公开(公告)号：US09589871B2

公开(公告)日：2017-03-07

申请号：US14685529

申请日：2015-04-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tang-Yuan Chen ,  Chin-Li Kao ,  Kuo-Hua Chen ,  Ming-Hung Chen ,  Dao-Long Chen

IPC: H01L23/49 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49548 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49582 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32245 ,  H01L2224/32502 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/92244 ,  H01L2924/15153 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: The present disclosure relates to a semiconductor package structure and a method for manufacturing the same. The semiconductor package structure includes a leadframe and a semiconductor die. The leadframe includes a main portion and a protrusion portion. The semiconductor die is bonded to a first surface of the main portion. The protrusion portion protrudes from a second surface of the main portion. The position of the protrusion portion corresponds to the position of the semiconductor die.

Abstract translation: 本公开涉及一种半导体封装结构及其制造方法。 半导体封装结构包括引线框和半导体管芯。 引线框架包括主体部分和突出部分。 半导体管芯结合到主要部分的第一表面。 突出部分从主体部分的第二表面突出。 突起部分的位置对应于半导体管芯的位置。

公开(公告)号：US09089268B2

公开(公告)日：2015-07-28

申请号：US13802355

申请日：2013-03-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuo-Hua Chen

IPC: A61B5/0478 ,  A61B5/04 ,  H01L21/768 ,  A61B5/00

CPC classification number: A61B5/04001 ,  A61B5/0478 ,  A61B5/685 ,  A61B5/6868 ,  A61B2562/046 ,  A61B2562/12 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/0231 ,  H01L2224/0235 ,  H01L2224/02372 ,  H01L2224/05569 ,  H01L2224/92 ,  H01L2224/94 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2221/68304 ,  H01L21/304 ,  H01L21/56 ,  H01L2221/68381 ,  H01L21/78 ,  H01L2924/00014

Abstract: The present invention provides a neural sensing device and method for making the same. The neural sensing device includes a base, an integrated circuit portion and a plurality of microprobes. The base has an active surface and a backside surface. The integrated circuit portion is disposed on the active surface of the base. The microprobes protrude from the backside surface of the base. The conductive vias are disposed in the microprobes and electrically connected to the integrated circuit portion.

Abstract translation: 本发明提供了一种神经感测装置及其制造方法。 该神经感测装置包括基座，集成电路部分和多个微探针。 底座具有活动表面和背面。 集成电路部分设置在基座的有源表面上。 微型笔从底座的背面突出。 导电通孔设置在微探针中并电连接到集成电路部分。