摘要:
Accelerators that can be useful for an energy polymerizable composition comprising a cationically curable material; energy polymerizable compositions comprising at least one cationically curable material and an initiation system therefor, the initiation system comprising at least one organometallic complex salt and at least one accelerator; and a method for curing the compositions. The cured compositions can provide useful articles. The invention also provides compositions of matter comprising an organometallic complex salt and at least one compound selected from the Class 1 through Class 4 compounds disclosed herein.
摘要:
Accelerators that can be useful for an energy polymerizable composition comprising a cationically curable material; energy polymerizable compositions comprising at least one cationically curable material and an initiation system therefor, the initiation system comprising at least one organometallic complex salt and at least one accelerator; and a method for curing the compositions. The cured compositions can provide useful articles. The invention also provides compositions of matter comprising an organometallic complex salt and at least one compound selected from the Class 1 through Class 4 compounds disclosed herein.
摘要:
A curable adhesive composition is disclosed comprising: at least one free radically polymerizable oligomer component; optionally at least one diluent monomer; at least one perfluorinated ether monomer; and a photoinitiator. The curable liquid adhesive is easily removable with low force and low adhesive transfer.
摘要:
A method for building three-dimensional articles using a thermal polymerization process in provided. The articles are built by using a composition that includes a thermally polymerizable composition, a thermal initiator, and a nonlinear light-to-heat conversion material such as a reverse saturable dye. The article is built by the sequential exposure of adjacent voxels with a laser beam. Microlens arrays can be used to expose more than one voxel at a time.
摘要:
Methods of forming nanostructures with chromonic materials are disclosed. A method includes coating a substrate surface with a chromonic solution to form a chromonic layer, removing at least a portion of the water to form a dried chromonic layer, and exposing the dried chromonic layer to an organic solvent to form a pattern of channels within the dried chromonic layer. The chromonic solution includes a chromonic material and water. Materials can be deposited within the channels to form a pattern of nanostructures.
摘要:
A thermomechanical-shock-resistant cured composition for solventless, hydrophobic resin encapsulation of electronic components having a glass transition temperature below 0° C. and containing a non-silicone oligomer including a flexible hydrocarbon backbone with reactive functionality, up to about 40% by weight of an adhesion promoter, and a optional viscosity-modifying component.
摘要:
A stabilized heat curable adhesive prepared from a formulation comprised of (1) at least one free radically polymerizable monomer; (2) at least one epoxy function monomer; (3) at least one free radical polymerization photoinitiator; (4) a thermally-initiated cationic catalyst system comprising (a) at least one salt of an organometallic cation, (b) at least one stabilizing additive; (5) optionally, at least one alcohol-containing material; and (6) optionally, adjuvants.
摘要:
The present invention provides an energy polymerizable composition comprising at least one epoxy monomer or at least one vinyl ether monomer and an initiation system therefor, the initiation system comprising at least one organometallic complex salt and at least one stabilizing additive. The cured composition provides useful articles or coated articles.
摘要:
The present invention is an article useful in the field of wafer processing, for example. The article includes a substrate, a leveling layer, a joining layer, a photothermal conversion layer and a temporary carrier. The substrate has a first major surface, a second major surface and at least one three dimensional topographical feature extending from the first major surface and having an initial step height. The leveling layer is positioned adjacent to the first major surface and reduces a topography of the substrate to between about 5% and about 95% of the initial step height. The joining layer is positioned adjacent to the leveling layer and further reduces the topography of the substrate to less than about 20% of the initial step height. The photothermal conversion layer is positioned adjacent to the joining layer and the temporary carrier is positioned adjacent the photothermal conversion layer.