公开(公告)号：US12124179B2

公开(公告)日：2024-10-22

申请号：US17920014

申请日：2021-05-11

Applicant: ASML NETHERLANDS B.V.

Inventor： Wim Tjibbo Tel ,  Hermanus Adrianus Dillen ,  Marc Jurian Kea ,  Roy Werkman ,  Weitian Kou

IPC: G03F9/00

CPC classification number: G03F9/7023 ,  G03F9/7088

Abstract: A method of determining a position of a product feature on a substrate, the method includes: obtaining a plurality of position measurements of one or more product features on a substrate, wherein the measurements are referenced to either a positioning system used in displacing the substrate in between measurements or a plane parallel to the surface of the substrate; and determining a distortion component of the substrate based on the position measurements.

公开(公告)号：US11754931B2

公开(公告)日：2023-09-12

申请号：US17603870

申请日：2020-03-18

Applicant: ASML NETHERLANDS B.V.

Inventor： Roy Werkman ,  David Frans Simon Deckers ,  Simon Philip Spencer Hastings ,  Jeffrey Thomas Ziebarth ,  Samee Ur Rehman ,  Davit Harutyunyan ,  Chenxi Lin ,  Yana Cheng

IPC: G03F1/36 ,  G03F7/00

CPC classification number: G03F7/705 ,  G03F1/36 ,  G03F7/70508 ,  G03F7/70616

Abstract: A method for determining a correction for an apparatus used in a process of patterning substrates, the method including: obtaining a group structure associated with a processing history and/or similarity in fingerprint of to be processed substrates; obtaining metrology data associated with a plurality of groups within the group structure, wherein the metrology data is correlated between the groups; and determining the correction for a group out of the plurality of groups by applying a model to the metrology data, the model including at least a group-specific correction component and a common correction component.

公开(公告)号：US20210389684A1

公开(公告)日：2021-12-16

申请号：US17411107

申请日：2021-08-25

Applicant: ASML NETHERLANDS B.V.

Inventor： Jochem Sebastiaan Wildenberg ,  Marinus Jochemsen ,  Erik Jensen ,  Erik Johannes Maria Wallerbos ,  Cornelis Johannes Rijnierse ,  Bijoy Rajasekharan ,  Roy Werkman ,  Jurgen Johannes Henderikus Maria Schoonus

IPC: G03F7/20

Abstract: A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.

公开(公告)号：US10816904B2

公开(公告)日：2020-10-27

申请号：US16461044

申请日：2018-05-23

Applicant: ASML NETHERLANDS B.V.

Inventor： Davit Harutyunyan ,  Fei Jia ,  Frank Staals ,  Fuming Wang ,  Hugo Thomas Looijestijn ,  Cornelis Johannes Rijnierse ,  Maxim Pisarenco ,  Roy Werkman ,  Thomas Theeuwes ,  Tom Van Hemert ,  Vahid Bastani ,  Jochem Sebastiaan Wildenberg ,  Everhardus Cornelis Mos ,  Erik Johannes Maria Wallerbos

IPC: G03F7/20 ,  G05B13/04 ,  H01L21/66

Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method including: obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.

公开(公告)号：US11669017B2

公开(公告)日：2023-06-06

申请号：US16762982

申请日：2018-11-09

Applicant: ASML NETHERLANDS B.V.

Inventor： Roy Werkman ,  Bijoy Rajasekharan ,  Lydia Marianna Vergaij-Huizer ,  Jochem Sebastiaan Wildenberg ,  Ronald Van Ittersum ,  Pieter Gerardus Jacobus Smorenberg ,  Robertus Wilhelmus Van Der Heijden ,  Xiuhong Wei ,  Hadi Yagubizade

IPC: G03F7/20

CPC classification number: G03F7/70458 ,  G03F7/70616

Abstract: A method for determining a plurality of corrections for control of at least one manufacturing apparatus used in a manufacturing process for providing product structures to a substrate in a plurality of layers, the method including: determining the plurality of corrections including a correction for each layer, based on an actuation potential of the applicable manufacturing apparatus used in the formation of each layer, wherein the determining includes determining corrections for each layer simultaneously in terms of a matching parameter.

公开(公告)号：US20220342319A1

公开(公告)日：2022-10-27

申请号：US17855995

申请日：2022-07-01

Applicant: ASML NETHERLANDS B.V.

Inventor： Davit Harutyunyan ,  Fei Jia ,  Frank Staals ,  Fuming Wang ,  Hugo Thomas Looijestijn ,  Cornelis Johannes Rijnierse ,  Maxim Pisarenco ,  Roy Werkman ,  Thomas Theeuwes ,  Tom Van Hemert ,  Vahid Bastani ,  Jochem Wildenberg ,  Everhardus Cornelis Mos ,  Erik Johannes Maria Wallerbos

IPC: G03F7/20 ,  G05B13/04

Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method includes obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.

公开(公告)号：US11442367B2

公开(公告)日：2022-09-13

申请号：US17411107

申请日：2021-08-25

Applicant: ASML NETHERLANDS B.V.

Inventor： Jochem Sebastiaan Wildenberg ,  Marinus Jochemsen ,  Erik Jensen ,  Erik Johannes Maria Wallerbos ,  Cornelis Johannes Rijnierse ,  Bijoy Rajasekharan ,  Roy Werkman ,  Jurgen Johannes Henderikus Maria Schoonus

IPC: G03F7/20

Abstract: A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.

公开(公告)号：US11300887B2

公开(公告)日：2022-04-12

申请号：US16463057

申请日：2017-11-06

Applicant: ASML NETHERLANDS B.V.

Inventor： Richard Johannes Franciscus Van Haren ,  Victor Emanuel Calado ,  Leon Paul Van Dijk ,  Roy Werkman ,  Everhardus Cornelis Mos ,  Jochem Sebastiaan Wildenberg ,  Marinus Jochemsen ,  Bijoy Rajasekharan ,  Erik Jensen ,  Adam Jan Urbanczyk

IPC: G03F7/20

Abstract: A method to change an etch parameter of a substrate etching process, the method including: making a first measurement of a first metric associated with a structure on a substrate before being etched; making a second measurement of a second metric associated with a structure on a substrate after being etched; and changing the etch parameter based on a difference between the first measurement and the second measurement.

公开(公告)号：US11106141B2

公开(公告)日：2021-08-31

申请号：US16495119

申请日：2018-03-28

Applicant: ASML NETHERLANDS B.V.

Inventor： Jochem Sebastiaan Wildenberg ,  Marinus Jochemsen ,  Erik Jensen ,  Erik Johannes Maria Wallerbos ,  Cornelis Johannes Rijnierse ,  Bijoy Rajasekharan ,  Roy Werkman ,  Jurgen Johannes Henderikus Maria Schoonus

IPC: G03F7/20

Abstract: A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.