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    PRECURSOR COMPOSITIONS FOR ALD/CVD OF GROUP II RUTHENATE THIN FILMS
    2.
    发明申请
    PRECURSOR COMPOSITIONS FOR ALD/CVD OF GROUP II RUTHENATE THIN FILMS 有权
    用于II组RUTHENATE薄膜的ALD / CVD的前体组合物

    公开(公告)号：US20100095865A1

    公开(公告)日：2010-04-22

    申请号：US12523704

    申请日：2007-03-12

    申请人： Chongying Xu ,  Bryan C. Hendrix ,  Thomas M. Cameron ,  Jeffrey F. Roeder ,  Matthias Stender ,  Tianniu Chen

    发明人： Chongying Xu ,  Bryan C. Hendrix ,  Thomas M. Cameron ,  Jeffrey F. Roeder ,  Matthias Stender ,  Tianniu Chen

    IPC分类号： C23C16/18 ,  C23C16/30

    CPC分类号： C07F17/02

    摘要： Precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of strontium ruthenium oxide (SrRuO3) thin films, e.g., in the manufacture of microelectronic devices, as well as processes of making and using such precursors, and precursor supply systems containing such precursor compositions in packaged form. Cyclopentadienyl compounds of varied type are described, including cyclopentadienyl as well as non cyclopentadienyl ligands coordinated to ruthenium, strontium or barium central atoms. The precursors of the invention are useful for forming contacts for microelectronic memory device structures, and in a specific aspect for selectively coating copper metallization without deposition on associated dielectric, under deposition conditions in a forming gas ambient.

    摘要翻译： 用于原子层沉积（ALD）和氧化钌氧化物（SrRuO 3）薄膜的化学气相沉积（CVD）的前体组合物，例如在微电子器件的制造中，以及制备和使用这些前体的方法以及前体供应 含有包装形式的前体组合物的体系。 描述了不同类型的环戊二烯基化合物，包括环戊二烯基以及与钌，锶或钡中心原子配位的非环戊二烯基配位体。 本发明的前体可用于形成微电子存储器件结构的接触，并且在特定方面，用于在形成气体环境中的沉积条件下，在相关联的电介质上不沉积而选择性地涂覆铜金属化。

    Precursor compositions for ALD/CVD of group II ruthenate thin films
    4.
    发明授权
    Precursor compositions for ALD/CVD of group II ruthenate thin films 有权
    用于II组钌酸盐薄膜的ALD / CVD的前体组合物

    公开(公告)号：US08524931B2

    公开(公告)日：2013-09-03

    申请号：US12523704

    申请日：2007-03-12

    申请人： Chongying Xu ,  Bryan C. Hendrix ,  Thomas M. Cameron ,  Jeffrey F. Roeder ,  Matthias Stender ,  Tianniu Chen

    发明人： Chongying Xu ,  Bryan C. Hendrix ,  Thomas M. Cameron ,  Jeffrey F. Roeder ,  Matthias Stender ,  Tianniu Chen

    IPC分类号： C07F15/00 ,  C03C17/10

    CPC分类号： C07F17/02

    摘要： Precursor compositions useful for atomic layer deposition (ALD) and chemical vapor deposition (CVD) of strontium ruthenium oxide (SrRuO3) thin films, e.g., in the manufacture of microelectronic devices, as well as processes of making and using such precursors, and precursor supply systems containing such precursor compositions in packaged form. Cyclopentadienyl compounds of varied type are described, including cyclopentadienyl as well as non cyclopentadienyl ligands coordinated to ruthenium, strontium or barium central atoms. The precursors of the invention are useful for forming contacts for microelectronic memory device structures, and in a specific aspect for selectively coating copper metallization without deposition on associated dielectric, under deposition conditions in a forming gas ambient.

    摘要翻译： 用于原子层沉积（ALD）和氧化钌氧化物（SrRuO 3）薄膜的化学气相沉积（CVD）的前体组合物，例如在微电子器件的制造中，以及制备和使用这些前体的方法以及前体供应 含有包装形式的前体组合物的体系。 描述了不同类型的环戊二烯基化合物，包括环戊二烯基以及与钌，锶或钡中心原子配位的非环戊二烯基配位体。 本发明的前体可用于形成微电子存储器件结构的接触，并且在特定方面，用于在形成气体环境中的沉积条件下，在相关联的电介质上不沉积而选择性地涂覆铜金属化。

    DOPING OF ZrO2 FOR DRAM APPLICATIONS
    8.
    发明申请
    DOPING OF ZrO2 FOR DRAM APPLICATIONS 有权
    用于DRAM应用的ZrO2的掺杂

    公开(公告)号：US20130122722A1

    公开(公告)日：2013-05-16

    申请号：US13808165

    申请日：2011-06-23

    申请人： Julie Cissell ,  Chongying Xu ,  Thomas M. Cameron ,  William Hunks ,  David W. Peters

    发明人： Julie Cissell ,  Chongying Xu ,  Thomas M. Cameron ,  William Hunks ,  David W. Peters

    IPC分类号： H01L49/02

    CPC分类号： H01L28/40 ,  C23C16/45525 ,  H01L21/02189 ,  H01L21/02194 ,  H01L21/0228

    摘要： A method of forming a dielectric material, comprising doping a zirconium oxide material, using a dopant precursor selected from the group consisting of Ti(NMe2)4; Ti(NMeEt)4; Ti(NEt2)4; TiCl4; tBuN═Nb(NEt2)3; tBuN═Nb(NMe2)3; t-BuN═Nb(NEtMe)3; t-AmN═Nb(NEt2)3; t-AmN═Nb(NEtMe)3; t-AmN═Nb(NMe2)3; t-AmN═Nb(OBu-t)3; Nb-13; Nb(NEt2)4; Nb(NEt2)5; Nb(N(CH3)2)5; Nb(OC2H5)5; Nb(thd)(OPr-i)4; SiH(OMe)3; SiCU; Si(NMe2)4; (Me3Si)2NH; GeRax(ORb)4.x wherein x is from 0 to 4, each Ra is independently selected from H or C1-C8 alkyl and each Rb is independently selected from C1-C8 alkyl; GeCl4; Ge(NRa2)4 wherein each Ra is independently selected from H and C1-C8 alkyl; and (Rb3Ge)2NH wherein each Rb is independently selected from C1-C8 alkyl; bis(N,N′-diisopropyl-1,3-propanediamide) titanium; and tetrakis(isopropylmethylamido) titanium; wherein Me is methyl, Et is ethyl, Pr-i is isopropyl, t-Bu is tertiary butyl, t-Am is tertiary amyl, and thd is 2,2,6,6-tetramethyl-3,5-heptanedionate. Doped zirconium oxide materials of the present disclosure are usefully employed in ferroelectric capacitors and dynamic random access memory (DRAM) devices.

    摘要翻译： 一种形成电介质材料的方法，包括使用选自Ti（NMe 2）4的掺杂剂前体掺杂氧化锆材料; Ti（NMeEt）4; Ti（NEt2）4; TiCl4; tBuN = Nb（NEt2）3; tBuN = Nb（NMe2）3; t-BuN = Nb（NEtMe）3; t-AmN = Nb（NEt2）3; t-AmN = Nb（NEtMe）3; t-AmN = Nb（NMe2）3; t-AmN = Nb（OBu-t）3; Nb-13; Nb（NEt2）4; Nb（NEt2）5; Nb（N（CH 3）2）5; Nb（OC2H5）5; Nb（thd）（OPr-i）4; SiH（OMe）3; SiCU; Si（NMe2）4; （Me 3 Si）2 NH GeRax（ORb）4.x其中x为0至4，每个R a独立地选自H或C 1 -C 8烷基，并且每个R b独立地选自C 1 -C 8烷基; GeCl4; Ge（NRa 2）4，其中每个R a独立地选自H和C 1 -C 8烷基; 和（Rb 3 Ge）2 NH，其中每个R b独立地选自C 1 -C 8烷基; 双（N，N'-二异丙基-1,3-丙二酰胺）钛; 和四（异丙基甲基氨基）钛; 其中Me是甲基，Et是乙基，Pr-i是异丙基，t-Bu是叔丁基，t-Am是叔戊基，thd是2,2,6,6-四甲基-3,5-庚二酮酸。 本公开的掺杂氧化锆材料有用地用于铁电电容器和动态随机存取存储器（DRAM）器件中。

    Precursors for CVD/ALD of metal-containing films
    9.
    发明授权
    Precursors for CVD/ALD of metal-containing films 失效
    含金属膜CVD / ALD的前体

    公开(公告)号：US08168811B2

    公开(公告)日：2012-05-01

    申请号：US12507048

    申请日：2009-07-21

    申请人： Thomas M. Cameron ,  Chongying Xu ,  Tianniu Chen

    发明人： Thomas M. Cameron ,  Chongying Xu ,  Tianniu Chen

    IPC分类号： C07F9/00 ,  C07F15/00 ,  C07F5/06

    CPC分类号： C07C225/14 ,  C07F7/003

    摘要： Precursors useful for vapor phase deposition processes, e.g., CVD/ALD, to form metal-containing films on substrates. The precursors include, in one class, a central metal atom M to which is coordinated at least one ligand of formula (I): wherein: R1, R2 and R3 are each independently H or ogano moieties; and G1 is an electron donor arm substituent that increases the coordination of the ligand to the central metal atom M; wherein when G1 is aminoalkyl, the substituents on the amino nitrogen are not alkyl, fluoroalkyl, cycloaliphatic, or aryl, and are not connected to form a ring structure containing carbon, oxygen or nitrogen atoms. Also disclosed are ketoester, malonate and other precursors adapted for forming metal-containing films on substrates, suitable for use in the manufacture of microelectronic device products such as semiconductor devices and flat panel displays.

    摘要翻译： 用于气相沉积工艺（例如CVD / ALD）以在基底上形成含金属膜的前体。 前体在一类中包括配位至少一种式（I）配位体的中心金属原子M：其中：R 1，R 2和R 3各自独立地为H或无规部分; 并且G1是增加配体与中心金属原子M的配位的电子给体臂取代基; 其中当G1是氨基烷基时，氨基氮上的取代基不是烷基，氟烷基，脂环族或芳基，并且不连接形成含有碳，氧或氮原子的环结构。 还公开了适用于在诸如半导体器件和平板显示器的微电子器件产品的制造中用于在基底上形成含金属膜的酮酯，丙二酸酯和其它前体。

    METHOD AND COMPOSITION FOR DEPOSITING RUTHENIUM WITH ASSISTIVE METAL SPECIES
    10.
    发明申请
    METHOD AND COMPOSITION FOR DEPOSITING RUTHENIUM WITH ASSISTIVE METAL SPECIES 有权
    用辅助金属物种沉积金属的方法和组合物

    公开(公告)号：US20120064719A1

    公开(公告)日：2012-03-15

    申请号：US13256832

    申请日：2010-03-17

    申请人： Jorge A. Lubguban, JR. ,  Thomas M. Cameron ,  Chongying Xu ,  Weimin Li

    发明人： Jorge A. Lubguban, JR. ,  Thomas M. Cameron ,  Chongying Xu ,  Weimin Li

    IPC分类号： H01L21/28 ,  B05D5/12 ,  H01B1/00

    CPC分类号： C23C16/0272 ,  C23C16/18 ,  C23C16/45534 ,  H01L28/65

    摘要： A method of forming a ruthenium-containing film in a vapor deposition process, including depositing ruthenium with an assistive metal species that increases the rate and extent of ruthenium deposition in relation to deposition of ruthenium in the absence of such assistive metal species. An illustrative precursor composition useful for carrying out such method includes a ruthenium precursor and a strontium precursor in a solvent medium, wherein one of the ruthenium and strontium precursors includes a pendant functionality that coordinates with the central metal atom of the other precursor, so that ruthenium and strontium co-deposit with one another. The method permits incubation time for ruthenium deposition on non- metallic substrates to be very short, thereby accommodating very rapid film formation in processes such as atomic layer deposition.

    摘要翻译： 一种在气相沉积工艺中形成含钌膜的方法，包括用辅助金属物质沉积钌，其在不存在这种辅助金属物质的情况下相对于沉积钌而增加钌沉积的速率和程度。 用于实施这种方法的说明性前体组合物包括在溶剂介质中的钌前体和锶前体，其中钌和锶前体之一包括与另一前体的中心金属原子配位的侧链官能团，使得钌 和锶共沉积。 该方法允许在非金属基底上钌沉积的孵育时间非常短，从而在诸如原子层沉积的过程中容纳非常快速的成膜。