Planarized extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor
    11.
    发明授权
    Planarized extreme ultraviolet lithography blank, and manufacturing and lithography systems therefor 有权
    平面化的极紫外光刻印刷机及其制造和光刻系统

    公开(公告)号:US09354508B2

    公开(公告)日:2016-05-31

    申请号:US14139307

    申请日:2013-12-23

    CPC classification number: G03F1/24 G03F7/70958

    Abstract: An integrated extreme ultraviolet (EUV) blank production system includes: a vacuum chamber for placing a substrate in a vacuum; a first deposition system for depositing a planarization layer having a planarized top surface over the substrate; and a second deposition system for depositing a multi-layer stack on the planarization layer without removing the substrate from the vacuum. The EUV blank is in an EUV lithography system includes: an extreme ultraviolet light source; a mirror for directing light from the EUV source; a reticle stage for placing a EUV mask blank with a planarization layer; and a wafer stage for placing a wafer. The EUV blank includes: a substrate; a planarization layer to compensate for imperfections related to the surface of the substrate, the planarization layer having a flat top surface; and a multi-layer stack on the planarization layer.

    Abstract translation: 集成的极紫外(EUV)空白生产系统包括:用于将基板放置在真空中的真空室; 第一沉积系统,用于沉积在衬底上具有平坦化顶表面的平坦化层; 以及用于在平坦化层上沉积多层堆叠而不从真空中移除基板的第二沉积系统。 EUV空白在EUV光刻系统中包括:极紫外光源; 一个用于指示EUV来源的光的镜子; 用于放置具有平坦化层的EUV掩模空白的掩模版台; 以及用于放置晶片的晶片台。 EUV空白包括:底物; 平坦化层,用于补偿与衬底的表面相关的缺陷,平坦化层具有平坦的顶表面; 以及平坦化层上的多层堆叠。

    PLANARIZED EXTREME ULTRAVIOLET LITHOGRAPHY BLANK, AND MANUFACTURING AND LITHOGRAPHY SYSTEMS THEREFOR
    13.
    发明申请
    PLANARIZED EXTREME ULTRAVIOLET LITHOGRAPHY BLANK, AND MANUFACTURING AND LITHOGRAPHY SYSTEMS THEREFOR 有权
    平面极化超紫外光刻胶及其制造及其光刻系统

    公开(公告)号:US20140268080A1

    公开(公告)日:2014-09-18

    申请号:US14139307

    申请日:2013-12-23

    CPC classification number: G03F1/24 G03F7/70958

    Abstract: An integrated extreme ultraviolet (EUV) blank production system includes: a vacuum chamber for placing a substrate in a vacuum; a first deposition system for depositing a planarization layer having a planarized top surface over the substrate; and a second deposition system for depositing a multi-layer stack on the planarization layer without removing the substrate from the vacuum. The EUV blank is in an EUV lithography system includes: an extreme ultraviolet light source; a mirror for directing light from the EUV source; a reticle stage for placing a EUV mask blank with a planarization layer; and a wafer stage for placing a wafer. The EUV blank includes: a substrate; a planarization layer to compensate for imperfections related to the surface of the substrate, the planarization layer having a flat top surface; and a multi-layer stack on the planarization layer.

    Abstract translation: 集成的极紫外(EUV)空白生产系统包括:用于将基板放置在真空中的真空室; 第一沉积系统,用于沉积在衬底上具有平坦化顶表面的平坦化层; 以及用于在平坦化层上沉积多层堆叠而不从真空中移除基板的第二沉积系统。 EUV空白在EUV光刻系统中包括:极紫外光源; 一个用于指示EUV来源的光的镜子; 用于放置具有平坦化层的EUV掩模空白的掩模版台; 以及用于放置晶片的晶片台。 EUV空白包括:底物; 平坦化层,用于补偿与衬底的表面相关的缺陷,平坦化层具有平坦的顶表面; 以及平坦化层上的多层堆叠。

    System and method for manufacturing planarized extreme ultraviolet lithography blank

    公开(公告)号:US10209613B2

    公开(公告)日:2019-02-19

    申请号:US15167740

    申请日:2016-05-27

    Abstract: An integrated extreme ultraviolet (EUV) blank production system includes: a vacuum chamber for placing a substrate in a vacuum; a first deposition system for depositing a planarization layer having a planarized top surface over the substrate; and a second deposition system for depositing a multi-layer stack on the planarization layer without removing the substrate from the vacuum. The EUV blank is in an EUV lithography system includes: an extreme ultraviolet light source; a mirror for directing light from the EUV source; a reticle stage for placing a EUV mask blank with a planarization layer; and a wafer stage for placing a wafer. The EUV blank includes: a substrate; a planarization layer to compensate for imperfections related to the surface of the substrate, the planarization layer having a flat top surface; and a multi-layer stack on the planarization layer.

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