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公开(公告)号：US20150089795A1
公开(公告)日：2015-04-02
申请号：US14565428
申请日：2014-12-10
Applicant: CYNTEC CO., LTD.
Inventor： Lan-Chin Hsieh , Roger Hsieh , Yu-Ching Kuo , Chun-Tiao Liu
CPC classification number: H01F41/005 , H01F3/10 , H01F17/04 , H01F17/045 , H01F27/022 , H01F2017/048 , Y10T29/49073
Abstract: A method to form a choke is disclosed, wherein the method comprises: encapsulating a hollow coil by a molding body; forming a first core, wherein the first core comprises a pillar; and disposing at least one first portion of the pillar inside the encapsulated hollow coil. The method avoids the overflow or vertical flow issue during a molding process for encapsulating a coil that has been wound on a core already.
Abstract translation: 公开了一种形成扼流圈的方法，其中所述方法包括：通过模制体封装空心线圈; 形成第一芯，其中所述第一芯包括柱; 并且将所述柱的至少一个第一部分设置在所述封装的中空线圈内。 该方法避免了在已经缠绕在芯上的线圈封装的模制过程中溢出或垂直流动问题。
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公开(公告)号：US09538660B2
公开(公告)日：2017-01-03
申请号：US14594084
申请日：2015-01-10
Applicant: CYNTEC CO., LTD.
Inventor： Da-Jung Chen , Chun-Tiao Liu , Bau-Ru Lu
IPC: H05K5/00 , H05K1/18 , H01L23/64 , H01L25/16 , H01F27/24 , H01F27/29 , H01F27/40 , H01F27/02 , H05K3/34 , H01L23/24 , H01L23/31 , H01L23/552 , H01L23/00
CPC classification number: H05K1/181 , H01F27/022 , H01F27/027 , H01F27/24 , H01F27/29 , H01F27/40 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K3/3421 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
Abstract translation: 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。
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公开(公告)号：US09230728B2
公开(公告)日：2016-01-05
申请号：US14251105
申请日：2014-04-11
Applicant: CYNTEC CO., LTD.
Inventor： Chun-Tiao Liu , Lan-Chin Hsieh , Tsung-Chan Wu , Chi-Hsun Lee , Chih-Siang Chuang
CPC classification number: H01F27/022 , H01F1/14741 , H01F1/14766 , H01F1/14791 , H01F17/045 , H01F27/255 , H01F27/2828 , H01F27/29
Abstract: A magnetic device includes a T-shaped magnetic core, a wire coil and a magnetic body. The T-shaped magnetic core includes a base and a pillar, and is made of an annealed soft magnetic metal material, a core loss PCL (mW/cm3) of the T-shaped magnetic core satisfying: 0.64×f0.95×Bm2.20≦PCL≦7.26×f1.41×Bm1.08, where f (kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency. The magnetic body fully covers the pillar, any part of the base that is located above the bottom surface of the base, and any part of the wire coil that is located directly above the top surface of the base.
Abstract translation: 磁性装置包括T形磁芯，线圈和磁性体。 T型磁芯包括基座和支柱，由退火的软磁金属材料制成，T形磁芯的铁心损耗PCL（mW / cm3）满足：0.64×f0.95×Bm2。 20＆nlE; PCL＆nlE; 7.26×f1.41×Bm1.08，其中f（kHz）表示施加到T形磁芯的磁场的频率，Bm（kGauss）表示磁场的工作磁通密度 在频率。 磁体完全覆盖支柱，位于基座底面上方的基座的任何部分以及位于基座顶表面正上方的线圈的任何部分。
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公开(公告)号：US08723629B1
公开(公告)日：2014-05-13
申请号：US13738674
申请日：2013-01-10
Applicant: Cyntec Co., Ltd.
Inventor： Chun-Tiao Liu , Lan-Chin Hsieh , Tsung-Chan Wu , Chi-Hsun Lee , Chih-Siang Chuang
CPC classification number: H01F27/022 , H01F1/14741 , H01F1/14766 , H01F1/14791 , H01F17/045 , H01F27/255 , H01F27/2828 , H01F27/29
Abstract: A magnetic device includes a T-shaped magnetic core, a wire coil and a magnetic body. The T-shaped magnetic core includes a base and a pillar, and is made of an annealed soft magnetic metal material, a core loss PCL (mW/cm3) of the T-shaped magnetic core satisfying: 0.64×f0.95×Bm2.20≦PCL≦7.26×f1.41×Bm1.08, where f (kHz) represents a frequency of a magnetic field applied to the T-shaped magnetic core, and Bm (kGauss) represents the operating magnetic flux density of the magnetic field at the frequency. The magnetic body fully covers the pillar, any part of the base that is located above the bottom surface of the base, and any part of the wire coil that is located directly above the top surface of the base.
Abstract translation: 磁性装置包括T形磁芯，线圈和磁性体。 T型磁芯包括基座和支柱，由退火的软磁金属材料制成，T形磁芯的铁心损耗PCL（mW / cm3）满足：0.64×f0.95×Bm2。 20＆nlE; PCL＆nlE; 7.26×f1.41×Bm1.08，其中f（kHz）表示施加到T形磁芯的磁场的频率，Bm（kGauss）表示磁场的工作磁通密度 在频率。 磁体完全覆盖支柱，位于基座底面上方的基座的任何部分以及位于基座顶表面正上方的线圈的任何部分。
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公开(公告)号：US11967446B2
公开(公告)日：2024-04-23
申请号：US17140143
申请日：2021-01-04
Applicant: CYNTEC CO., LTD.
Inventor： Chun-Tiao Liu , Lan-Chin Hsieh , Tsung-Chan Wu , Chi-Hsun Lee , Chih-Siang Chuang
CPC classification number: H01F27/022 , H01F1/14741 , H01F1/14766 , H01F1/14791 , H01F17/045 , H01F27/255 , H01F27/2828 , H01F27/29
Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein μC×Hsat≥1800, where μC is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of μC0, where μC0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.
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Patent Agency Ranking
公开(公告)号：US20230014778A1
公开(公告)日：2023-01-19
申请号：US17671561
申请日：2022-02-14
Applicant: CYNTEC CO., LTD.
Inventor： Chun-Tiao Liu , Hsieh-Shen Hsieh , Shao-Wei Chang , JINPING ZHOU
Abstract: A magnetic component structure with thermal conductive filler, including two magnetic cores combining together to form an inner accommodating space and at least one core opening, two plate portions connect each other through an inner leg structure and two outer leg structures, a bobbin sleeving on the inner leg structure, a coil winding on the bobbin, a bobbin housing surrounding the bobbin and the coil winding and form winding opening facing the at least one core opening, gaps are formed between the encasing structure constituted by the bobbin housing and the bobbin sleeving and the magnetic cores, a thermal conductive filler formed between the bobbin and the bobbin housing and encapsulating at least parts of the coil winding, and a cooling surface contacts the magnetic cores and the thermal conductive filler, the thermal conductive filler extends outwardly to contact the cooling surface through the opening and the winding opening.
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公开(公告)号：US20160141087A1
公开(公告)日：2016-05-19
申请号：US14941647
申请日：2015-11-15
Applicant: CYNTEC CO., LTD.
Inventor： Chun-Tiao Liu , Lan-Chin Hsieh , Tsung-Chan Wu , Chi-Hsun Lee , Chih-Siang Chuang
IPC: H01F27/02 , H01F27/28 , H01F1/147 , H01F27/255
CPC classification number: H01F27/022 , H01F1/14741 , H01F1/14766 , H01F1/14791 , H01F17/045 , H01F27/255 , H01F27/2828 , H01F27/29
Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein the volume of the base is V1 and the volume of the pillar is V2; a coil wound on the pillar; and a magnetic body encapsulating the pillar, the coil and a portion of the base, wherein the ratio of V1 to V2 (V1/V2) is configured in a pre-determined range so as to reduce the total core loss of the inductor with the equivalent permeability of the inductor being between 28.511 and 52.949.
Abstract translation: 公开了一种电感器，所述电感器包括：T形磁芯，由包括退火的软磁金属材料的材料制成，并具有与所述基底一体形成的基座和柱体，其中所述基座的体积为V1， 柱体积为V2; 缠绕在支柱上的线圈; 以及封装所述支柱，所述线圈和所述基座的一部分的磁体，其中所述V1与V2（V1 / V2）的比率被配置在预定范围内，以便减少所述电感器的总铁芯损耗 电感的等效磁导率在28.511和52.949之间。
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公开(公告)号：US20160113117A1
公开(公告)日：2016-04-21
申请号：US14883651
申请日：2015-10-15
Applicant: CYNTEC CO., LTD.
Inventor： Chun-Tiao Liu , BAU-RU LU
CPC classification number: H05K1/183 , H01L2224/16225 , H01L2224/16235 , H01L2924/15153 , H01L2924/15313 , H01L2924/181 , H01L2924/19105 , H05K1/0203 , H05K1/181 , H05K1/185 , H05K3/284 , H05K2201/1003 , H05K2203/1316 , Y02P70/611 , H01L2924/00012
Abstract: An electronic module is disclosed. The electronic module includes a substrate, a plurality of electronic components electrically connected to a first side of the substrate, and another plurality of electronic components embedded in the substrate. In some other embodiments, the electronic module further comprises a heat sink disposed on at least one of the plurality of electronic components to dissipate the heat generated by the at least one of the plurality of electronic components. And, in some other embodiment, the electronic module further comprises a molding disposed on the plurality of electronic components and, in further embodiments, the heat sink.
Abstract translation: 公开了一种电子模块。 电子模块包括基板，电连接到基板的第一侧的多个电子部件和嵌入在基板中的另外多个电子部件。 在一些其他实施例中，电子模块还包括设置在多个电子部件中的至少一个上的散热器，以消散由多个电子部件中的至少一个产生的热量。 并且，在一些其它实施例中，电子模块还包括设置在多个电子部件上的模制件，并且在另外的实施例中，该散热器。
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公开(公告)号：US20150116973A1
公开(公告)日：2015-04-30
申请号：US14594083
申请日：2015-01-10
Applicant: CYNTEC CO., LTD.
Inventor： DA-JUNG CHEN , Chun-Tiao Liu , BAU-RU LU
CPC classification number: H05K1/181 , H01F27/022 , H01F27/027 , H01F27/24 , H01F27/29 , H01F27/40 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K3/3421 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
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公开(公告)号：US20150116960A1
公开(公告)日：2015-04-30
申请号：US14594084
申请日：2015-01-10
Applicant: CYNTEC CO., LTD.
Inventor： DA-JUNG CHEN , Chun-Tiao Liu , BAU-RU LU
IPC: H05K1/18
CPC classification number: H05K1/181 , H01F27/022 , H01F27/027 , H01F27/24 , H01F27/29 , H01F27/40 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K3/3421 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
Abstract translation: 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。
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