公开(公告)号：US08592830B2

公开(公告)日：2013-11-26

申请号：US13264188

申请日：2010-04-13

申请人： Youji Urano

发明人： Youji Urano

IPC分类号： H01L29/18 ,  H01L33/00 ,  H01L27/15 ,  H01L21/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21V19/0015 ,  F21V19/045 ,  F21V29/58 ,  F21V29/83 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L33/648 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/117 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10446 ,  H01L2924/00

摘要： The LED unit 100 comprises a plurality of the LED module 1 and the heat radiation plate. Each the LED module 1 comprises the LED chip and the package for incorporating the LED chip therein; the package has the electrical insulation property. Each the package comprises the sub-mount member which is located between the LED chip and the heat radiation plate and which has heat conductivity; these are integrally formed. The LED modules are arranged on the first surface of the heat radiation plate. This configuration makes it possible for the LED unit to efficiently disperse the heat in the LED chip 10 to the heat radiation plate.

摘要翻译： LED单元100包括多个LED模块1和散热板。 每个LED模块1包括LED芯片和用于将LED芯片并入其中的封装; 该封装具有电绝缘性能。 每个包装件包括位于LED芯片和散热板之间并具有导热性的子安装构件; 这些是整体形成的。 LED模块布置在散热板的第一表面上。 该结构使得LED单元有可能将LED芯片10中的热量有效地分散到散热板。

公开(公告)号：US08203157B2

公开(公告)日：2012-06-19

申请号：US12736240

申请日：2009-03-26

申请人： Tomonori Suzuki ,  Kenichiro Tanaka ,  Youji Urano

发明人： Tomonori Suzuki ,  Kenichiro Tanaka ,  Youji Urano

IPC分类号： H01L29/20 ,  H01L33/00 ,  H01L29/201 ,  H01L29/22 ,  H01L29/227 ,  H01L31/00

CPC分类号： H01L33/504 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/0091 ,  H01L2924/00014

摘要： A lighting device including an LED chip having a light emitting surface, and being configured to emit a light from the light emitting surface, a mounting substrate being configured to mount the LED chip, a first color conversion member including a first light transmissive material and a first phosphor, the first phosphor being excited by the light which is emitted from the LED chip, thereby giving off a first light having a wavelength which is longer than a wavelength of the light emitted from the LED chip, the first color conversion member being directly disposed on the light emitting surface of the LED chip, a second color conversion member including a second light transmissive material and a second phosphor, the second phosphor being excited by the light which is emitted from the LED chip, thereby giving off a second light having a wavelength which is longer than the wavelength of the light emitted from the LED chip, the second color conversion member being shaped to have a dome-shape, wherein the LED chip and the first color conversion member are disposed between the mounting substrate and the second color conversion member.

摘要翻译： 一种照明装置，包括具有发光表面的LED芯片，并且被配置为从所述发光表面发射光;安装基板，其被配置为安装所述LED芯片;第一颜色转换构件，包括第一透光材料和 第一荧光体，第一荧光体被从LED芯片发射的光激励，从而发出比从LED芯片发射的光的波长长的波长的第一光，第一颜色转换部件直接 配置在所述LED芯片的发光面上的第二颜色转换构件，包括第二透光性材料和第二荧光体的第二颜色转换构件，所述第二荧光体被从所述LED芯片发射的光激励，从而发出具有 比从LED芯片发射的光的波长长的波长，第二颜色转换部件成形为具有圆顶状 pe，其中所述LED芯片和所述第一颜色转换构件设置在所述安装基板和所述第二颜色转换构件之间。

公开(公告)号：US20110006323A1

公开(公告)日：2011-01-13

申请号：US12736240

申请日：2009-03-26

申请人： Tomonori Suzuki ,  Kenichiro Tanaka ,  Youji Urano

发明人： Tomonori Suzuki ,  Kenichiro Tanaka ,  Youji Urano

IPC分类号： H01L33/48

CPC分类号： H01L33/504 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2933/0091 ,  H01L2924/00014

摘要： A lighting device comprising an LED chip having a light emitting surface, and being configured to emit a light from the light emitting surface, a mounting substrate being configured to mount the LED chip, a first color conversion member comprising a first light transmissive material and a first phosphor, the first phosphor being excited by the light which is emitted from the LED chip, thereby giving off a first light having a wavelength which is longer than a wavelength of the light emitted from the LED chip, the first color conversion member being directly disposed on the light emitting surface of the LED chip, a second color conversion member comprising a second light transmissive material and a second phosphor, the second phosphor being excited by the light which is emitted from the LED chip, thereby giving off a second light having a wavelength which is longer than the wavelength of the light emitted from the LED chip, the second color conversion member being shaped to have a dome-shape, wherein the LED chip and the first color conversion member are disposed between the mounting substrate and the second color conversion member.

摘要翻译： 一种照明装置，包括具有发光表面的LED芯片，并且被配置为从所述发光表面发射光，安装基板被配置为安装所述LED芯片，第一颜色转换部件包括第一透光材料和 第一荧光体，第一荧光体被从LED芯片发射的光激励，从而发出比从LED芯片发射的光的波长长的波长的第一光，第一颜色转换部件直接 配置在所述LED芯片的发光面上的第二颜色转换构件，包括第二透光材料和第二荧光体，所述第二荧光体被从所述LED芯片发射的光激励，从而发出第二光，所述第二光具有 所述波长比从所述LED芯片发射的光的波长长，所述第二颜色转换构件被成形为具有圆顶形状， 形状，其中所述LED芯片和所述第一颜色转换构件设置在所述安装基板和所述第二颜色转换构件之间。

公开(公告)号：US07869675B2

公开(公告)日：2011-01-11

申请号：US12733400

申请日：2008-08-28

申请人： Youji Urano

发明人： Youji Urano

IPC分类号： G02B6/26

CPC分类号： H01L33/507 ,  F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/505 ,  H01L33/52 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/141 ,  H05K1/184 ,  H05K3/0061 ,  H05K2201/0311 ,  H05K2201/048 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10962 ,  Y10S385/901 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting device, in which an encapsulation resin is disposed at a space confined between an optical member and a mounting substrate. This encapsulation resin is possibly made free from a void-generation therein. In this light emitting device, the optical member can be precisely positioned. An electrode disposed outside a color conversion member is possibly free from an improper solder connection. A ring gate is formed on the top surface of the mounting substrate outside of the optical member, and acts to position the color conversion member. The ring gate acts to prevent an overflowing liquid encapsulation resin from flowing to the electrode provided. The ring gate is provided with a plurality of centering projections which are spaced circumferentially along its inner circumference to position the color conversion member.

摘要翻译： 一种发光器件，其中密封树脂设置在限制在光学构件和安装衬底之间的空间。 这种封装树脂可能没有其中的空隙产生。 在该发光装置中，可以精确地定位光学构件。 设置在颜色转换构件外侧的电极可能没有不正确的焊接连接。 环形门形成在安装基板的顶面上，在光学构件的外部，并且用于定位颜色转换构件。 环形栅极用于防止溢出的液体封装树脂流到所提供的电极。 环形门设置有多个定心突起，沿着其内圆周沿圆周间隔定位，以定位颜色转换构件。

公开(公告)号：US07800124B2

公开(公告)日：2010-09-21

申请号：US11993956

申请日：2006-06-30

申请人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

发明人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  F21K9/00 ,  F21V21/30 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.

摘要翻译： 本发明的发光装置包括：LED芯片10; 具有其一个表面侧安装有LED芯片10的导电板（传热板）71的芯片安装构件70和通过绝缘体形成在导电板71的一个表面侧上的导体图案73,73 部分72并且电连接到LED芯片10; 以及布置在导电板71的另一个表面侧上的片状连接件80，以将导电板71连接到作为用于保持芯片安装部件70的金属部件的照明器90的主体。连接部件80是 由包含填料的树脂片制成，其粘度通过加热而降低，并且连接构件80具有电绝缘性能，并且将导电板71和照明器的主体90彼此热连接。

公开(公告)号：US20100207135A1

公开(公告)日：2010-08-19

申请号：US12733402

申请日：2008-08-28

申请人： Takanori Aketa ,  Youji Urano ,  Tomonori Suzuki

发明人： Takanori Aketa ,  Youji Urano ,  Tomonori Suzuki

IPC分类号： H01L33/48

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting device free from void-generation at a bonding between an LED chip and a metal layer provided on a dielectric substrate. This light emitting device is also free from short-circuit between the closely arranged LED chips. This light emitting device includes a plurality of the LED chips, one dielectric substrate (sub-mount member) which is made of a dielectric substrate for holding the LED chips. The dielectric substrate is formed with a plurality of supporting platforms which respectively holds the LED chips. Each supporting platform is provided with a metal layer which is soldered to the LED chip. The supporting platforms are configured to leave a groove between the adjacent ones of the supporting platforms. Each supporting platform is provided at its side surface with a solder-leading portion made of a material having a solder-wettablity higher than that of the supporting platform.

摘要翻译： 在LED芯片和设置在电介质基板上的金属层之间的接合处不发生空隙的发光器件。 该发光器件在紧密排列的LED芯片之间也没有短路。 该发光装置包括多个LED芯片，由用于保持LED芯片的电介质基板制成的一个电介质基板（副安装构件）。 电介质基板形成有分别保持LED芯片的多个支撑平台。 每个支撑平台设有焊接到LED芯片的金属层。 支撑平台被配置为在相邻的支撑平台之间留下凹槽。 每个支撑平台在其侧表面上设置有由焊料可润湿性高于支撑平台的材料制成的焊料引导部分。

公开(公告)号：US20120037939A1

公开(公告)日：2012-02-16

申请号：US13264004

申请日：2010-04-12

申请人： Youji Urano

发明人： Youji Urano

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/58 ,  H01L33/647 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/84385 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode comprises a LED chip, a package in which the LED chip is housed, and a connection electrode electrically connected to an element electrode with which the LED chip is provided. The package is a laminated body comprising at least a submount substrate and a frame body, and the LED chip is fixedly-mounted on one surface of the submount substrate, and the frame body is laminated on the one surface of the submount substrate and is provided with a through-hole in which the LED chip is stored. The connection electrode is formed on at least either the one surface of the submount substrate or one surface of the frame body facing toward a light irradiation direction, while being exposed in the light irradiation direction. Therefore, the light emitting diode can improve both heat dissipation performance and density of LED placement together.

摘要翻译： 发光二极管包括LED芯片，其中容纳LED芯片的封装以及电连接到设置有LED芯片的元件电极的连接电极。 所述封装是至少包括基座基板和框体的层叠体，所述LED芯片被固定地安装在所述副安装座基板的一个表面上，并且所述框架体层叠在所述副安装座基板的一个表面上， 具有存储LED芯片的通孔。 连接电极形成在副安装座基板的一个表面或框体的面向光照射方向的一个表面上，同时沿光照射方向曝光。 因此，发光二极管可以将LED放置的散热性能和密度提高一起。

公开(公告)号：US08044424B2

公开(公告)日：2011-10-25

申请号：US12856775

申请日：2010-08-16

申请人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

发明人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  F21K9/00 ,  F21V21/30 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.

摘要翻译： 本发明的发光装置包括：LED芯片10; 具有其一个表面侧安装有LED芯片10的导电板（传热板）71的芯片安装构件70和通过绝缘体形成在导电板71的一个表面侧上的导体图案73,73 部分72并且电连接到LED芯片10; 以及布置在导电板71的另一个表面侧上的片状连接件80，以将导电板71连接到作为用于保持芯片安装部件70的金属部件的照明器90的主体。连接部件80是 由包含填料的树脂片制成，其粘度通过加热而降低，并且连接构件80具有电绝缘性能，并且将导电板71和照明器的主体90彼此热连接。

公开(公告)号：US07960751B2

公开(公告)日：2011-06-14

申请号：US12856775

申请日：2010-08-16

申请人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

发明人： Youji Urano ,  Takuya Nakatani ,  Yasuhiro Hidaka

IPC分类号： H01L33/00

摘要： A light-emitting device of the present invention includes: a LED chip 10; a chip mounting member 70 having a conductive plate (heat transfer plate) 71 one surface side of which the LED chip 10 is mounted on and a conductor patterns 73, 73 which is formed on the one surface side of the conductive plate 71 through an insulating part 72 and electrically connected to the LED chip 10; and a sheet-shaped connecting member 80 disposed on the other surface side of the conductive plate 71 to connect the conductive plate 71 to a body of the luminaire 90 which is a metal member for holding the chip mounting member 70. The connecting member 80 is made of a resin sheet which includes a filler and whose viscosity is reduced by heating, and the connecting member 80 has an electrical insulating property and thermally connects the conductive plate 71 and the body 90 of the luminaire to each other.

公开(公告)号：US07948001B2

公开(公告)日：2011-05-24

申请号：US12066433

申请日：2006-09-20

申请人： Kazuo Kamada ,  Yasushi Nishioka ,  Youji Urano

发明人： Kazuo Kamada ,  Yasushi Nishioka ,  Youji Urano

IPC分类号： H01L23/28 ,  H01L23/373

CPC分类号： F21K9/00 ,  F21V21/30 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/58 ,  H01L33/641 ,  H01L2224/73265 ,  H01L2924/19107

摘要： A light-emitting device held on a fixture body includes an LED chip, a heat transfer plate made of a thermally conductive material on which the LED chip is mounted, a wiring board having, on one side, patterned conductors, for supplying an electric power to the LED chip and formed with an aperture (exposure part) through which a LED chip mount surface of the heat transfer plate is exposed, an encapsulation part in which the LED chip is encapsulated on the one side of the wiring board, and a dome-shaped color-changing member made of a fluorescent material and an optically transparent material and placed on the one side of the wiring board. The light-emitting device is bonded to the fixture body with an insulating layer interposed therebetween, and the insulating layer has electrical insulating properties and is interposed between the heat transfer plate and the fixture body to thermally couple the same.

摘要翻译： 保持在固定体上的发光装置包括LED芯片，由其上安装有LED芯片的导热材料制成的传热板，布线板，一侧具有图案导体，用于提供电力 在LED芯片上形成有露出传热板的LED芯片安装面的开口部（曝光部），将LED芯片封装在布线基板一侧的封装部和圆顶部 由荧光材料和光学透明材料制成并设置在布线板的一侧上的彩色变色构件。 发光装置以夹着绝缘层的方式与固定体接合，绝缘层具有电绝缘性，插入在传热板与固定体之间，使其热耦合。