-
公开(公告)号:US20240249970A1
公开(公告)日:2024-07-25
申请号:US18627178
申请日:2024-04-04
Applicant: ASM IP Holding B.V.
Inventor: Uday Kiran Rokkam , Sam Kim , Saket Rathi , Dakai Bian
IPC: H01L21/687
CPC classification number: H01L21/68735 , H01L21/6875 , H01L21/68785
Abstract: A susceptor can include a generally circular shape and may include an inner and outer susceptor. The outer susceptor can include a support region having one or more support mechanisms as well as a channel region extending from the region boundary to an outer radial boundary radially inward of an outer edge of the susceptor, the channel region can include a plurality of channels extending radially from the region boundary to the outer radial boundary.
The inner susceptor can include a second plurality of channels extending from the inner radial boundary to an edge of the inner susceptor.-
公开(公告)号:US11842908B2
公开(公告)日:2023-12-12
申请号:US17152241
申请日:2021-01-19
Applicant: ASM IP HOLDING B.V.
Inventor: Shiva K. T. Rajavelu Muralidhar , Sam Kim
CPC classification number: H01L21/67115 , F27B17/0025 , H01K1/14 , H01K7/00 , H01L21/324 , H05B3/0047 , F27D5/0037
Abstract: An arrangement of linear heat lamps is provided which allows for localized control of temperature nonuniformities in a substrate during semiconductor processing. A reactor includes a substrate holder positioned between a top array and a bottom array of linear heat lamps. At least one lamp of the arrays includes a filament having a varying density and power output along the length of the lamp. In particular, at least one lamp of the arrays includes a filament having a higher filament winding density within a central portion of the lamp relative to peripheral portions of the lamp. In some embodiments, the at least one lamp is a central lamp extending across a central portion of the substrate heated by the lamp. Furthermore, at least one lamp of the arrays has a higher power output within a central portion of the lamp than at peripheral portions of the lamp.
-
公开(公告)号:US11837494B2
公开(公告)日:2023-12-05
申请号:US17961882
申请日:2022-10-07
Applicant: ASM IP Holding B.V.
Inventor: KiHyun Kim , Sam Kim , Rutvij Naik
IPC: H01L21/677 , H01L21/687 , B65G47/90
CPC classification number: H01L21/68707 , B65G47/90
Abstract: An adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.
-
公开(公告)号:US20230034114A1
公开(公告)日:2023-02-02
申请号:US17961882
申请日:2022-10-07
Applicant: ASM IP Holding B.V.
Inventor: KiHyun Kim , Sam Kim , Rutvij Naik
IPC: H01L21/687 , B65G47/90
Abstract: An adjustable joint for insertion into a linkage of a substrate handler utilized for substrate processing. The adjustable joint allows for adjusting the pitch and roll of an attached link. Such adjustment may permit aligning a pickup surface of an end effector to a desired plane. Once adjusted, the joint may be fixed to maintain the desired orientation of the attached link. The adjustable joint allows for correcting deflection of a pickup surface of an end effector relative to a desired pickup plane due to, for example, drooping caused by high temperature usage, mechanical tolerances and/or installation errors.
-
公开(公告)号:USD975665S1
公开(公告)日:2023-01-17
申请号:US29704408
申请日:2019-09-04
Applicant: ASM IP Holding B.V.
Designer: Aniket Patil , Sam Kim
-
公开(公告)号:USD965524S1
公开(公告)日:2022-10-04
申请号:US29702410
申请日:2019-08-19
Applicant: ASM IP Holding B.V.
Designer: Aniket Patil , John DiSanto , Sam Kim , Saket Rathi
-
公开(公告)号:USD947913S1
公开(公告)日:2022-04-05
申请号:US29691717
申请日:2019-05-17
Applicant: ASM IP Holding B.V.
Designer: Aniket Patil , Sam Kim
-
公开(公告)号:US11946137B2
公开(公告)日:2024-04-02
申请号:US17549022
申请日:2021-12-13
Applicant: ASM IP Holding B.V.
Inventor: Aniket Nitin Patil , Saket Rathi , Sam Kim , Shiva K. T. Rajavelu Muralidhar
IPC: B23Q3/00 , C23C16/455 , C23C16/458 , C23C16/52
CPC classification number: C23C16/455 , B23Q3/00 , C23C16/4582 , C23C16/52
Abstract: A fixture is provided. The fixture includes a base, a turntable, a first sensor, and a second sensor. The turntable is supported on the base, is rotatable about a rotation axis, and is configured to slidably seat a susceptor assembly for rotation about the rotation axis. The first sensor is fixed relative to the base, is radially offset from the rotation axis, and is configured to determine ex-situ runout of the susceptor assembly. The second sensor is fixed relative to the first sensor, is axially offset from the first sensor, and is configured to determine ex-situ wobble of the susceptor assembly. Fixture arrangements and methods of determining ex-situ runout and ex-situ wobble of susceptor assemblies for semiconductor processing systems are also described.
-
公开(公告)号:US11885023B2
公开(公告)日:2024-01-30
申请号:US16584283
申请日:2019-09-26
Applicant: ASM IP Holding B.V.
Inventor: Shiva K. T. Rajavelu Muralidhar , Sam Kim , Jeffrey Barrett Robinson , James King Wilson, Jr. , Ninad Vijay Sonje
IPC: C23C16/46 , H01L21/67 , H01L21/687 , C23C16/458 , C23C16/44
CPC classification number: C23C16/466 , C23C16/4411 , C23C16/4586 , H01L21/67201 , H01L21/68757
Abstract: A substrate retaining apparatus, a load lock assembly comprising the substrate retaining apparatus, and a system including the substrate retaining apparatus are disclosed. The substrate retaining apparatus can include at least one sidewall and one or more heat shields. One or more of the at least one sidewall can include a cooling fluid conduit to facilitate cooling of substrates retained by the substrate retaining apparatus. Additionally or alternatively, one or more of the at least one sidewall can include a gas conduit to provide gas to a surface of a retained substrate.
-
公开(公告)号:US11828707B2
公开(公告)日:2023-11-28
申请号:US17157507
申请日:2021-01-25
Applicant: ASM IP Holding B.V.
Inventor: Shiva K. T. Rajavelu Muralidhar , Youness Alvandi-Tabrizi , John DiSanto , Sam Kim
IPC: G01N21/59 , G01N21/958 , G01B11/02 , G01N33/207
CPC classification number: G01N21/59 , G01B11/028 , G01N21/958 , G01N33/207 , G01N2201/021
Abstract: Methods and apparatus for measuring light intensity are disclosed. The methods and apparatus can be used to verify an article, such as a reaction chamber. Exemplary apparatus include a first arm, a light source coupled to the first arm, a second arm, and a sensor coupled to the second arm. The sensor can receive light from the light source that is transmitted through at least a portion of the article.
-
-
-
-
-
-
-
-
-