公开(公告)号：US20160114458A1

公开(公告)日：2016-04-28

申请号：US14920801

申请日：2015-10-22

Applicant: APPLIED MATERIALS, INC.

Inventor： Rajeev BAJAJ ,  Daniel REDFIELD ,  Mahendra C. ORILALL ,  Boyi FU ,  Aniruddh KHANNA ,  Jason G. FUNG ,  Mario CORNEJO ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Veera Raghava REDDY ,  Ashavani KUMAR ,  Venkatachalam HARIHARAN ,  Gregory E. MENK ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Robert E. DAVENPORT ,  Amritanshu SINHA

IPC: B24B37/26 ,  B24B37/24 ,  B24D11/04 ,  B24D3/28 ,  B24D11/00

CPC classification number: B24B37/26 ,  B24B37/22 ,  B24B37/24 ,  B24D3/28 ,  B24D11/00 ,  B24D11/001 ,  B24D11/04 ,  B33Y10/00 ,  B33Y80/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

Abstract translation: 本公开的实施例涉及具有可调节的化学，材料和结构特性的高级抛光垫及其制造方法。 根据本公开的一个或多个实施例，已经发现可以通过诸如三维（3D）印刷工艺的添加剂制造工艺来生产具有改进性能的抛光垫。 因此，本公开的实施例可以提供具有离散特征和几何形状的先进抛光垫，其由至少两种不同的材料形成，包括功能性聚合物，功能低聚物，反应性稀释剂和固化剂。 例如，先进的抛光垫可以由多个聚合物层形成，通过至少一种树脂前体组合物的自动顺序沉积，然后至少一个固化步骤，其中各层可代表至少一种聚合物组合物和/ 或不同组成的区域。

公开(公告)号：US20160107287A1

公开(公告)日：2016-04-21

申请号：US14887240

申请日：2015-10-19

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Daniel REDFIELD ,  Mahendra C. ORILALL ,  Boyi FU ,  Aniruddh KHANNA ,  Jason G. FUNG ,  Mario CORNEJO ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Veera Raghava Reddy KAKIREDDY ,  Ashavani KUMAR ,  Venkatachalam HARIHARAN ,  Gregory E. MENK ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Robert E. DAVENPORT ,  Amritanshu SINHA

IPC: B24B37/22 ,  B24B37/24 ,  B24D3/28

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US20250056920A1

公开(公告)日：2025-02-13

申请号：US18797189

申请日：2024-08-07

Applicant: Applied Materials, Inc.

Inventor： Peiwen LIU ,  Uma SRIDHAR ,  Hyunsung BANG ,  Kai DING ,  Jeffrey L. FRANKLIN ,  Mingwei ZHU ,  Hou T. NG ,  Nag B. PATIBANDLA

IPC: H01L33/00 ,  H01L25/075

Abstract: The present disclosure provides devices and methods for repairing dice during micro-LED display fabrication. The devices include a backplane. The backplane has a plurality of backplane electrodes. Each backplane electrode includes a first material. A plurality of micro-LEDs having a plurality of micro-LED electrodes is included in the device. Each micro-LED electrode includes a second material. Each micro-LED electrode is bonded to each backplane electrode with an alloy of the first material and the second material therebetween. At least one backplane electrode is bonded to the micro-LED electrode via a repair material. The device includes a plurality of subpixel isolation (SI) structures formed over the backplane. The SI structures define wells of sub-pixels. Each well includes a respective micro-LED between adjacent SI structures. The sub-pixels have a color conversion material disposed in the wells.

公开(公告)号：US20220402091A1

公开(公告)日：2022-12-22

申请号：US17834675

申请日：2022-06-07

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/24

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material, and structural properties, and new methods of manufacturing the same. In one or more embodiments, polishing pads with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Some embodiments may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, advanced polishing pads may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, where each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments can also provide polishing pads with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20210205951A1

公开(公告)日：2021-07-08

申请号：US17209137

申请日：2021-03-22

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B29C64/112 ,  B24D3/28 ,  B24D11/00 ,  B24D11/04 ,  B33Y10/00 ,  B33Y80/00 ,  B29C35/08 ,  C09D4/00 ,  C09G1/16

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20200325353A1

公开(公告)日：2020-10-15

申请号：US16668961

申请日：2019-10-30

Applicant: Applied Materials, Inc.

Inventor： Uma SRIDHAR ,  Sivapackia GANAPATHIAPPAN ,  Ashwin CHOCKALINGAM ,  Yingdong LUO ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Sudhakar MADHUSOODHANAN

IPC: C09D11/38 ,  B24B37/24 ,  C09D11/107 ,  C09D11/101 ,  B33Y70/00 ,  B33Y80/00

Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.

公开(公告)号：US20190337117A1

公开(公告)日：2019-11-07

申请号：US16375506

申请日：2019-04-04

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Ankit VORA ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Sudhakar MADHUSOODHANAN

IPC: B24B37/22 ,  B24B37/24 ,  B24B37/26

Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.

公开(公告)号：US20190139788A1

公开(公告)日：2019-05-09

申请号：US16171000

申请日：2018-10-25

Applicant: Applied Materials, Inc.

Inventor： Boyi FU ,  Han-Wen CHEN ,  Kyuil CHO ,  Sivapackia GANAPATHIAPPAN ,  Roman GOUK ,  Steven VERHAVERBEKE ,  Nag B. PATIBANDLA ,  Yan ZHAO ,  Hou T. NG ,  Ankit VORA ,  Daihua ZHANG

IPC: H01L21/56 ,  H01L21/67

Abstract: Aspects of the disclosure generally relate to methods of immobilizing die on a substrate. In one method one or more immobilization features are formed in a selected pattern on a substrate. A die is positioned in contact with the one or more immobilization features and the substrate. The one or more immobilization features are cured, and a mold layer is formed on top of the cured one or more immobilization features and the die so as to encapsulate the die.

公开(公告)号：US20170136603A1

公开(公告)日：2017-05-18

申请号：US15352647

申请日：2016-11-16

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/24 ,  B29C35/08 ,  C09G1/16 ,  B33Y80/00 ,  B24B37/26 ,  C09D4/00 ,  B29C67/00 ,  B33Y10/00

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D3/28 ,  B24D11/001 ,  B24D11/04 ,  B24D2203/00 ,  B29C35/0805 ,  B29C64/112 ,  B29C2035/0827 ,  B29K2033/04 ,  B29K2995/0077 ,  B29K2995/0092 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D4/00 ,  C09G1/16

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20170100817A1

公开(公告)日：2017-04-13

申请号：US15296015

申请日：2016-10-17

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/22 ,  B24B37/24 ,  B24B37/26

CPC classification number: B24B37/24 ,  B24B37/22 ,  B24B37/26 ,  B24D3/28 ,  B24D11/001 ,  B24D11/04 ,  B24D2203/00 ,  B29C35/0805 ,  B29C64/112 ,  B29C2035/0827 ,  B29K2033/04 ,  B29K2995/0077 ,  B29K2995/0092 ,  B33Y10/00 ,  B33Y70/00 ,  B33Y80/00 ,  C09D4/00 ,  C09G1/16

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.