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    Semiconductor packaging structure and semiconductor power device thereof
    11.
    发明授权
    Semiconductor packaging structure and semiconductor power device thereof 有权

    公开(公告)号：US10347758B2

    公开(公告)日：2019-07-09

    申请号：US15647278

    申请日：2017-07-12

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Chao-Feng Cai ,  Jian-Hong Zeng ,  Zeng Li

    IPC: H01L29/417 ,  H01L29/78 ,  H01L23/50 ,  H01L23/00 ,  H01L29/40 ,  H01L29/10

    Abstract: A semiconductor packaging structure includes a chip, a first pin, a second pin, and a third pin. The chip includes a first surface, a second surface, a first power switch, and a second switch, and both the first power switch and the second switch include a first terminal and a second terminal. The second surface of the chip is opposite to the first surface of the chip. The first pin does not contact to the second pin. The first terminal of the first power switch of the chip is coupled to the first pin, and the second terminal of the first power switch of the chip is coupled to the third pin. The first terminal of the second power switch of the chip is coupled to the third pin, and the second terminal of the second power switch of the chip is coupled to the second pin.

    Power converting device
    13.
    发明授权
    Power converting device 有权

    公开(公告)号：US11018596B2

    公开(公告)日：2021-05-25

    申请号：US15285473

    申请日：2016-10-04

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Jian-Hong Zeng ,  Xiao-Ni Xin ,  Rui Wu ,  Min Zhou ,  Hao-Yi Ye

    IPC: H01F17/04 ,  H02M7/00 ,  H02M3/00 ,  H01F38/14 ,  H02M3/158 ,  H02M5/293 ,  H02M7/537 ,  H01F17/06

    Abstract: A power converter device includes a power element module, a conductor, and a magnetic-conductive assembly. The power element module includes at least two electrodes and a power semiconductor unit. Voltage among these electrodes is AC voltage. The power semiconductor unit includes at least one pure die, and the pure die includes plural surfaces. The surface which occupies the most area of the pure die is the pure die surface. The conductor is coupled to the power element module. A current loop forms between the power element module and the conductor. A magnetic loop forms in the magnetic-conductive assembly. The magnetic-conductive assembly includes a chamber. The current loop passes through the chamber and intersects the magnetic loop to form inductance which the current loop needs. A part of the power element module is disposed in the chamber.

    DRIVING CIRCUIT FOR POWER SWITCH
    15.
    发明申请
    DRIVING CIRCUIT FOR POWER SWITCH 审中-公开

    公开(公告)号：US20170155377A1

    公开(公告)日：2017-06-01

    申请号：US15332623

    申请日：2016-10-24

    Applicant: DELTA ELECTRONICS, INC.

    Inventor： Pei-Qing Hu ,  Jian-Hong Zeng ,  Hao-Yi Ye

    IPC: H03K3/012 ,  H03K17/687

    CPC classification number: H03K3/012 ,  H02M1/08 ,  H02M3/158 ,  H02M3/1582 ,  H02M2001/346 ,  H03K17/04123 ,  H03K17/163 ,  H03K17/687 ,  Y02B70/1425 ,  Y02B70/1491

    Abstract: A driving circuit for driving a power switch. The driving circuit and the power switch are collaboratively defined as an equivalent circuit. The equivalent circuit includes a first equivalent capacitor corresponding to an input capacitor of the power switch, an equivalent inductor, and a second equivalent capacitor corresponding to a parasitic parameter of at least one driving switch. In the charging procedure or the discharging of the first equivalent capacitor, a change amount of charges in the first equivalent capacitor while a voltage of the input capacitor is changed from a voltage corresponding to no inductor current to a set voltage is larger than or equal to a change amount of charges in the second equivalent capacitor while the voltage of the input capacitor is changed from the voltage corresponding to no inductor current to a steady voltage.

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