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    HEATING DEVICE
    11.
    发明申请
    HEATING DEVICE 有权

    公开(公告)号：US20210167336A1

    公开(公告)日：2021-06-03

    申请号：US15780359

    申请日：2017-11-08

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Bin ZHOU ,  Guangcai YUAN ,  Dongfang WANG ,  Ce ZHAO ,  Jun CHENG ,  Luke DING

    IPC: H01L51/56 ,  H05B1/02 ,  F28F3/12 ,  H05B3/22

    Abstract: The present disclosure provides a heating device for heating an OLED substrate, comprising: a heating plate, a support, and a temperature controller, the temperature controller is connected with the heating plate and the support respectively, and the temperature controller is used to synchronously heat the heating plate and the support, so that the temperature of the heating plate and the support are substantially the same; wherein the heating plate comprises an receiving portion for accommodating the support, the support is configured to be able to protrude from the heating plate and retract into the heating plate.

    DISPLAY SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND DISPLAY PANEL
    14.
    发明公开
    DISPLAY SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND DISPLAY PANEL 审中-公开

    公开(公告)号：US20240049539A1

    公开(公告)日：2024-02-08

    申请号：US18490147

    申请日：2023-10-19

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Jingang FANG ,  Luke DING ,  Bin ZHOU ,  Miao ZHANG

    IPC: H10K59/131 ,  H10K50/84 ,  H10K59/126

    CPC classification number: H10K59/131 ,  H10K50/84 ,  H10K59/126 ,  H10K2102/00

    Abstract: A display substrate, a method for fabricating the same, and a display panel are provided. The display substrate includes: a substrate, and a first conductive layer, at least two insulation layers, and a second conductive layer, the second conductive layer being electrically connected with the first conductive layer through via-holes, and the at least two insulation layers including a first insulation layer in contact with the first conductive layer, wherein the display substrate further includes an assisting alignment structure on the surface of the first insulation layer, and the orthographic projection of the assisting alignment structure surrounds at least part of the edge of the orthographic projection of the first via-hole in the first insulation layer on the substrate, so that the orthographic projection of the first via-hole on the first conductive layer lies within the pattern of the first conductive layer.

    Display Substrate and Preparation Method Therefor, and Display Apparatus
    15.
    发明公开
    Display Substrate and Preparation Method Therefor, and Display Apparatus 审中-公开

    公开(公告)号：US20240032355A1

    公开(公告)日：2024-01-25

    申请号：US17799918

    申请日：2021-11-12

    Applicant: Hefei BOE Joint Technology Co.,Ltd. ,  BOE Technology Group Co., Ltd.

    Inventor： Luke DING ,  Yongqian LI

    IPC: H10K59/131 ,  G09G3/3233 ,  H10K59/124 ,  H10K59/12

    CPC classification number: H10K59/131 ,  G09G3/3233 ,  H10K59/124 ,  H10K59/1201 ,  G09G2300/0819 ,  G09G2300/0842 ,  G09G2310/08

    Abstract: A display substrate and a display device are provided. The display substrate includes a light emitting element disposed on a base substrate, and an encapsulation layer, a connection layer, a light extraction layer, a polarization conversion layer and a polarization layer stacked sequentially at a light exiting side of the light emitting element. The light extraction layer is configured to convert at least a portion of light emitted by the light emitting element incident onto the light extraction layer into circularly polarized light with a set rotational direction to pass through the light extraction layer. The polarization conversion layer is configured to convert the circularly polarized light passing through the light extraction layer into linearly polarized light, with a polarization direction parallel to a direction of a light transmission axis of the polarization layer; the connection layer is configured to bond the light extraction layer to the encapsulation layer.

    FULL-COLOR LIGHT EMITTING DIODE (LED) DISPLAY PANEL, METHOD OF MANUFACTURING FULL-COLOR LED DISPLAY PANEL, DISPLAY DEVICE
    18.
    发明申请
    FULL-COLOR LIGHT EMITTING DIODE (LED) DISPLAY PANEL, METHOD OF MANUFACTURING FULL-COLOR LED DISPLAY PANEL, DISPLAY DEVICE 有权
    全彩色发光二极管（LED）显示面板，制造全彩LED显示面板的方法，显示装置

    公开(公告)号：US20160284673A1

    公开(公告)日：2016-09-29

    申请号：US14403467

    申请日：2014-03-20

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Xiangchun KONG ,  Zhanfeng CAO ,  Qi YAO ,  Luke DING

    IPC: H01L25/075 ,  H01L33/50 ,  H01L33/56 ,  H01L27/15

    CPC classification number: H01L25/0753 ,  H01L27/14621 ,  H01L27/153 ,  H01L27/156 ,  H01L27/3241 ,  H01L33/50 ,  H01L33/502 ,  H01L33/56

    Abstract: A full-color display panel includes a plurality of sub-pixel units. The sub-pixel unit includes an LED unit and a filter layer transmitting light of a specific color. The LED unit includes an LED semiconductor chip emitting light of a specific color. The LED semiconductor chips of the plurality of sub-pixel units are homochromatic LED semiconductor chips emitting light of a same color. In each sub-pixel unit, a position of the filter layer corresponds to a position of the LED semiconductor chip, and the filter layer is located on a side of the LED semiconductor chip that emits light.

    Abstract translation: 全色显示面板包括多个子像素单元。 子像素单元包括LED单元和透射特定颜色的光的滤光层。 LED单元包括发射特定颜色的光的LED半导体芯片。 多个子像素单元的LED半导体芯片是发射相同颜色的光的同色LED半导体芯片。 在每个子像素单元中，滤光层的位置对应于LED半导体芯片的位置，滤光层位于发光的LED半导体芯片的一侧。

    THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF AND ARRAY SUBSTRATE
    19.
    发明申请
    THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF AND ARRAY SUBSTRATE 有权
    薄膜晶体管，其制造方法和阵列基板

    公开(公告)号：US20160027927A1

    公开(公告)日：2016-01-28

    申请号：US14429059

    申请日：2014-07-25

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Zhengliang LI ,  Zhen LIU ,  Luke DING ,  Bin ZHANG ,  Zhanfeng CAO ,  Guanbao HUI

    IPC: H01L29/786 ,  H01L29/45 ,  C22C9/00 ,  H01L29/66 ,  H01L21/443 ,  H01L21/4763 ,  H01L27/12 ,  H01L29/49

    CPC classification number: H01L21/02304 ,  C22C9/00 ,  H01L21/28008 ,  H01L29/4908 ,  H01L29/78603 ,  H01L29/78606 ,  H01L41/0815

    Abstract: A thin film transistor, a manufacturing method thereof and an array substrate are provided. The thin film transistor comprises: a gate electrode (11), a source electrode (15) and a drain electrode (16), and the thin film transistor further comprises a buffer layer (11) which is directly provided at one side or both sides of at least one of the gate electrode (11), the source electrode (15) and the drain electrode (16), wherein, the buffer layer (11) and at least one of the gate electrode (11), the source electrode (15) and the drain electrode (16) directly contacting the buffer layer (11) are conformal. Therefore, the adhesion between an electrode of the thin film transistor and a film layer contacting it is improved and at the same time an atom in the electrode of the thin film transistor is effectively prevented from diffusing to the film layer connected with it, and the reliability of the thin film transistor is improved and the production cost is reduced.

    Abstract translation: 提供薄膜晶体管，其制造方法和阵列基板。 薄膜晶体管包括：栅电极（11），源电极（15）和漏电极（16），薄膜晶体管还包括缓冲层（11），其直接设置在一侧或两侧 的栅电极（11），源电极（15）和漏电极（16）中的至少一个，其中，缓冲层（11）和栅电极（11），源电极 15）和与缓冲层（11）直接接触的漏电极（16）是共形的。 因此，薄膜晶体管的电极和与其接触的膜层之间的粘附性得到改善，并且同时有效地防止了薄膜晶体管的电极中的原子扩散到与其连接的膜层，并且 提高了薄膜晶体管的可靠性，降低了生产成本。

    DISPLAY SUBSTRATE, MAINTENANCE METHOD AND DISPLAY DEVICE
    20.
    发明申请
    DISPLAY SUBSTRATE, MAINTENANCE METHOD AND DISPLAY DEVICE 有权

    公开(公告)号：US20250089365A1

    公开(公告)日：2025-03-13

    申请号：US18557810

    申请日：2022-07-28

    Applicant: HEFEI BOE JOINT TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Can YUAN ,  Luke DING ,  Zhidong YUAN ,  Liu WU ,  Yongqian LI ,  Dacheng ZHANG ,  Cheng XU ,  Dandan ZHOU

    IPC: H01L27/12 ,  G09G3/00 ,  G09G3/3225

    Abstract: A display substrate including a base substrate and a driving module arranged on the base substrate, the driving module includes at least one driving unit, and the driving unit includes N stages of driving circuits; N is a positive integer, n is a positive integer less than or equal to N; the nth stage of driving circuit includes a (2n−1)th stage of output circuit, a 2nth stage of output circuit and a first node control circuit; the first node is electrically connected to the (2n−1)th stage of output circuit and the 2nth stage of output circuit respectively through a first connection line; the driving module also includes a scanning line; there are at least two mutually independent overlapping portions between the orthographic projection of the first connection line on the base substrate and the orthographic projection of the scanning line on the base substrate.

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