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公开(公告)号：US20240136485A1
公开(公告)日：2024-04-25
申请号：US18490847
申请日：2023-10-19
Applicant: Applied Materials, Inc.
Inventor： Zhiyong LI , Sivapackia GANAPATHIAPPAN , Mingwei ZHU , Nag B. PATIBANDLA , Hou T. NG , Lisong XU , Ding KAI , Kulandaivelu SIVANANDAN
CPC classification number: H01L33/60 , H01L25/167 , H01L2933/0058
Abstract: Embodiments of the present disclosure generally relate to LED pixels and methods of fabricating LED pixels. A device includes a backplane, at least three LEDs disposed on the backplane, subpixel isolation (SI) structures disposed defining wells of at least three subpixels, a reflection material is disposed on sidewalls and a top surface of the SI structures, at least three of the subpixels have a color conversion material disposed in the wells, an encapsulation layer disposed over the subpixel isolation structures and the subpixels, a light filter layer disposed over the encapsulation layer and micro-lenses disposed over the light filter layer and over each of the wells of the subpixels.
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公开(公告)号：US20220362904A1
公开(公告)日：2022-11-17
申请号：US17321694
申请日：2021-05-17
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Uma SRIDHAR , Yingdong LUO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Sebastian David ROZO , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA , Hou T. NG , Sudhakar MADHUSOODHANAN
IPC: B24B37/24
Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore-features formed therein. The pre-polymer composition includes a multifunctional acrylate component. A curing rate of the dispensed droplets of the pre-polymer composition including the multifunctional acrylate component when exposed to a first dose of electromagnetic radiation is greater than a curing rate of the pre-polymer composition without the multifunctional acrylate component when exposed to the same first dose of electromagnetic radiation.
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公开(公告)号：US20160107295A1
公开(公告)日：2016-04-21
申请号：US14885950
申请日：2015-10-16
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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4.发明申请公开(公告)号：US20170203408A1
公开(公告)日：2017-07-20
申请号：US15287665
申请日：2016-10-06
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Boyi FU , Ashwin CHOCKALINGAM , Daniel REDFIELD , Rajeev BAJAJ , Mahendra C. ORILALL , Hou T. NG , Jason G. FUNG , Mayu YAMAMURA
IPC: B24B37/24
CPC classification number: B24B37/24
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
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公开(公告)号：US20220111579A1
公开(公告)日：2022-04-14
申请号：US17070854
申请日：2020-10-14
Applicant: Applied Materials, Inc.
Inventor： Daihua ZHANG , Uma SRIDHAR , Hou T. NG , Sivapackia GANAPATHIAPPAN , Nag B. PATIBANDLA
IPC: B29C64/112 , B29C64/264 , B29C64/209 , B29C64/245 , B29C64/232 , B33Y70/00 , A61F2/02
Abstract: A method of forming a three dimensional object includes dispensing droplets of an electromagnetic energy curable liquid onto a surface to form a plurality of layers of the three dimensional object in liquid form, wherein each droplet forms a layer of liquid on the surface which is larger than a minimum feature size of a structure to be formed by curing the curable liquid, and directing electromagnetic energy capable of curing the liquid and having a beam width intersecting the layer of liquid which is at least as small as the smallest feature of a structure to be formed in the curable liquid.
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Patent Agency Ranking
公开(公告)号：US20170259499A1
公开(公告)日：2017-09-14
申请号：US15452053
申请日：2017-03-07
Applicant: Applied Materials, Inc.
Inventor： Hou T. NG , Nag B. PATIBANDLA , Rajeev BAJAJ , Daniel REDFIELD , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Mario CORNEJO
CPC classification number: B33Y10/00 , B24B37/22 , B29K2105/0058 , B33Y30/00 , B33Y80/00 , G03F7/0035 , G03F7/2014
Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.
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公开(公告)号：US20240234655A9
公开(公告)日：2024-07-11
申请号：US18490847
申请日：2023-10-20
Applicant: Applied Materials, Inc.
Inventor： Zhiyong LI , Sivapackia GANAPATHIAPPAN , Mingwei ZHU , Nag B. PATIBANDLA , Hou T. NG , Lisong XU , Ding KAI , Kulandaivelu SIVANANDAN
CPC classification number: H01L33/60 , H01L25/167 , H01L2933/0058
Abstract: Embodiments of the present disclosure generally relate to LED pixels and methods of fabricating LED pixels. A device includes a backplane, at least three LEDs disposed on the backplane, subpixel isolation (SI) structures disposed defining wells of at least three subpixels, a reflection material is disposed on sidewalls and a top surface of the SI structures, at least three of the subpixels have a color conversion material disposed in the wells, an encapsulation layer disposed over the subpixel isolation structures and the subpixels, a light filter layer disposed over the encapsulation layer and micro-lenses disposed over the light filter layer and over each of the wells of the subpixels.
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8.发明公开公开(公告)号：US20240145624A1
公开(公告)日：2024-05-02
申请号：US18493426
申请日：2023-10-24
Applicant: Applied Materials, Inc.
Inventor： Peiwen LIU , Hyunsung BANG , Jianfeng SUN , Lisong XU , Zhiyong LI , Sivapackia GANAPATHIAPPAN , Mingwei ZHU , Hou T. NG , Nag. B. PATIBANDLA
CPC classification number: H01L33/06 , H01L33/502 , H01L33/52 , H01L33/58 , H01L2933/0041
Abstract: A pixel herein includes a color panel, a light emitting diode (LED) panel, and an adhesive layer disposed between the color panel and the LED panel. The color panel includes a transparent layer, a plurality of sub-pixel isolation structures, and a plurality of black matrix structures disposed between the plurality of sub-pixel isolation structures and the transparent layer. The sub-pixel isolation structures define a plurality color conversion wells of plurality of sub-pixels. A color conversion material is disposed in the color conversion well. The plurality of black matrix structures define a plurality of color resist wells of the plurality of sub-pixels. A color resist is disposed in the color resist wells. The LED panel includes a plurality of micro-LEDs disposed on a backplane. The plurality of micro-LEDs correspond to a sub-pixel.
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9.发明公开公开(公告)号：US20240123568A1
公开(公告)日：2024-04-18
申请号：US18212285
申请日：2023-06-21
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Boyi FU , Ashwin CHOCKALINGAM , Daniel REDFIELD , Rajeev BAJAJ , Mahendra C. ORILALL , Hou T. NG , Jason G. FUNG , Mayu YAMAMURA
IPC: B24B37/24 , B24B37/22 , B24B37/26 , B24D3/28 , B24D11/00 , B24D11/04 , B29C35/08 , B29C64/112 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C09D4/00 , C09G1/16
CPC classification number: B24B37/24 , B24B37/22 , B24B37/26 , B24D3/28 , B24D11/001 , B24D11/04 , B29C35/0805 , B29C64/112 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C09D4/00 , C09G1/16 , B33Y70/10
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and methods of manufacturing the same. According to one or more embodiments, a method for forming or otherwise preparing a polishing article by sequentially forming a plurality of polymer layers is provided and includes: (a) dispensing a plurality of droplets of a polymer precursor composition onto a surface of a previously formed at least partially cured polymer layer, where the polymer precursor composition contains a first precursor component containing an epoxide group and a photoinitiator component which generates a photoacid when exposed to UV light, (b) at least partially curing the plurality of droplets to form an at least partially cured polymer layer, and (c) repeating (a) and (b).
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10.发明申请公开(公告)号：US20190202024A1
公开(公告)日：2019-07-04
申请号：US16298802
申请日：2019-03-11
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Boyi FU , Ashwin CHOCKALINGAM , Daniel REDFIELD , Rajeev BAJAJ , Mahendra C. ORILALL , Hou T. NG , Jason G. FUNG , Mayu YAMAMURA
IPC: B24B37/24
CPC classification number: B24B37/24
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
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