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    Retaining ring with conductive portion
    12.
    发明授权
    Retaining ring with conductive portion 失效
    带导电部分的保持环

    公开(公告)号：US07276743B2

    公开(公告)日：2007-10-02

    申请号：US11127790

    申请日：2005-05-11

    申请人： Antoine P. Manens ,  Suresh Shrauti ,  Alain Duboust ,  Yan Wang ,  Liang-Yuh Chen

    发明人： Antoine P. Manens ,  Suresh Shrauti ,  Alain Duboust ,  Yan Wang ,  Liang-Yuh Chen

    IPC分类号： H01L29/74 ,  H01L31/111

    CPC分类号： B23H5/08 ,  B24B37/32

    摘要： A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.

    摘要翻译： 描述了一种用于电化学机械加工的保持环。 保持环具有形成有导电部分和非导电部分的大致环形体。 非导电部分在抛光期间接触基板。 导电部分在抛光期间被电偏置以减少常规电化学机械处理系统倾向于发生的边缘效应。

    METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE
    15.
    发明申请
    METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE 审中-公开
    用于抛光底物的方法和组合物

    公开(公告)号：US20070295611A1

    公开(公告)日：2007-12-27

    申请号：US11764726

    申请日：2007-06-18

    申请人： FENG LIU ,  Stan Tsai ,  Yongqi Hu ,  Siew Neo ,  Yan Wang ,  Alain Duboust ,  Liang-Yuh Chen

    发明人： FENG LIU ,  Stan Tsai ,  Yongqi Hu ,  Siew Neo ,  Yan Wang ,  Alain Duboust ,  Liang-Yuh Chen

    IPC分类号： B23H9/00 ,  B23H7/00

    CPC分类号： B23H7/08 ,  B23H1/022 ,  B23H1/06

    摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 2 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer. The ECMP polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as copper, with a reduction in planarization type defects and yielding a desirable surface finish.

    摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 一方面，组合物包括酸性电解质体系，一种或多种螯合剂，一种或多种腐蚀抑制剂，一种或多种无机或有机酸盐，一种或多种pH调节剂，以提供约2至约10 ，选自磨料颗粒，一种或多种氧化剂及其组合的研磨增强材料和溶剂。 该组合物可用于导电材料去除工艺中，包括在包括电极的处理设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及 从导电材料层去除导电材料。 本文所述的ECMP抛光组合物和方法提高了材料从衬底表面（例如铜）的有效去除速率，同时平坦化型缺陷减少并产生理想的表面光洁度。

    BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION
    19.
    发明申请
    BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION 审中-公开
    用于铜减少和减少焦距的球接触罩

    公开(公告)号：US20070096315A1

    公开(公告)日：2007-05-03

    申请号：US11555588

    申请日：2006-11-01

    申请人： Antoine Manens ,  Alain Duboust ,  Donald Olgado ,  Yan Wang ,  Jose Salas-Vernis ,  Shou-Sung Chang

    发明人： Antoine Manens ,  Alain Duboust ,  Donald Olgado ,  Yan Wang ,  Jose Salas-Vernis ,  Shou-Sung Chang

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： B24B37/16 ,  B23H5/08 ,  H01L21/32125

    摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball disposed in a passage formed through the housing. The ball is adapted to extend partially from the housing to contact the substrate during processing. The housing comprises a conductive material. In another embodiment, the housing comprises a lower housing and a contact cover wherein the contact cover comprises a conductive material.

    摘要翻译： 本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。 在一个实施例中，用于电化学处理衬底的接触组件包括具有设置在通过壳体形成的通道中的球的壳体。 该球适于在加工过程中从壳体部分延伸以接触基底。 壳体包括导电材料。 在另一个实施例中，壳体包括下壳体和接触盖，其中接触盖包括导电材料。

    LASER MODULES AND PROCESSES FOR THIN FILM SOLAR PANEL LASER SCRIBING
    20.
    发明申请
    LASER MODULES AND PROCESSES FOR THIN FILM SOLAR PANEL LASER SCRIBING 审中-公开
    激光模块和薄膜太阳能电池板激光扫描的工艺

    公开(公告)号：US20110132884A1

    公开(公告)日：2011-06-09

    申请号：US12851442

    申请日：2010-08-05

    申请人： Antoine P. Manens ,  Wei-Sheng Lei ,  Wei-Yung Hsu ,  Bassam Shamoun ,  Yan Wang

    发明人： Antoine P. Manens ,  Wei-Sheng Lei ,  Wei-Yung Hsu ,  Bassam Shamoun ,  Yan Wang

    IPC分类号： B23K26/00

    CPC分类号： H01L31/18 ,  B23K26/0673 ,  B23K26/082 ,  B23K26/364

    摘要： Laser systems for laser scribing are provided. The systems include a remote module coupled to a laser module through a cable. The remote module includes a controller and a chiller. The laser module has at least a laser source and a cooling plate. The laser module is operable to remove material from at least a portion of a workpiece. The systems also include a plurality of termination modules coupled to the laser module through a plurality of optical fibers. Each of the termination modules includes a mechanical interface. The mechanical interface is coupled to a respective optical fiber. The systems further include a plurality of scanning devices operable to control a position of the output from the laser. Each of the scanning devices is coupled to a respective mechanical interface.

    摘要翻译： 提供激光划线的激光系统。 该系统包括通过电缆耦合到激光模块的远程模块。 远程模块包括控制器和冷却器。 激光模块至少具有激光源和冷却板。 激光模块可操作以从工件的至少一部分去除材料。 该系统还包括通过多根光纤耦合到激光模块的多个端接模块。 每个终端模块包括机械接口。 机械接口耦合到相应的光纤。 该系统还包括可操作以控制来自激光器的输出位置的多个扫描装置。 每个扫描装置耦合到相应的机械接口。