Abstract:
A method for controlling the synthesis of a block copolymer containing at least two blocks, with at least one nonpolar block and at least one polar block, said method making it possible in particular to control the ratio between the blocks and the molecular weight of each of the blocks, said copolymer being a block copolymer intended to be used as a mask in a method of nanolithography by direct self-assembly (DSA), said control being achieved by semicontinuous anionic polymerization in an aprotic nonpolar medium and comprising the following steps: synthesizing a first nonpolar block in the form of a macro-initiator, preparing a solution of said macro-initiator previously synthesized by mixing it with an alkali metal alcoholate in an aprotic nonpolar solvent, preparing a solution of a polar monomer in an aprotic nonpolar solvent, injecting the two solutions previously prepared of macro-initiator and of polar monomer into a micro-mixer, connected to a polymerization reactor, at a constant flow ratio, recovering the copolymer obtained.
Abstract:
The invention concerns a manufacturing method for nanolithography masks from a PS-b-PMMA block copolymer film deposited on a surface to be etched, said copolymer film comprising PMMA nanodomains orientated perpendicularly to the surface to be etched, said method being characterized in that it comprises the following steps: partially irradiating said copolymer film to form a first irradiated area and a second non-irradiated area in said copolymer film, then treating said copolymer film in a developer solvent to selectively remove at least said PMMA nanodomains of said first irradiated area of said copolymer film.
Abstract:
Provided is a process for reducing the structuring time of an ordered film of a diblock copolymer on a surface. The process includes curing, on a surface, a composition including a diblock copolymer at a structuring temperature between the Tg of the diblock copolymer and the decomposition temperature of the diblock copolymer to form an ordered film of the diblock copolymer on the substrate. The composition has a product χeffective*N of between 10.5 and 40 at the structuring temperature, where χeffective is the Flory-Huggins parameter of the diblock copolymer and N is the total degree of polymerization of the blocks of the diblock copolymer.
Abstract:
Provided is a process for reducing the number of defects of an ordered film of a diblock copolymer on a surface. The process includes curing, on a surface, a composition including a diblock copolymer at a structuring temperature between the Tg of the diblock copolymer and the decomposition temperature of the diblock copolymer to form an ordered film of the diblock copolymer on the substrate. The composition has a product Xeffective*N of between 10.5 and 40 at the structuring temperature, where Xeffective is the Flory-Huggins parameter of the diblock copolymer and N is the total degree of polymerization of the blocks of the diblock copolymer.
Abstract:
Provided is a process for improving the critical dimension uniformity of an ordered film of a diblock copolymer on a surface. The process includes curing, on a surface, a composition including a diblock copolymer at a structuring temperature between the Tg of the diblock copolymer and the decomposition temperature of the diblock copolymer to form an ordered film of the diblock copolymer on the substrate. The composition has a product Xeffective*N of between 10.5 and 40 at the structuring temperature, where Xeffective is the Flory-Huggins parameter of the diblock copolymer and N is the total degree of polymerization of the blocks of the diblock copolymer.
Abstract:
Provided is a process for forming an ordered film of a block copolymer on a surface. The process includes curing, on a surface, a composition comprising at least one block copolymer at a structuring temperature between the highest Tg of the at least one block copolymer and the decomposition temperature of the at least one block copolymer to form an ordered film comprising the at least one block copolymer on the substrate. The composition has a product χ effective*N of between 10.5 and 40 at the structuring temperature, where χ effective is the Flory-Huggins parameter of the block copolymer and N is the total degree of polymerization of the blocks of the block copolymer. The ordered film has a thickness greater than 20 nm and a period greater than 10 nm.
Abstract:
The present invention relates to a process for obtaining high-period (typically >10 nm), thick (typically >20 nm) ordered films on a nanometric scale comprising a block copolymer (BCP). The invention also relates to the compositions used to obtain these thick ordered films and to the resulting ordered films that can be used in particular as masks in the lithography field.
Abstract:
The invention relates to a process for controlling the surface energy of a substrate in order to make it possible to obtain a specific orientation of the nanodomains of a film of block copolymer subsequently deposited on the said surface, the said process being characterized in that it comprises the following stages: preparing a blend of copolymers, each copolymer comprising at least one functional group which allows it to be grafted to or crosslinked on the surface of the said substrate, depositing the said blend thus prepared on the surface of the said substrate, carrying out a treatment which results in the grafting to the surface of the substrate or the crosslinking on the surface of the substrate of each of the copolymers of the blend.
Abstract:
The invention relates to a process that enables the creation of nanometric structures by self-assembly of block copolymers, at least one of the blocks of which results from the polymerization of monomers comprising at least one cyclic entity corresponding to the formula I. where X═Si(R1,R2); Ge(R1,R2) Z═Si(R3,R4); Ge(R3,R4); O; S; C(R3,R4) Y═O; S; C(R5,R6) T=O; S; C(R7,R8) R1, R2, R3, R4, R5, R6, R7, R8 are selected from hydrogen, linear, branched or cyclic alkyl groups, with or without heteroatoms, and aromatic groups with or without heteroatoms.
Abstract:
The present invention relates to a process for producing nanostructured films obtained from block copolymers exhibiting a dispersity index of between 1.1 and 2, limits included, without nanostructuring defects, on a surface, in order for this treated surface to be able to be used as masks for applications in microelectronics.