abstract:
The present invention discloses a semiconductor device, comprising a first MOSFET; a second MOSFET; a first stress liner covering the first MOSFET and having a first stress; a second stress liner covering the second MOSFET and having a second stress; wherein the second stress liner and/or the first stress liner comprise(s) a metal oxide. In accordance with the high-stress CMOS and method of manufacturing the same of the present invention, a stress layer comprising a metal oxide is formed selectively on PMOS and NMOS respectively by using a CMOS compatible process, whereby carrier mobility of the channel region is effectively enhanced and the performance of the device is improved.
Abstract:
The present invention provides a liquid crystal display panel and manufacturing method thereof. The manufacturing method includes: disposing a first and a second substrate oppositely, first substrate comprising a color filter (CF) array area and a first non-display area disposed in peripheral of CF array area, first substrate or second substrate coated with radiation curing agent corresponding to first non-display area; using curing radiation to shine on first substrate from a side of first substrate away from second substrate so that incident curing radiation to CF array area absorbed by CF array area, and incident curing radiation to first non-display area curing radiation curing agent to adhere first and second substrates. The present invention effectively solves insufficient curing problem caused by shielding of metal routes in peripheral of thin film transistor array area and reduces manufacture cost of liquid crystal display panel without UV mask.