Precursor compositions for atomic layer deposition and chemical vapor deposition of titanate, lanthanate, and tantalate dielectric films
    11.
    发明授权
    Precursor compositions for atomic layer deposition and chemical vapor deposition of titanate, lanthanate, and tantalate dielectric films 有权
    用于钛酸盐,镧系元素和钽酸盐介电膜的原子层沉积和化学气相沉积的前体组合物

    公开(公告)号:US07638074B2

    公开(公告)日:2009-12-29

    申请号:US12282511

    申请日:2007-03-12

    IPC分类号: C07F3/00 C23C16/00

    摘要: Barium, strontium, tantalum and lanthanum precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of titanate thin films. The precursors have the formula M(Cp)2, wherein M is strontium, barium, tantalum or lanthanum, and Cp is cyclopentadienyl, of the formula (I), wherein each of R1-R5 is the same as or different from one another, with each being independently selected from among hydrogen, C1-C12 alkyl, C1-C12 amino, C6-C10 aryl, C1-C12 alkoxy, C3-C6 alkylsilyl, C2-C12 alkenyl, R1R2R3NNR3, wherein R1, R2 and R3 may be the same as or different from one another and each is independently selected from hydrogen and C1-C6 alkyl, and pendant ligands including functional group(s) providing further coordination to the metal center M. The precursors of the above formula are useful to achieve uniform coating of high dielectric constant materials in the manufacture of flash memory and other microelectronic devices.

    摘要翻译: 用于钛酸盐薄膜的原子层沉积(ALD)和化学气相沉积(CVD)的钡,锶,钽和镧前体组合物。 前体具有式(I)的式M(Cp)2,其中M是锶,钡,钽或镧,Cp是环戊二烯基,其中R 1 -R 5各自彼此相同或不同, 其中每个独立地选自氢,C 1 -C 12烷基,C 1 -C 12氨基,C 6 -C 10芳基,C 1 -C 12烷氧基,C 3 -C 6烷基甲硅烷基,C 2 -C 12烯基,R 1 R 2 R 3 N NR 3,其中R 1,R 2和R 3可以是 彼此相同或不同,并且各自独立地选自氢和C 1 -C 6烷基,以及包括提供与金属中心M进一步配位的官能团的侧链配体。上式的前体可用于实现均匀涂布 的高介电常数材料制造闪存和其他微电子器件。

    Precursor compositions for atomic layer deposition and chemical vapor deposition of titanate, lanthanate, and tantalate dielectric films
    12.
    发明授权
    Precursor compositions for atomic layer deposition and chemical vapor deposition of titanate, lanthanate, and tantalate dielectric films 有权
    用于钛酸盐,镧系元素和钽酸盐介电膜的原子层沉积和化学气相沉积的前体组合物

    公开(公告)号:US08784936B2

    公开(公告)日:2014-07-22

    申请号:US13370072

    申请日:2012-02-09

    IPC分类号: C23C16/00

    摘要: Barium, strontium, tantalum and lanthanum precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of titanate thin films. The precursors have the formula M(Cp)2, wherein M is strontium, barium, tantalum or lanthanum, and Cp is cyclopentadienyl, of the formula wherein each of R1-R5 is the same as or different from one another, with each being independently selected from among hydrogen, C1-C12 alkyl, C1-C12 amino, C6-C10 aryl, C1-C12 alkoxy, C3-C6 alkylsilyl, C2-C12 alkenyl, R1R2R3NNR3, wherein R1, R2 and R3 may be the same as or different from one another and each is independently selected from hydrogen and C1-C6 alkyl, and pendant ligands including functional group(s) providing further coordination to the metal center M. The precursors of the above formula are useful to achieve uniform coating of high dielectric constant materials in the manufacture of flash memory and other microelectronic devices.

    摘要翻译: 用于钛酸盐薄膜的原子层沉积(ALD)和化学气相沉积(CVD)的钡,锶,钽和镧前体组合物。 前体具有式M(Cp)2,其中M是锶,钡,钽或镧,Cp是环戊二烯基,其中R 1 -R 5各自彼此相同或不同,各自独立地 选自氢,C1-C12烷基,C1-C12氨基,C6-C10芳基,C1-C12烷氧基,C3-C6烷基甲硅烷基,C2-C12烯基,R1R2R3NNR3,其中R1,R2和R3可以相同或不同 并且各自独立地选自氢和C 1 -C 6烷基,以及包括提供与金属中心M进一步配位的官能团的侧链配体。上式的前体可用于实现高介电常数的均匀涂布 材料制造闪存等微电子器件。

    METAL AMINOTROPONIMINATES, BIS-OXAZOLINATES AND GUANIDINATES
    13.
    发明申请
    METAL AMINOTROPONIMINATES, BIS-OXAZOLINATES AND GUANIDINATES 审中-公开
    金属氨基丙酸盐,双氧氮杂环丁烷和胍基

    公开(公告)号:US20110060165A1

    公开(公告)日:2011-03-10

    申请号:US12517901

    申请日:2006-12-29

    IPC分类号: C07C249/00 C09D7/12 C23C16/00

    摘要: Metal aminotroponiminates, metal bis-oxazolinates and metal guanidinates are described, as well as ligand precursors of such compounds, and mixed ligand barium and strontium complexes suitable for chemical vapor deposition, atomic layer deposition, and rapid vapor deposition processes. Such metal compounds are useful in the formation of thin metal films on substrates, e.g., in chemical vapor deposition, atomic layer deposition or rapid vapor deposition processes. The substrates formed have thin film monolayers of the metals provided by the precursors.

    摘要翻译: 本发明描述了金属氨基阿魏酸盐,金属双恶唑酸盐和金属胍盐,以及这些化合物的配体前体,以及适用于化学气相沉积,原子层沉积和快速气相沉积工艺的混合配体钡和锶络合物。 这种金属化合物可用于在基底上形成薄金属膜,例如在化学气相沉积,原子层沉积或快速气相沉积工艺中。 形成的基材具有由前体提供的金属的薄膜单层。

    Precursors for CVD/ALD of metal-containing films
    15.
    发明授权
    Precursors for CVD/ALD of metal-containing films 失效
    含金属膜CVD / ALD的前体

    公开(公告)号:US08168811B2

    公开(公告)日:2012-05-01

    申请号:US12507048

    申请日:2009-07-21

    IPC分类号: C07F9/00 C07F15/00 C07F5/06

    CPC分类号: C07C225/14 C07F7/003

    摘要: Precursors useful for vapor phase deposition processes, e.g., CVD/ALD, to form metal-containing films on substrates. The precursors include, in one class, a central metal atom M to which is coordinated at least one ligand of formula (I): wherein: R1, R2 and R3 are each independently H or ogano moieties; and G1 is an electron donor arm substituent that increases the coordination of the ligand to the central metal atom M; wherein when G1 is aminoalkyl, the substituents on the amino nitrogen are not alkyl, fluoroalkyl, cycloaliphatic, or aryl, and are not connected to form a ring structure containing carbon, oxygen or nitrogen atoms. Also disclosed are ketoester, malonate and other precursors adapted for forming metal-containing films on substrates, suitable for use in the manufacture of microelectronic device products such as semiconductor devices and flat panel displays.

    摘要翻译: 用于气相沉积工艺(例如CVD / ALD)以在基底上形成含金属膜的前体。 前体在一类中包括配位至少一种式(I)配位体的中心金属原子M:其中:R 1,R 2和R 3各自独立地为H或无规部分; 并且G1是增加配体与中心金属原子M的配位的电子给体臂取代基; 其中当G1是氨基烷基时,氨基氮上的取代基不是烷基,氟烷基,脂环族或芳基,并且不连接形成含有碳,氧或氮原子的环结构。 还公开了适用于在诸如半导体器件和平板显示器的微电子器件产品的制造中用于在基底上形成含金属膜的酮酯,丙二酸酯和其它前体。

    PRECURSORS FOR CVD/ALD OF METAL-CONTAINING FILMS
    16.
    发明申请
    PRECURSORS FOR CVD/ALD OF METAL-CONTAINING FILMS 失效
    含有金属膜的CVD / ALD的前身

    公开(公告)号:US20100018439A1

    公开(公告)日:2010-01-28

    申请号:US12507048

    申请日:2009-07-21

    IPC分类号: C09D7/12 C07C211/00 C07F7/28

    CPC分类号: C07C225/14 C07F7/003

    摘要: Precursors useful for vapor phase deposition processes, e.g., CVD/ALD, to form metal-containing films on substrates. The precursors include, in one class, a central metal atom M to which is coordinated at least one ligand of formula (I): wherein:R1, R2 and R3 are each independently H or ogano moieties; andG1 is an electron donor arm substituent that increases the coordination of the ligand to the central metal atom M;wherein when Ga is aminoalkyl, the substituents on the amino nitrogen are not alkyl, fluoroalkyl, cycloaliphatic, or aryl, and are not connected to form a ring structure containing carbon, oxygen or nitrogen atoms. Also disclosed are ketoester, malonate and other precursors adapted for forming metal-containing films on substrates, suitable for use in the manufacture of microelectronic device products such as semiconductor devices and flat panel displays.

    摘要翻译: 用于气相沉积工艺(例如CVD / ALD)以在基底上形成含金属膜的前体。 前体在一类中包括配位至少一种式(I)配位体的中心金属原子M:其中:R 1,R 2和R 3各自独立地为H或无规部分; 并且G1是增加配体与中心金属原子M的配位的电子给体臂取代基; 其中当Ga是氨基烷基时,氨基氮上的取代基不是烷基,氟代烷基,脂环族或芳基,并且不连接形成含有碳,氧或氮原子的环结构。 还公开了适用于在诸如半导体器件和平板显示器的微电子器件产品的制造中用于在基底上形成含金属膜的酮酯,丙二酸酯和其它前体。

    DOPING OF ZrO2 FOR DRAM APPLICATIONS
    17.
    发明申请
    DOPING OF ZrO2 FOR DRAM APPLICATIONS 有权
    用于DRAM应用的ZrO2的掺杂

    公开(公告)号:US20130122722A1

    公开(公告)日:2013-05-16

    申请号:US13808165

    申请日:2011-06-23

    IPC分类号: H01L49/02

    摘要: A method of forming a dielectric material, comprising doping a zirconium oxide material, using a dopant precursor selected from the group consisting of Ti(NMe2)4; Ti(NMeEt)4; Ti(NEt2)4; TiCl4; tBuN═Nb(NEt2)3; tBuN═Nb(NMe2)3; t-BuN═Nb(NEtMe)3; t-AmN═Nb(NEt2)3; t-AmN═Nb(NEtMe)3; t-AmN═Nb(NMe2)3; t-AmN═Nb(OBu-t)3; Nb-13; Nb(NEt2)4; Nb(NEt2)5; Nb(N(CH3)2)5; Nb(OC2H5)5; Nb(thd)(OPr-i)4; SiH(OMe)3; SiCU; Si(NMe2)4; (Me3Si)2NH; GeRax(ORb)4.x wherein x is from 0 to 4, each Ra is independently selected from H or C1-C8 alkyl and each Rb is independently selected from C1-C8 alkyl; GeCl4; Ge(NRa2)4 wherein each Ra is independently selected from H and C1-C8 alkyl; and (Rb3Ge)2NH wherein each Rb is independently selected from C1-C8 alkyl; bis(N,N′-diisopropyl-1,3-propanediamide) titanium; and tetrakis(isopropylmethylamido) titanium; wherein Me is methyl, Et is ethyl, Pr-i is isopropyl, t-Bu is tertiary butyl, t-Am is tertiary amyl, and thd is 2,2,6,6-tetramethyl-3,5-heptanedionate. Doped zirconium oxide materials of the present disclosure are usefully employed in ferroelectric capacitors and dynamic random access memory (DRAM) devices.

    摘要翻译: 一种形成电介质材料的方法,包括使用选自Ti(NMe 2)4的掺杂剂前体掺杂氧化锆材料; Ti(NMeEt)4; Ti(NEt2)4; TiCl4; tBuN = Nb(NEt2)3; tBuN = Nb(NMe2)3; t-BuN = Nb(NEtMe)3; t-AmN = Nb(NEt2)3; t-AmN = Nb(NEtMe)3; t-AmN = Nb(NMe2)3; t-AmN = Nb(OBu-t)3; Nb-13; Nb(NEt2)4; Nb(NEt2)5; Nb(N(CH 3)2)5; Nb(OC2H5)5; Nb(thd)(OPr-i)4; SiH(OMe)3; SiCU; Si(NMe2)4; (Me 3 Si)2 NH GeRax(ORb)4.x其中x为0至4,每个R a独立地选自H或C 1 -C 8烷基,并且每个R b独立地选自C 1 -C 8烷基; GeCl4; Ge(NRa 2)4,其中每个R a独立地选自H和C 1 -C 8烷基; 和(Rb 3 Ge)2 NH,其中每个R b独立地选自C 1 -C 8烷基; 双(N,N'-二异丙基-1,3-丙二酰胺)钛; 和四(异丙基甲基氨基)钛; 其中Me是甲基,Et是乙基,Pr-i是异丙基,t-Bu是叔丁基,t-Am是叔戊基,thd是2,2,6,6-四甲基-3,5-庚二酮酸。 本公开的掺杂氧化锆材料有用地用于铁电电容器和动态随机存取存储器(DRAM)器件中。

    METHOD AND COMPOSITION FOR DEPOSITING RUTHENIUM WITH ASSISTIVE METAL SPECIES
    18.
    发明申请
    METHOD AND COMPOSITION FOR DEPOSITING RUTHENIUM WITH ASSISTIVE METAL SPECIES 有权
    用辅助金属物种沉积金属的方法和组合物

    公开(公告)号:US20120064719A1

    公开(公告)日:2012-03-15

    申请号:US13256832

    申请日:2010-03-17

    IPC分类号: H01L21/28 B05D5/12 H01B1/00

    摘要: A method of forming a ruthenium-containing film in a vapor deposition process, including depositing ruthenium with an assistive metal species that increases the rate and extent of ruthenium deposition in relation to deposition of ruthenium in the absence of such assistive metal species. An illustrative precursor composition useful for carrying out such method includes a ruthenium precursor and a strontium precursor in a solvent medium, wherein one of the ruthenium and strontium precursors includes a pendant functionality that coordinates with the central metal atom of the other precursor, so that ruthenium and strontium co-deposit with one another. The method permits incubation time for ruthenium deposition on non- metallic substrates to be very short, thereby accommodating very rapid film formation in processes such as atomic layer deposition.

    摘要翻译: 一种在气相沉积工艺中形成含钌膜的方法,包括用辅助金属物质沉积钌,其在不存在这种辅助金属物质的情况下相对于沉积钌而增加钌沉积的速率和程度。 用于实施这种方法的说明性前体组合物包括在溶剂介质中的钌前体和锶前体,其中钌和锶前体之一包括与另一前体的中心金属原子配位的侧链官能团,使得钌 和锶共沉积。 该方法允许在非金属基底上钌沉积的孵育时间非常短,从而在诸如原子层沉积的过程中容纳非常快速的成膜。

    Doping of ZrO2 for DRAM applications
    20.
    发明授权
    Doping of ZrO2 for DRAM applications 有权
    用于DRAM应用的ZrO2的掺杂

    公开(公告)号:US09373677B2

    公开(公告)日:2016-06-21

    申请号:US13808165

    申请日:2011-06-23

    IPC分类号: H01L49/02 H01L21/02

    摘要: A method of forming a dielectric material, comprising doping a zirconium oxide material, using a dopant precursor selected from the group consisting of Ti(NMe2)4; Ti(NMeEt)4; Ti(NEt2)4;TiCl4; tBuN═Nb(NEt2)3; tBuN═Nb(NMe2)3; t-BuN═Nb(NEtMe)3; t-AmN═Nb(NEt2)3; t-AmN═Nb(NEtMe)3; t-AmN═Nb(NMe2)3; t-AmN═Nb(OBu-t)3; Nb-13; Nb(NEt2)4; Nb(NEt2)5; Nb(N(CH3)2)5; Nb(OC2H5)5; Nb(thd)(OPr-i)4; SiH(OMe)3; SiCU; Si(NMe2)4; (Me3Si)2NH; GeRax(ORb)4.x wherein x is from 0 to 4, each Ra is independently selected from H or C1-C8 alkyl and each Rb is independently selected from C1-C8 alkyl; GeCl4; Ge(NRa2)4 wherein each Ra is independently selected from H and C1-C8 alkyl; and (Rb3Ge)2NH wherein each Rb is independently selected from C1-C8 alkyl; bis(N,N′-diisopropyl-1,3-propanediamide) titanium; and tetrakis(isopropylmethylamido) titanium; wherein Me is methyl, Et is ethyl, Pr-i is isopropyl, t-Bu is tertiary butyl, t-Am is tertiary amyl, and thd is 2,2,6,6-tetramethyl-3,5-heptanedionate. Doped zirconium oxide materials of the present disclosure are usefully employed in ferroelectric capacitors and dynamic random access memory (DRAM) devices.

    摘要翻译: 一种形成电介质材料的方法,包括使用选自Ti(NMe 2)4的掺杂剂前体掺杂氧化锆材料; Ti(NMeEt)4; Ti(NEt2)4; TiCl4; tBuN = Nb(NEt2)3; tBuN = Nb(NMe2)3; t-BuN = Nb(NEtMe)3; t-AmN = Nb(NEt2)3; t-AmN = Nb(NEtMe)3; t-AmN = Nb(NMe2)3; t-AmN = Nb(OBu-t)3; Nb-13; Nb(NEt2)4; Nb(NEt2)5; Nb(N(CH 3)2)5; Nb(OC2H5)5; Nb(thd)(OPr-i)4; SiH(OMe)3; SiCU; Si(NMe2)4; (Me 3 Si)2 NH GeRax(ORb)4.x其中x为0至4,每个R a独立地选自H或C 1 -C 8烷基,并且每个R b独立地选自C 1 -C 8烷基; GeCl4; Ge(NRa 2)4,其中每个R a独立地选自H和C 1 -C 8烷基; 和(Rb 3 Ge)2 NH,其中每个R b独立地选自C 1 -C 8烷基; 双(N,N'-二异丙基-1,3-丙二酰胺)钛; 和四(异丙基甲基氨基)钛; 其中Me是甲基,Et是乙基,Pr-i是异丙基,t-Bu是叔丁基,t-Am是叔戊基,thd是2,2,6,6-四甲基-3,5-庚二酮酸。 本公开的掺杂氧化锆材料有用地用于铁电电容器和动态随机存取存储器(DRAM)器件中。