公开(公告)号：US09007581B2

公开(公告)日：2015-04-14

申请号：US13621121

申请日：2012-09-15

Applicant: Izuo Horai ,  Hirokazu Koyabu ,  Yuta Urano ,  Takahiro Jingu

Inventor： Izuo Horai ,  Hirokazu Koyabu ,  Yuta Urano ,  Takahiro Jingu

IPC: G01J3/00 ,  G01N21/00 ,  G01N21/95 ,  G01N21/65 ,  G01N21/47 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/65 ,  G01N21/9505 ,  G01N2021/4711 ,  G01N2021/473 ,  G01N2021/8861 ,  G01N2021/8864

Abstract: An inspection method and an inspection device, or apparatus each capable of conducting composition analysis of a defect detected by elastic or stokes scattered light, an inspection surface or defect on the surface of the inspection surface, or a defect on the surface of the inspection object and its internal composition. A surface inspection method for optically detecting elastic or stokes scattering or inelastic or anti-stokes scattered light from inside the surface of the inspection object, for detecting existence of defects of the inspection object and features of the defects, for detecting positions of the detected defects on the surface of the inspection object, classifying and analyzing the detected defects in accordance with their features on the basis of the positions of the defects and the features of the defects or the classification result of the defects.

Abstract translation: 检查方法和检查装置或装置，其能够对由检查表面的弹性或sto kes散射光，检查面或缺陷检测到的缺陷或检​​查对象的表面上的缺陷进行组成分析 及其内在组成。 一种表面检查方法，用于光学检测来自检查对象的表面内的弹性或斯托克斯散射或非弹性或反射散射光，用于检测检查对象的缺陷的存在和缺陷的特征，用于检测检测到的缺陷的位置 在检查对象的表面上，根据缺陷的位置和缺陷的特征或缺陷的分类结果，根据其特征对检测到的缺陷进行分类和分析。

公开(公告)号：US08804110B2

公开(公告)日：2014-08-12

申请号：US13703414

申请日：2011-05-20

Applicant: Yuta Urano ,  Shigenobu Maruyama ,  Toshiyuki Nakao ,  Toshifumi Honda ,  Yukihiro Shibata

Inventor： Yuta Urano ,  Shigenobu Maruyama ,  Toshiyuki Nakao ,  Toshifumi Honda ,  Yukihiro Shibata

IPC: G01N21/00 ,  G01N21/95 ,  G01N21/94 ,  G01N21/956

CPC classification number: G01N21/94 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/4711 ,  G01N2021/8867 ,  G01N2021/8874 ,  G01N2201/0806 ,  G01N2201/10

Abstract: Proposed is a defect inspection method whereby: illuminating light having a substantially uniform illumination intensity distribution in one direction of a sample surface irradiated on the sample surface; multiple scattered light components, which are output in multiple independent directions, are detected among the scattered light from the sample surface and multiple corresponding scattered light detection signals are obtained; at least one of the multiple scattered light detection signals is processed and the presence of defects is determined; at least one of the multiple scattered light detection signals that correspond to each of the points determined by the processing as a defect is processed and the dimensions of the defect are determined; and the position and dimensions of the defect on the sample surface, at each of the points determined as a defect, are displayed.

Abstract translation: 提出了一种缺陷检查方法，其中：照射在样品表面上的样品表面的一个方向具有基本上均匀的照明强度分布的光; 在来自样品表面的散射光中检测多个独立方向输出的多个散射光分量，并获得多个相应的散射光检测信号; 处理多个散射光检测信号中的至少一个并确定缺陷的存在; 处理与通过处理确定的每个点对应的多个散射光检测信号中的至少一个作为缺陷，并确定缺陷的尺寸; 并且显示在被确定为缺陷的每个点处的样品表面上的缺陷的位置和尺寸。

公开(公告)号：US20140204194A1

公开(公告)日：2014-07-24

申请号：US14116132

申请日：2012-04-27

Applicant: Yuko Otani ,  Toshifumi Honda ,  Yuta Urano

Inventor： Yuko Otani ,  Toshifumi Honda ,  Yuta Urano

IPC: G01N21/95 ,  G02B26/00

CPC classification number: G01N21/9505 ,  G01B11/00 ,  G01B11/02 ,  G01B15/00 ,  G01N21/47 ,  G01N21/9501 ,  G01N2021/4711 ,  G01N2021/8822 ,  G01N2021/8867 ,  G02B26/008 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: This invention relates to a method for performing an analysis of defective material and the refractive index, and a three-dimensional analysis of very small pattern shapes including the steps of imaging by a scanning electron microscope to acquire an image of the position of a defect under observation using information of inspection results obtained by an optical inspection device, creating a model of the defect by using the acquired image of the defect under observation, calculating the values detected by the detector when reflected and scattered light emitted from a defect model is received by the detector when light is irradiated onto the defect model thus created, comparing the detection values thus calculated and the values detected by the detector, which has received light actually reflected and scattered from the sample, to obtain information relating to the height of the defect under observation, the material, or the refractive index.

Abstract translation: 本发明涉及一种用于对缺陷物质进行分析的方法和折射率，以及非常小的图案形状的三维分析，包括以下步骤：通过扫描电子显微镜成像以获得缺陷位置的图像 观察使用由光学检查装置获得的检查结果的信息，通过使用获取的观察缺陷图像来产生缺陷的模型，计算当从缺陷模型发射的反射和散射光被反射和检测到的值时检测到的值被接收到 当将光照射到如此产生的缺陷模型上时，将检测器与这样计算的检测值进行比较，并将接收到从样品实际反射和散射的光的检测器检测到的值进行比较，以获得与缺陷的高度有关的信息 观察，材料或折射率。

公开(公告)号：US08638429B2

公开(公告)日：2014-01-28

申请号：US13146428

申请日：2009-12-15

Applicant: Toshiyuki Nakao ,  Shigenobu Maruyama ,  Akira Hamamatsu ,  Yuta Urano

Inventor： Toshiyuki Nakao ,  Shigenobu Maruyama ,  Akira Hamamatsu ,  Yuta Urano

IPC: G01N21/00 ,  G01J4/00

CPC classification number: G01N21/9501 ,  G01N21/8806 ,  G01N2021/8809 ,  G01N2021/8848 ,  H01L22/12

Abstract: Provided are a defect inspecting method and a defect inspecting apparatus, wherein defect detecting sensitivity is improved and also haze measurement is performed using polarization detection, while suppressing damages to samples. The defect inspecting apparatus is provided with a light source which oscillates to a sample a laser beam having a wavelength band wherein a small energy is absorbed, and two independent detecting optical systems, i.e., a defect detecting optical system which detects defect scattered light generated by a defect, by radiating the laser beams oscillated by the light source, and a haze detecting optical system which detects roughness scattered light generated due to roughness of the wafer surface. Polarization detection is independently performed with respect to the scattered light detected by the two detecting optical systems, and based on the two different detection signals, defect determination and haze measurement are performed.

Abstract translation: 提供了一种缺陷检查方法和缺陷检查装置，其中提高了缺陷检测灵敏度，并且在抑制对样本的损害的同时使用偏振检测进行雾度测量。 缺陷检查装置具有向样品振荡的光源，其具有吸收小能量的波长带的激光束，以及两个独立的检测光学系统，即检测由 通过照射由光源振荡的激光束的缺陷，以及检测由于晶片表面的粗糙度而产生的粗糙度散射光的雾度检测光学系统。 相对于由两个检测光学系统检测的散射光独立地进行极化检测，并且基于两个不同的检测信号，执行缺陷确定和雾度测量。

公开(公告)号：US20130301042A1

公开(公告)日：2013-11-14

申请号：US13976178

申请日：2011-10-21

Applicant: Yuta Urano ,  Toshifumi Honda ,  Yukihiro Shibata

Inventor： Yuta Urano ,  Toshifumi Honda ,  Yukihiro Shibata

IPC: G01N21/956

CPC classification number: G01N21/956 ,  G01B11/0608 ,  G01N21/9501 ,  G01N21/95623 ,  G01N2021/8854 ,  G01N2201/1045

Abstract: A defect inspection method includes: illuminating an area on surface of a specimen as a test object under a specified illumination condition; scanning a specimen to translate and rotate the specimen; detecting scattering lights to separate each of scattering lights scattered in different directions from the illuminated area on the specimen into pixels to be detected according to a scan direction at the scanning a specimen and a direction approximately orthogonal to the scan direction; and processing to perform an addition process on each of scattering lights that are detected at the step and scatter approximately in the same direction from approximately the same area of the specimen, determine presence or absence of a defect based on scattering light treated by the addition process, and compute a size of the determined defect using at least one of the scattering lights corresponding to the determined defect.

Abstract translation: 缺陷检查方法包括：在规定的照明条件下照射作为被检体的试样表面的面积; 扫描样品以平移和旋转样品; 检测散射光，根据扫描样本的扫描方向和与扫描方向大致正交的方向，将从样本上的照射区域向不同方向散射的散射光分离成要检测的像素; 对在步骤中检测到的每个散射光进行加法处理，并且从与样本的大致相同的区域大致相同的方向散射，基于通过加法处理的散射光确定缺陷的存在或不存在 并且使用与所确定的缺陷相对应的散射光中的至少一个来计算确定的缺陷的大小。

公开(公告)号：US20130277553A1

公开(公告)日：2013-10-24

申请号：US13993838

申请日：2011-11-10

Applicant: Yuko Otani ,  Yuta Urano ,  Toshifumi Honda

Inventor： Yuko Otani ,  Yuta Urano ,  Toshifumi Honda

IPC: H01J37/26

CPC classification number: H01J37/261 ,  G01N21/8806 ,  G01N21/9501

Abstract: Disclosed are a method and an apparatus for observing defects by using an SEM, wherein, in order to observe defects on a wafer at high speed and high sensitivity, positional information of defects on a sample, which has been optically inspected and detected by other inspecting apparatus, and information of the conditions of the optical inspection having been performed by other inspecting apparatus are obtained, and optically detecting the defects on the sample placed on a table, on the basis of the thus obtained information, and on the basis of the detected positional information of the defect on the sample placed on the table, the positional information of the defect having been inspected and detected by other inspecting apparatus is corrected, then, the defects on the sample placed on the table are observed by the SEM using the thus corrected positional information of the defects.

Abstract translation: 公开了通过使用SEM观察缺陷的方法和装置，其中为了以高速和高灵敏度观察晶片上的缺陷，通过其他检查被光学检查和检测的样品上的缺陷的位置信息 获取了由其他检查装置执行的光学检查条件的信息，并根据所获得的信息，基于检测到的信息光学地检测放置在工作台上的样品上的缺陷 对放置在工作台上的样品上的缺陷的位置信息进行校正，由其他检查装置检查和检测的缺陷的位置信息被校正，然后通过SEM观察放置在工作台上的样品上的缺陷， 校正了缺陷的位置信息。

公开(公告)号：US08477302B2

公开(公告)日：2013-07-02

申请号：US12412776

申请日：2009-03-27

Applicant: Yuta Urano ,  Toshiyuki Nakao ,  Yoshimasa Oshima ,  Akira Hamamatsu

Inventor： Yuta Urano ,  Toshiyuki Nakao ,  Yoshimasa Oshima ,  Akira Hamamatsu

IPC: G01N21/00

CPC classification number: G01N21/9501 ,  G01N21/9505 ,  G01N2021/8854 ,  G01N2021/8874 ,  G01N2201/103 ,  G01N2201/1045

Abstract: A defect inspection apparatus for inspecting a surface of a sample includes a stage for holding the sample, an illumination optical system that irradiates a laser beam to form a linear illuminated area on the surface of the sample, a detection optical system, and a signal processing system. The detection optical system includes a detector device having a plurality of pixels for detecting light scattered from the linear illuminated area of the surface of the sample, and that outputs in parallel a plurality of detection signals having mutually different sensitivities acquired from the plurality of pixels of the detector device. The signal processing system selects an unsaturated detection signal from the plurality of detection signals and detects a defect in accordance with the selected detection signal.

Abstract translation: 用于检查样品表面的缺陷检查装置包括用于保持样品的载物台，照射光学系统，其照射激光束以在样品的表面上形成线性照射区域，检测光学系统和信号处理 系统。 检测光学系统包括具有多个像素的检测器装置，用于检测从样品表面的线性照射区域散射的光，并且并行地输出具有从多个像素获得的具有相互不同的灵敏度的多个检测信号 检测器装置。 信号处理系统从多个检测信号中选择不饱和检测信号，并根据所选择的检测信号检测缺陷。

公开(公告)号：US20130155400A1

公开(公告)日：2013-06-20

申请号：US13700520

申请日：2011-05-20

Applicant: Toshiyuki Nakao ,  Junguo Xu ,  Yuki Shimizu ,  Toshihiko Nakata ,  Toshifumi Honda ,  Yukihiro Shibata ,  Yuta Urano

Inventor： Toshiyuki Nakao ,  Junguo Xu ,  Yuki Shimizu ,  Toshihiko Nakata ,  Toshifumi Honda ,  Yukihiro Shibata ,  Yuta Urano

IPC: G01N21/95

CPC classification number: G01N21/95 ,  G01N21/9501 ,  G01Q60/22 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A defect inspecting method is provided which comprises a pre-scan defect inspecting process including a pre-scan irradiating step for casting irradiation light onto the surface of a sample, a pre-scan detecting step for detecting the scattered lights, and a pre-scan defect information collecting step for obtaining information on preselected defects present on the sample surface on the basis of the scattered lights; a near-field defect inspecting process including a near-field irradiating step in which the distance between the sample surface and a near-field head is adjusted so that the sample surface is irradiated, a near-field detecting step for detecting near-field light response, and a near-field defect information collecting step for obtaining information on the preselected defects on the basis of the near-field light response; and a merging process for inspecting defects present on the sample surface by merging the pieces of information on the preselected defects.

Abstract translation: 提供一种缺陷检查方法，其包括预扫描缺陷检查处理，其包括用于将照射光投射到样品表面上的预扫描照射步骤，用于检测散射光的预扫描检测步骤，以及预扫描 缺陷信息收集步骤，用于基于散射光获得在样品表面上存在的预选缺陷的信息; 包括近场照射步骤的近场缺陷检查处理，其中调整样品表面和近场磁头之间的距离以照射样品表面;近场检测步骤，用于检测近场光 响应和近场缺陷信息收集步骤，用于基于近场光响应获得关于预选缺陷的信息; 以及通过合并关于预选缺陷的信息来检查存在于样品表面上的缺陷的合并过程。

公开(公告)号：US08462330B2

公开(公告)日：2013-06-11

申请号：US13362808

申请日：2012-01-31

Applicant: Hiroyuki Nakano ,  Toshihiko Nakata ,  Sachio Uto ,  Akira Hamamatsu ,  Shunji Maeda ,  Yuta Urano

Inventor： Hiroyuki Nakano ,  Toshihiko Nakata ,  Sachio Uto ,  Akira Hamamatsu ,  Shunji Maeda ,  Yuta Urano

IPC: G01N21/88

CPC classification number: G01N21/956 ,  G01N21/47 ,  G01N21/94 ,  G01N21/9501 ,  G01N2021/8822

Abstract: A method and apparatus for detecting defects are provided for detecting defects or foreign matter on an object to be inspected. The apparatus includes a movable stage for mounting a specimen, an illumination system for irradiating a circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. A spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern. The scattered and reflected light received by the detector is converted into an electrical signal. The converted electrical signal of one chip is compared with that of the other adjacent chip.

Abstract translation: 提供一种用于检测缺陷的方法和装置，用于检测被检测物体上的缺陷或异物。 该装置包括用于安装样本的可移动台，用于从倾斜方向的光照射电路图案的照明系统和用于从上方和倾斜形成检测器上的照射检测区域的图像的图像形成光学系统 方向。 利用这种布置，收集通过照明系统的照明在电路图案上产生的衍射光和散射光。 在傅立叶变换表面上提供空间滤波器，用于阻挡来自电路图形的线性部分的衍射光。 由检测器接收的散射和反射光被转换成电信号。 将一个芯片的转换电信号与另一个芯片的转换电信号进行比较。

公开(公告)号：US08427634B2

公开(公告)日：2013-04-23

申请号：US12647246

申请日：2009-12-24

Applicant: Yuta Urano ,  Akira Hamamatsu ,  Shunji Maeda ,  Kaoru Sakai

Inventor： Yuta Urano ,  Akira Hamamatsu ,  Shunji Maeda ,  Kaoru Sakai

IPC: G01N21/00

CPC classification number: G01N21/9501 ,  G01N21/4738 ,  G01N21/956

Abstract: A pattern inspection apparatus is provided to compare images of regions, corresponding to each other, of patterns that are formed so as to be identical and judge that non-coincident portions in the images are defects. The pattern inspection apparatus is equipped with an image comparing section which plots individual pixels of an inspection subject image in a feature space and detects excessively deviated points in the feature space as defects. Defects can be detected correctly even when the same patterns in images have a brightness difference due to a difference in the thickness of a film formed on a wafer.

Abstract translation: 提供了一种图案检查装置，用于将形成为相同的图案的彼此对应的区域的图像进行比较，并判断图像中的非重合部分是缺陷。 图案检查装置配备有图像比较部，其在特征空间中绘制检查对象图像的各个像素，并且将特征空间中的过度偏离的点作为缺陷进行检测。 即使图像中的相同图案由于晶片上形成的膜的厚度差而具有亮度差，因此也可以正确地检测缺陷。