THIN-FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF, AND DISPLAY SUBSTRATE

    公开(公告)号:US20240204004A1

    公开(公告)日:2024-06-20

    申请号:US17910133

    申请日:2021-12-27

    CPC classification number: H01L27/124 H01L27/1259 H01L27/1222

    Abstract: Provided are a thin-film transistor and a manufacturing method thereof, and a display substrate, belonging to the technical field of thin-film transistors. The thin-film transistor includes: a base substrate; a gate electrode on the base substrate; an active layer on a side of the gate electrode away from the base substrate, an orthographic projection of the active layer onto the base substrate overlapping with an orthographic projection of the gate electrode onto the base substrate; and a first electrode and a second electrode on a side of the active layer away from the base substrate, the first electrode being one of a source electrode and a drain electrode, and the second electrode being the other of the source electrode and the drain electrode. Specifically the active layer includes a channel region corresponding to a gap between the first electrode and the second electrode, and a width direction of the channel region is perpendicular or substantially perpendicular to an extending direction of the gate electrode. According to the embodiments of the present disclosure, the illumination stability of the thin-film transistor can be improved without reducing the transmittance of the substrate.

    SEMICONDUCTOR MATERIAL, LIGHT-EMITTING DEVICE, DISPLAY PANEL AND DISPLAY DEVICE

    公开(公告)号:US20240128327A1

    公开(公告)日:2024-04-18

    申请号:US18016899

    申请日:2022-02-17

    CPC classification number: H01L29/24 H01L29/7869

    Abstract: The present disclosure has disclosed a semiconductor material, light-emitting device, display panel and display device. The semiconductor material comprises: at least two of an oxide of a first element, an oxide of a second element, an oxide of a third element, an oxide of a fourth element and a compound of fifth element, and comprises at least the oxide of the first element and the compound of the fifth element; the first element comprises at least one of In, Zn, Sn, Cd, Tl and Pb; the second element comprises at least one of Ta, Ga, W, Ba, V, Hf and Nb; the third element comprises at least one of Sn, Zr, Cr and Si; the fourth element comprises at least one of Zn, Al, Sn, Ta, Hf, Zr and Ti; and the compound of the fifth element comprises MxA.

    THIN-FILM TRANSISTOR AND METHOD FOR PREPARING THE SAME, DISPLAY SUBSTRATE AND DISPLAY DEVICE

    公开(公告)号:US20200220020A1

    公开(公告)日:2020-07-09

    申请号:US16608549

    申请日:2019-04-25

    Abstract: The present disclosure relates to a thin-film transistor, a method for preparing the same, and a display substrate. The method for preparing the thin-film transistor includes the steps of forming a source electrode, a drain electrode, and an active layer, in which the step of forming the source electrode, the drain electrode, and the active layer includes: forming a first thin film from a first metal oxide material in an atmosphere of a first oxygen content; and forming a second thin film from a second metal oxide material in an atmosphere of a second oxygen content, in which the first thin film is configured to form the active layer, the second thin film is configured to form a source electrode and a drain electrode, and the second oxygen content is less than the first oxygen content.

    OXIDE SEMICONDUCTOR COMPOSITION, MANUFACTURING METHOD THEREOF, THIN FILM TRANSISTOR AND DISPLAY APPARATUS

    公开(公告)号:US20190233299A1

    公开(公告)日:2019-08-01

    申请号:US16344000

    申请日:2018-09-17

    CPC classification number: C01G15/006 C01P2002/72 C01P2004/61 H01L29/7869

    Abstract: An oxide semiconductor composition for use in thin film transistors includes indium oxide, zinc oxide, and an oxide including a doping element of scandium, such as scandium oxide. A molar percentage of the indium oxide can be larger than approximately 50%. The oxide semiconductor composition can have a formula of In2Sc2ZnO7. Manufacturing of the oxide semiconductor composition can include: mixing indium oxide powder, scandium oxide powder, and zinc oxide powder to thereby obtain an oxide shaped object; and sintering the oxide shaped object to form the oxide semiconductor composition. A thin-film transistor for use in a semiconductor device, such as a display apparatus, can include the oxide semiconductor composition, and can thereby have improved mobility of the oxide semiconductor due to the reduced oxygen vacancy therein.

    NEGATIVE PHOTORESIST AND METHODS OF PREPARING AND USING THE SAME
    19.
    发明申请
    NEGATIVE PHOTORESIST AND METHODS OF PREPARING AND USING THE SAME 有权
    负离子光刻胶及其制备和使用方法

    公开(公告)号:US20150370168A1

    公开(公告)日:2015-12-24

    申请号:US14428143

    申请日:2014-08-15

    Abstract: Disclosed is a negative photoresist comprising 1 to 90 parts of hydroxyl-containing or carboxyl-containing film-forming resin, 1 to 99 parts of silicon-containing vinyl ether monomer, 0.1 to 15 parts by weigh of a crosslinking agent, and an organic solvent capable of dissolving the aforesaid substances. Disclosed is also methods of preparing and using the negative photoresist.

    Abstract translation: 公开了含有含羟基或含羧基的成膜树脂1〜90份,含硅乙烯基醚单体1〜99份,交联剂0.1〜15重量份和有机溶剂 能够溶解上述物质。 还公开了制备和使用负性光致抗蚀剂的方法。

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