ROUGH STRUCTURE OF OPTOELECTRONIC DEVICE AND FABRICATION THEREOF
    14.
    发明申请
    ROUGH STRUCTURE OF OPTOELECTRONIC DEVICE AND FABRICATION THEREOF 审中-公开
    光电器件的粗糙结构及其制造

    公开(公告)号:US20100019263A1

    公开(公告)日:2010-01-28

    申请号:US12505711

    申请日:2009-07-20

    Abstract: A dual-scale rough structure, in which a plurality of islands are grown on a semiconductor layer by heavily doping a dopant during epitaxy of a semiconductor layer of an optoelectronics device, is provided. A plurality of pin holes are formed on the islands by lowering the epitaxial temperature. The pin holes are distributed over the top and sidewall surfaces of the islands so that the total internal reflection within the optoelectronics device can be significantly reduced so as to enhance the brightness thereof. Compared with traditional technologies, the process method of the present invention has the advantages of producing less pollution, being able to perform easily, reducing manufactured cost, increasing the efficiency of light extraction, and increasing the effective area of the dual-scale emitting surface, which is not a smooth surface, of the structure.

    Abstract translation: 提供了一种双尺度粗糙结构,其中通过在光电子器件的半导体层的外延期间重掺杂掺杂剂,在半导体层上生长多个岛。 通过降低外延温度,在岛上形成多个针孔。 针孔分布在岛的顶壁和侧壁表面上,使得光电子器件内的全内反射可以显着地减小,从而增强其亮度。 与传统技术相比,本发明的方法具有污染少,能够容易地实现,降低制造成本,提高光提取效率,增加双尺度发射面有效面积的优点, 这不是一个光滑的表面,结构。

Patent Agency Ranking