公开(公告)号：US11262197B2

公开(公告)日：2022-03-01

申请号：US16683117

申请日：2019-11-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Kuang-Hsiung Chen

IPC: G01C3/08

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

公开(公告)号：US10812017B1

公开(公告)日：2020-10-20

申请号：US16530710

申请日：2019-08-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Ching-Han Huang ,  Hui-Chung Liu ,  Kuo-Hua Lai ,  Cheng-Ling Huang

IPC: H03B5/04 ,  H01L23/13 ,  H01L23/00 ,  H01L23/36 ,  H03B5/30 ,  H01L23/14 ,  B81B7/00 ,  H03B5/36 ,  H03L1/04 ,  H03B1/02

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

公开(公告)号：US10170658B2

公开(公告)日：2019-01-01

申请号：US14941069

申请日：2015-11-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Hsuan Tsai ,  Lu-Ming Lai

IPC: H01L31/173 ,  H01L25/16

Abstract: An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. The light emitter includes an emitting area facing the substrate. The light detector includes a receiving area facing the substrate. The light emitter emits light within a range of wavelengths, and the substrate passes the light emitted by the light emitter. The opaque material is disposed on the substrate, and absorbs or attenuates the light within the range of wavelengths.

公开(公告)号：US10069051B2

公开(公告)日：2018-09-04

申请号：US15403057

申请日：2017-01-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Hsun-Wei Chan ,  Lu-Ming Lai

IPC: H01L33/58 ,  H01L21/56 ,  H01L33/56 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L33/00 ,  H01L25/16

Abstract: A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. The first electronic component is disposed on the first carrier. The second carrier defines an aperture and is disposed on the first carrier. The aperture is positioned over the first electronic component and exposes the first electronic component. The second electronic component is disposed on the second carrier. The encapsulant covers the second electronic component. The lens defines a cavity and is disposed on the aperture of the first carrier.

公开(公告)号：US20180213312A1

公开(公告)日：2018-07-26

申请号：US15879335

申请日：2018-01-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Liang Hsiao ,  Yu-Hsuan Tsai ,  Pu Shan Huang ,  Ching-Han Huang ,  Lu-Ming Lai

IPC: H04R1/04 ,  B81B7/00 ,  B81C1/00 ,  H04R1/02

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00309 ,  H04R1/021 ,  H04R1/2807 ,  H04R31/00 ,  H04R2201/003 ,  H04R2410/03

Abstract: A microelectromechanical systems package structure includes a first substrate, a transducer unit, a semiconductor chip and a second substrate. The first substrate defines a through hole. The transducer unit is electrically connected to the first substrate, and includes a base and a membrane. The membrane is located between the through hole and the base. The semiconductor chip is electrically connected to the first substrate and the transducer unit. The second substrate is attached to the first substrate and defines a cavity. The transducer unit and the chip are disposed in the cavity, and the second substrate is electrically connected to the transducer unit and the semiconductor chip through the first substrate.

公开(公告)号：US12085768B2

公开(公告)日：2024-09-10

申请号：US17465713

申请日：2021-09-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shih-Chieh Tang ,  Lu-Ming Lai ,  Yu-Che Huang ,  Ying-Chung Chen

IPC: G02B6/42

CPC classification number: G02B6/4215 ,  G02B6/4214

Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.

公开(公告)号：US11682684B2

公开(公告)日：2023-06-20

申请号：US17066412

申请日：2020-10-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ling Huang ,  Lu-Ming Lai ,  Ying-Chung Chen

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14685

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.

公开(公告)号：US11276806B2

公开(公告)日：2022-03-15

申请号：US16734046

申请日：2020-01-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen Chiang ,  Kuang-Hsiung Chen ,  Lu-Ming Lai ,  Hsun-Wei Chan ,  Hsin-Ying Ho ,  Shih-Chieh Tang

IPC: H01L33/54 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/58 ,  H01L33/62 ,  H01L31/0232

Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.

公开(公告)号：US11091365B2

公开(公告)日：2021-08-17

申请号：US14500629

申请日：2014-09-29

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Ching-Han Huang ,  Lu-Ming Lai

IPC: B81B7/00

Abstract: The present disclosure provides a package structure and a manufacturing method. The package structure includes a substrate, a cover, a conductive pattern, and a sensing component. The cover is disposed on the substrate. The cover and the substrate define an accommodation space. The conductive pattern includes a conductive line. The conductive line is disposed on an internal surface of the cover exposed by the accommodation space, and is electrically connected to the substrate. The sensing component is disposed on the internal surface of the cover, and is electrically connected to the conductive line.

公开(公告)号：US11088054B2

公开(公告)日：2021-08-10

申请号：US16570841

申请日：2019-09-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng Tseng ,  Lu-Ming Lai ,  Ying-Chung Chen ,  Hui-Chung Liu

IPC: H01L21/48 ,  H01L23/495

Abstract: A lead frame includes a die pad having a pad top surface and a pad bottom surface opposite to the top pad surface, a plurality of leads, each having a top lead surface and a bottom lead surface opposite to the top lead surface and disposed around the die pad, and a first molding compound disposed between the die pad and each of the leads. The first molding compound exposes the top pad surface of the die pad by covering a portion of the periphery of the top pad surface of the die pad. A method for manufacturing the lead frame is also disclosed.