Abstract:
THIS APPLICATION DISCLOSES A METHOD FOR SELECTIVELY ETCHING A THIN OXIDE OR NITRIDE LAYER ON A SEMICONDUCTIVE BODY. IN PARTICULAR, AN OXIDE OR NITRIDE LAYER IS SELECTIVELY ETCHED BY DEPOSITING A THIN LAYER OF AN ACTIVE METAL UPON IT, INDUCING A CHEMICAL REDUCTION REACTION BETWEEN THE
ACTIVE METAL AND THE OXIDE OR NITRIDE IN SELECTED AREAS, AND SELECTIVELY REMOVING THE MORE READILY DISSOLVED REACTED AREAS.
Abstract:
An insulated gate field-effect transistor is made which utilizes both Schottky barrier connections and ion-implanted zones. The resultant structure incorporates source and drain zones, which are formed by ion implantation and whose spacing is fixed by the gate electrode, and source and drain electrodes which make ohmic connection to the implanted source and drain zones and rectifying connections to unimplanted material.
Abstract:
A method for producing tucked under, passivated PN-junctions in semiconductor devices by ion implantation through a layered mask. Apertures in the upper layers of the mask are formed somewhat larger than the corresponding apertures in a first layer (contiguous with the surface of the semiconductor) so that an annulus of uncovered first layer remains around each exposed portion of semiconductor surface. Then the structure is subjected to a beam of dopant ions of sufficient energy to pass through the exposed annulus of uncovered first layer but of insufficient energy to pass through the area covered by the multiple layers; and a tucked under, passivated junction thereby is formed.
Abstract:
Vanadium oxide exhibits a substantial and relatively abrupt change in conductivity as the temperature of the material is varied through a particular characteristic temperature (about 68* C.). In accordance with our invention, a vanadium oxide resistor is employed as a temperature-sensing element in the control circuit of a heater to stabilize the operating temperature of an electronic circuit at about 68* C. over a wide range of ambient temperatures.
Abstract:
The reverse characteristic of Schottky barrier diodes provides easily fabricated, small area, high impedance elements for micropower circuits. Advantageously, the diodes are fabricated within semiconductive integrated circuit arrays by forming rhodium silicide on relatively high resistivity P-type silicon. Such diodes are particularly useful in the loads of flip-flops used as cells of a semiconductor memory.