-
公开(公告)号：US20200070302A1
公开(公告)日：2020-03-05
申请号：US16529884
申请日：2019-08-02
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Ankit VORA , Boyi FU , Venkat HARIHARAN , Mayu YAMAMURA , Mario CORNEJO , Igor ABRAMSON , Mo YANG , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA
IPC: B24B37/24 , C08F283/00 , B33Y10/00 , B33Y70/00 , B29C64/112
Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.
-
公开(公告)号：US20160114458A1
公开(公告)日：2016-04-28
申请号：US14920801
申请日：2015-10-22
Applicant: APPLIED MATERIALS, INC.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava REDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
CPC classification number: B24B37/26 , B24B37/22 , B24B37/24 , B24D3/28 , B24D11/00 , B24D11/001 , B24D11/04 , B33Y10/00 , B33Y80/00
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
Abstract translation: 本公开的实施例涉及具有可调节的化学，材料和结构特性的高级抛光垫及其制造方法。 根据本公开的一个或多个实施例，已经发现可以通过诸如三维（3D）印刷工艺的添加剂制造工艺来生产具有改进性能的抛光垫。 因此，本公开的实施例可以提供具有离散特征和几何形状的先进抛光垫，其由至少两种不同的材料形成，包括功能性聚合物，功能低聚物，反应性稀释剂和固化剂。 例如，先进的抛光垫可以由多个聚合物层形成，通过至少一种树脂前体组合物的自动顺序沉积，然后至少一个固化步骤，其中各层可代表至少一种聚合物组合物和/ 或不同组成的区域。
-
公开(公告)号：US20160107287A1
公开(公告)日：2016-04-21
申请号：US14887240
申请日：2015-10-19
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
-
Patent Agency Ranking
公开(公告)号：US20170259499A1
公开(公告)日：2017-09-14
申请号：US15452053
申请日：2017-03-07
Applicant: Applied Materials, Inc.
Inventor： Hou T. NG , Nag B. PATIBANDLA , Rajeev BAJAJ , Daniel REDFIELD , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Mario CORNEJO
CPC classification number: B33Y10/00 , B24B37/22 , B29K2105/0058 , B33Y30/00 , B33Y80/00 , G03F7/0035 , G03F7/2014
Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.
-
公开(公告)号：US20140273752A1
公开(公告)日：2014-09-18
申请号：US14200149
申请日：2014-03-07
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Rixin PENG , Mario CORNEJO , Thomas BREZOCZKY , Fred REDEKER , Thomas H. OSTERHELD
IPC: B24B53/017 , B24B37/04
CPC classification number: B24B49/18 , B24B37/042 , B24B53/017
Abstract: A method and apparatus for conditioning a polishing pad used in a substrate polishing process. In one embodiment, a method for conditioning a polishing pad utilized to polish a substrate is provided. The method includes providing relative motion between an optical device and a polishing pad having a polishing medium disposed thereon, and scanning a processing surface of the polishing pad with a laser beam to condition the processing surface, wherein the laser beam has a wavelength that is substantially transparent to the polishing medium, but is reactive with the material of the polishing pad.
Abstract translation: 一种用于调整用于衬底抛光工艺中的抛光垫的方法和装置。 在一个实施例中，提供了一种用于调节用于抛光衬底的抛光垫的方法。 该方法包括提供光学装置与其上布置有抛光介质的抛光垫之间的相对运动，以及用激光束扫描抛光垫的处理表面以调节处理表面，其中激光束具有基本上 对抛光介质透明，但与抛光垫的材料反应。
-
公开(公告)号：US20230294239A1
公开(公告)日：2023-09-21
申请号：US18202013
申请日：2023-05-25
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Ankit VORA , Boyi FU , Venkat HARIHARAN , Mayu YAMAMURA , Mario CORNEJO , Igor ABRAMSON , Mo YANG , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA
IPC: B24B37/24 , C08F283/00 , B33Y10/00 , B29C64/112 , B33Y70/10
CPC classification number: B24B37/24 , C08F283/008 , B33Y10/00 , B29C64/112 , B33Y70/10 , B29L2031/736
Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.
-
公开(公告)号：US20170133252A1
公开(公告)日：2017-05-11
申请号：US14935134
申请日：2015-11-06
Applicant: Applied Materials, Inc.
Inventor： Jason G. FUNG , Rajeev BAJAJ , Daniel REDFIELD , Aniruddh KHANNA , Mario CORNEJO , Gregory E. MENK , John WATKINS
IPC: H01L21/67 , H01L21/66 , B24B37/26 , B29C67/00 , B24B49/14 , B24B49/16 , B24B49/10 , H01L21/306 , B24B49/00
CPC classification number: H01L21/67253 , B24B37/26 , B24B49/003 , B24B49/10 , B24B49/14 , B24B49/16 , B29C64/106 , B29K2995/0003 , B29K2995/0005 , B29L2031/736 , B33Y10/00 , B33Y80/00 , H01L21/30625 , H01L21/67075 , H01L21/67294 , H01L22/12 , H01L22/20 , H01L22/26
Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.
-
公开(公告)号：US20160107295A1
公开(公告)日：2016-04-21
申请号：US14885950
申请日：2015-10-16
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
-
-
-
-
-
-
-
Search Results
8
records
(took 0.019 seconds)
