公开(公告)号：US10894302B2

公开(公告)日：2021-01-19

申请号：US15318895

申请日：2015-06-22

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Remya Chandran ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Bawa Singh

IPC: B23K35/02 ,  B23K35/30 ,  B23K35/32 ,  B23K35/36 ,  B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  C09C1/62

Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.

公开(公告)号：US20190194517A1

公开(公告)日：2019-06-27

申请号：US16289789

申请日：2019-03-01

Applicant: Alpha Assembly Solutions Inc.

Inventor： Shamik Ghosal ,  Ranjit Pandher ,  Oscar Khaselev ,  Ravi Bhatkal ,  Rahul Raut ,  Bawa Singh ,  Morgana de Avila Ribas ,  Siuli Sarkar ,  Sutapa Mukherjee ,  Sathish Kumar ,  Remya Chandran ,  Pavan Vishwanath ,  Ashok Pachamuthu ,  Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Nirmalya Kumar Chaki

IPC: C09K5/14 ,  B22F1/02 ,  B22F1/00 ,  C09C3/08 ,  B82Y30/00 ,  C01G5/00 ,  C09C1/62

CPC classification number: C09K5/14 ,  B22F1/0011 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/0074 ,  B22F1/02 ,  B22F2001/0066 ,  B82Y30/00 ,  C01G5/00 ,  C01P2002/72 ,  C01P2002/88 ,  C01P2004/04 ,  C01P2004/53 ,  C01P2004/61 ,  C01P2004/64 ,  C01P2006/22 ,  C01P2006/32 ,  C01P2006/40 ,  C09C1/62 ,  C09C3/08 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

公开(公告)号：US20180102464A1

公开(公告)日：2018-04-12

申请号：US15286759

申请日：2016-10-06

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Pritha Choudhury ,  Siuli Sarkar ,  Ranjit Pandher ,  Nicholas G. Herrick ,  Amit Patel ,  Ravindra M Bhatkal ,  Bawa Singh

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/64 ,  B23K1/00 ,  B23K1/08 ,  B23K1/002 ,  B23K1/005 ,  B23K35/26 ,  C22C13/02

CPC classification number: H01L33/62 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/085 ,  B23K35/262 ,  C22C13/02 ,  H01L24/13 ,  H01L24/29 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/13211 ,  H01L2224/13313 ,  H01L2224/1332 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/29211 ,  H01L2224/29313 ,  H01L2224/2932 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2924/01058 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/20106 ,  H01L2924/351 ,  H01L2933/0066

Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

公开(公告)号：US20170304955A1

公开(公告)日：2017-10-26

申请号：US15644331

申请日：2017-07-07

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ranjit Pandher ,  Bawa Singh ,  Siuli Sarkar ,  Sujatha Chegudi ,  Anil K. N. Kumar ,  Kamanio Chattopadhyay ,  Dominic Lodge ,  Morgana de Avila Ribas

IPC: B23K35/26 ,  B23K1/005 ,  B23K35/02 ,  C22C13/02 ,  C22C12/00 ,  B23K1/002

CPC classification number: B23K35/262 ,  B23K1/002 ,  B23K1/0056 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/264 ,  B23K2101/42 ,  C22C12/00 ,  C22C13/02 ,  Y10T403/479

Abstract: The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to .0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to .0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to .0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.

公开(公告)号：US20250026645A1

公开(公告)日：2025-01-23

申请号：US18901595

申请日：2024-09-30

Applicant: Alpha Assembly Solutions Inc.

Inventor： Nirmalyakumar Chaki ,  Supriya Devarajan ,  Barun Das ,  Chetan Pravinchandra Shah ,  Venodh Manoharan ,  Rahul Raut ,  Bawa Singh ,  Ranjit Pandher

IPC: C01B32/194 ,  B29C51/14 ,  B29K67/00 ,  B29K69/00 ,  C08K3/04 ,  C09K5/14 ,  H01B1/04

Abstract: Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.

公开(公告)号：US20230330788A1

公开(公告)日：2023-10-19

申请号：US18205590

申请日：2023-06-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Anil Kumar ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravi Bhatkal ,  Bawa Singh

IPC: B23K35/02 ,  B23K1/012 ,  B23K1/005 ,  B23K35/26 ,  B23K1/08 ,  B23K1/00 ,  H05K3/34 ,  C22C13/02 ,  B23K1/20 ,  B23K1/002 ,  B23K1/19 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/012 ,  B23K1/085 ,  B23K1/19 ,  B23K1/203 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  C22C13/00 ,  C22C13/02 ,  H05K3/3457 ,  H05K3/3463 ,  B23K2103/12 ,  Y10T403/479

Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.

公开(公告)号：US11411150B2

公开(公告)日：2022-08-09

申请号：US16257441

申请日：2019-01-25

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Pritha Choudhury ,  Siuli Sarkar ,  Ranjit Pandher ,  Nicholas G Herrick ,  Amit Patel ,  Ravindra M Bhatkal ,  Bawa Singh

IPC: B23K35/26 ,  C22C13/02 ,  H01L33/62 ,  H01L23/00 ,  B23K1/00 ,  B23K1/002 ,  B23K1/005 ,  B23K1/08 ,  H01L33/64

Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

公开(公告)号：US20210205935A1

公开(公告)日：2021-07-08

申请号：US17149503

申请日：2021-01-14

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Remya Chandran ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Bawa Singh

IPC: B23K35/30 ,  B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  C09C1/62 ,  B23K35/02 ,  B23K35/36

Abstract: A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.

公开(公告)号：US10065274B2

公开(公告)日：2018-09-04

申请号：US14909888

申请日：2014-08-29

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Ranjit Pandher ,  Bawa Singh ,  Rahul Raut ,  Sanyogita Arora ,  Ravindra Bhatkal ,  Bin Mo

IPC: B23K35/36 ,  B23K35/26 ,  B23K35/362 ,  B23K35/02 ,  B23K1/012 ,  B23K1/08 ,  B23K1/19 ,  C22C13/00

Abstract: A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.

公开(公告)号：US20170197281A1

公开(公告)日：2017-07-13

申请号：US15326180

申请日：2015-07-15

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravindra Bhatkal ,  Bawa Singh

IPC: B23K35/26 ,  H01L23/00 ,  B23K1/08 ,  B23K1/00 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/0056 ,  B23K1/085 ,  B23K35/00 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K2101/40 ,  B23K2101/42 ,  C22C13/00 ,  C22C13/02 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29105 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29117 ,  H01L2224/29123 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29149 ,  H01L2224/29155 ,  H01L2224/29157 ,  H01L2224/2916 ,  H01L2224/29163 ,  H01L2224/29166 ,  H01L2224/29169 ,  H01L2224/29171 ,  H01L2224/29172 ,  H01L2224/2918 ,  H01L2224/83815 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01032 ,  H01L2924/01034 ,  H01L2924/01052 ,  H01L2924/01058

Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.