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公开(公告)号：US10474189B2
公开(公告)日：2019-11-12
申请号：US16172790
申请日：2018-10-27
Applicant: Apple Inc.
Inventor： Matthew Theobald , Jonathan P. Ive , Bartley K. Andre , Christopher Stringer , Daniel J. Coster , John Raff , Ron Hopkinson , John Brock , Chris Ligtenberg , Michelle Rae Goldberg
Abstract: A top case assembly for a portable computer is disclosed. The assembly may include an integral unified (e.g., homogenous) top case formed from a single part. The integral top case provides an enclosure, frame and cosmetic exterior of the portable computer. The integral top case also serves as the primary structure of the portable computer. The assembly may include a variety of subassemblies such as keyboards, touchpads, circuit boards, and drives that are carried by the underside of the integral top case. The integral top case may be formed from aluminum slab that has been machined to form walls, openings, attachment areas and cosmetic areas of the top case.
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公开(公告)号：US10284951B2
公开(公告)日：2019-05-07
申请号：US14507582
申请日：2014-10-06
Applicant: Apple Inc.
Inventor： Martin E. Johnson , Ruchi Goel , Darby E. Hadley , John Raff
Abstract: A method and apparatus for outputting audio based on an orientation of an electronic device, or video shown by the electronic device. The audio may be mapped to a set of speakers using either or both of the device and video orientation to determine which speakers receive certain audio channels.
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公开(公告)号：US20190103715A1
公开(公告)日：2019-04-04
申请号：US16139068
申请日：2018-09-23
Applicant: Apple Inc.
Inventor： Reza Nasiri Mahalati , Blake R. Marshall , Liquan Tan , Florence W. Ow , Alex C. Yeung , John Raff , Robert Scritzky , Wei-Hsuan Chen , Eric S. Jol , Madhusudanan Keezhveedi Sampath , Nan Liu , Gianpaolo Lisi , YiBo Liu
IPC: H01R13/66 , H01R13/22 , H01R13/502 , H02J50/10
Abstract: Hybrid connectors that may transfer power and data with a variety of electronic devices having different types of connector interfaces, may consume a minimal amount of surface area, depth, and volume in an electronic device, and may be readily manufactured.
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公开(公告)号：US20190101960A1
公开(公告)日：2019-04-04
申请号：US16145019
申请日：2018-09-27
Applicant: Apple Inc.
Inventor： Mikael M. Silvanto , Simon R. Trivett , Matthew S. Theobald , Dinesh C. Mathew , Simon R. Lancaster-Larocque , Robert Y. Cao , Ari P. Miller , Kevin M. Robinson , Houtan R. Farahani , Francesco Ferretti , John Raff , Robert J. Lockwood , Genie Kim , Karan Bir , Keith J. Hendren , Gurshan Deol , Antonio Clarke , Prabhu Sathyamurthy , William A. Counts
Abstract: An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.
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公开(公告)号：US20190044093A1
公开(公告)日：2019-02-07
申请号：US15864983
申请日：2018-01-08
Applicant: Apple Inc.
Inventor： Daniel B. Sargent , John Raff , Li Zhang , Victor H. Yin , Wenyong Zhu
Abstract: An organic light-emitting diode display may have an array of pixels formed from a layer of thin-film circuitry. The thin-film circuitry may be formed on a glass layer that serves as an inner layer of encapsulation for the array of pixels formed from the thin-film circuitry. A thin-film encapsulation layer may overlap the array of pixels and may serve as an opposing outer layer of encapsulation for the array of pixels formed by the thin-film circuitry. An electronic device may have opposing front and rear faces. The display may be mounted in a housing on the front face. The housing may have a planar rear wall on the rear face. A display cover layer associated with the display may overlap the pixel array. A touch sensor and optical layers such as a circular polarizer layer and a compensation layer may be interposed between the display cover layer and the thin-film.
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Patent Agency Ranking
公开(公告)号：US09681570B2
公开(公告)日：2017-06-13
申请号：US14487869
申请日：2014-09-16
Applicant: Apple Inc.
Inventor： William F. Leggett , John Raff
CPC classification number: H05K7/1427 , G06F1/1658 , H05K1/189 , H05K3/361 , H05K3/363 , H05K3/368 , H05K2201/09918 , H05K2201/10128 , H05K2203/107
Abstract: An electronic device may have printed circuits to which electrical components are mounted. The printed circuits may have metal traces that form signal lines and contact pads. Vias or other conductive structures may be used in interconnecting the signal lines to the contact pads. The contact pads may have elongated shapes or other shapes and may be formed in arrays on the printed circuits. Laser welds or other electrical connections may be used to join contact pads on a first printed circuit to respective contact pads on a second printed circuit. The laser welds may form part of a rectangular region of welds or may form part of a non-rectangular region of welds such as a region with a curved edge. Alignment marks may be used in aligning the contact pads.
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公开(公告)号：US20160260945A1
公开(公告)日：2016-09-08
申请号：US15156013
申请日：2016-05-16
Applicant: Apple Inc.
Inventor： Fletcher Rothkopf , David A. Pakula , Daniel W. Jarvis , John Raff , Jeremy C. Franklin
IPC: H01M2/10 , H01M2/02 , H01M10/647 , H01M10/6572 , H01M10/623 , H01L31/048 , H01M10/613
CPC classification number: H01M2/1066 , H01L31/048 , H01M2/0207 , H01M6/46 , H01M10/0436 , H01M10/425 , H01M10/613 , H01M10/623 , H01M10/647 , H01M10/657 , H01M10/6572 , H01M2220/30 , Y02E10/50 , Y10T156/10 , Y10T156/1082
Abstract: Flexible battery packs for use in electronic devices are disclosed. In one embodiment of the present disclosure, the flexible battery pack may include a plurality of cells, such as galvanic or photovoltaic cells. The battery pack also may include a plurality of laminate layers coupled to the cells that include a top laminate layer and a bottom laminate layer. An adhesive may be used to couple the top and bottom laminate layers together such that each of the plurality of cells is isolated from each other. This arrangement may allow the battery to be shaped to fit a form factor of the electronic device. This arrangement also may allow one or more of the cells to be selectively removed from the plurality, which may be desirable from a manufacturing perspective.
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公开(公告)号：US20160091678A1
公开(公告)日：2016-03-31
申请号：US14597995
申请日：2015-01-15
Applicant: APPLE INC.
Inventor： Amy Qian , Derek W. Wright , John Raff
CPC classification number: G02B6/4206 , G02B6/4292 , G02B6/4295 , H04B10/801
Abstract: An electronic device having an optical connector that provides and/or receives optical signals through openings or perforations formed at an external surface of the electronic device. These openings can serve as the interface of the optical connector through which the electronic device can engage in one-way or two-way communication with corresponding optical connectors of other electronic devices. These openings can be sized such that they are not visible or not easily visible with the naked human eye. As such, these openings can be too small for communicating with corresponding optical connectors using any single one of these openings. But light that is collectively transmitted through or received through a group of these openings can provide optical signals that can be used to communicate with corresponding optical connectors using optical signals.
Abstract translation: 一种具有光学连接器的电子设备，其通过形成在电子设备的外表面处的开口或穿孔提供和/或接收光信号。 这些开口可以用作光学连接器的接口，电子设备可以通过该接口与其它电子设备的相应光学连接器进行单向或双向通信。 这些开口的大小可以使其不可见或不容易用肉眼看到。 因此，这些开口可能太小，以便使用这些开口中的任何一个与相应的光学连接器连通。 但是通过一组这些开口集体传输或接收的光可以提供可用于使用光信号与对应的光连接器进行通信的光信号。
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公开(公告)号：US20160087329A1
公开(公告)日：2016-03-24
申请号：US14862032
申请日：2015-09-22
Applicant: Apple Inc.
Inventor： Benjamin M. Rappoport , Bruce E. Berg , John Raff , Stephen R. McClure
Abstract: An electronic device may be provided with antenna structures that are embedded in a dielectric such as plastic. The plastic may be molded over the antenna structures using molding equipment. Antenna structures may be embedded in molded plastic structures such as plastic electronic device housing structures. The plastic electronic device housing structures may form housing structures such as housing wall structures. The antenna structures may be embedded within the housing wall structures in the vicinity of an exterior surface of the housing wall structures. Embedded antenna structures may also be mounted under other dielectric structures such portions of a display cover layer.
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公开(公告)号：US20150357733A1
公开(公告)日：2015-12-10
申请号：US14300855
申请日：2014-06-10
Applicant: Apple Inc.
Inventor： Emery A. Sanford , Tyson B. Manullang , David G. Havskjold , Tyler S. Bushnell , Eric S. Jol , Anthony S. Montevirgen , John Raff
IPC: H01R12/61
CPC classification number: H01R12/62 , H01R12/52 , H05K1/14 , H05K1/142 , H05K1/147 , H05K1/148 , H05K2201/046 , H05K2201/05 , H05K2201/10325 , H05K2201/1034 , H05K2201/10681
Abstract: An electrical board-to-board connector including a flexible cable assembly having a low profile or dimensionally reduced configuration. The connector body of a cable assembly may be widened to provide the structural rigidity sufficient to support an array of solder lead connections. Other support elements may be omitted from the cable assembly, which results in a reduced height dimension. The flexible cable assembly may also include a cowling used to retain the cable assembly against a circuit board. The cowling may also be configured to reduce the dimensions or dimensional footprint of the connection.
Abstract translation: 一种电路板对板连接器，包括具有低轮廓或尺寸减小的构造的柔性电缆组件。 电缆组件的连接器主体可以被加宽以提供足以支持焊锡引线连接阵列的结构刚度。 可以从电缆组件中省略其它支撑元件，这导致减小的高度尺寸。 柔性电缆组件还可以包括用于将电缆组件保持抵靠电路板的整流罩。 整流罩也可以被配置成减小连接的尺寸或尺寸。
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