公开(公告)号：US09589863B2

公开(公告)日：2017-03-07

申请号：US15094038

申请日：2016-04-08

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shouyu Hong ,  Yanlin Chen ,  Zhenqing Zhao

IPC: H01L23/36 ,  H01L23/373

CPC classification number: H01L23/3733 ,  H01L23/3737 ,  H01L2224/0603 ,  H01L2224/4846

Abstract: A power module and a thermal interface structure are provided herein. The thermal interface structure includes: a base and a plurality of filler particles distributed in the base. When the filler particles are under pressure, at least a part of the filler particles are deformed, and at least two adjacent filler particles partially contact with each other to form a heat-conducting path for transferring heat.

Abstract translation: 本文提供了功率模块和热接口结构。 热界面结构包括：基底和分散在基底中的多个填料颗粒。 当填料颗粒处于压力下时，填料颗粒的至少一部分变形，并且至少两个相邻的填料颗粒彼此部分接触以形成用于传递热量的导热路径。

公开(公告)号：US11245214B2

公开(公告)日：2022-02-08

申请号：US16934076

申请日：2020-07-21

Applicant: Delta Electronics, Inc.

Inventor： Shouyu Hong ,  Qingdong Chen ,  Ganyu Zhou ,  Pengkai Ji ,  Yiqing Ye ,  Zhenqing Zhao

IPC: H01R13/22 ,  H01R12/71 ,  H01R43/16 ,  H01R13/405

Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.

公开(公告)号：US11183323B2

公开(公告)日：2021-11-23

申请号：US16104961

申请日：2018-08-20

Applicant: Delta Electronics,Inc.

Inventor： Haibin Xu ,  Tao Wang ,  Shouyu Hong ,  Zhenqing Zhao ,  Yicong Xie ,  Zengsheng Wang

IPC: H01F3/14 ,  H01F3/10 ,  H01F3/12 ,  H01F27/28

Abstract: There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.

公开(公告)号：US10685895B2

公开(公告)日：2020-06-16

申请号：US16261012

申请日：2019-01-29

Applicant: DELTA ELECTRONICS, INC.

Inventor： Pengkai Ji ,  Shouyu Hong ,  Zhenqing Zhao ,  Jianhong Zeng

IPC: H05K1/02 ,  H05K5/00 ,  H05K9/00 ,  H01L23/34 ,  H01L23/36 ,  H01L23/58 ,  H01L23/66 ,  H01L23/367 ,  H01L29/82 ,  H01L51/52 ,  H01L23/31 ,  H01L21/56 ,  H01L23/433 ,  H01L23/498 ,  H01L23/492 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40

Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.

公开(公告)号：US10340617B2

公开(公告)日：2019-07-02

申请号：US15168262

申请日：2016-05-31

Applicant: Delta Electronics, Inc.

Inventor： Le Liang ,  Shouyu Hong ,  Zhenqing Zhao

IPC: H01R12/58 ,  H02M3/04 ,  H01R12/52

Abstract: A power module with vertically stacked structure and a pin thereof are disclosed. The power module comprises at least three circuit modules. The at least three circuit modules are a first circuit module, a second circuit module and a third circuit module. The pin is led from the first circuit module. The pin comprises: a main body, a first connection surface and a second connection surface. An upper part of the main body is electrically connected with the first circuit module. The first connection surface is provided at a middle part of the main body and electrically connected with the second circuit module. The second connection surface is provided at a terminal of the main body and electrically connected with the third circuit module.

公开(公告)号：US20190157175A1

公开(公告)日：2019-05-23

申请号：US16261012

申请日：2019-01-29

Applicant: DELTA ELECTRONICS, INC.

Inventor： Pengkai Ji ,  Shouyu Hong ,  Zhenqing Zhao ,  Jianhong Zeng

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/433 ,  H01L23/492 ,  H05K3/40 ,  H01L21/56 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/30

Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.

公开(公告)号：US09892998B2

公开(公告)日：2018-02-13

申请号：US14918837

申请日：2015-10-21

Applicant: DELTA ELECTRONICS, INC.

Inventor： Kai Lu ,  Zhenqing Zhao ,  Shouyu Hong ,  Tao Wang ,  Le Liang

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49555 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/8382 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665

Abstract: The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion circuit is surface-mountable on a system board. The package module of the power conversion circuit includes: a substrate, a power device die, a molding layer and a plurality of pins. The substrate has a metal layer, an insulating substrate layer and a thermal conductive layer. The insulating substrate layer is disposed between the metal layer and the thermal conductive layer. The power device die is coupled to the metal layer. Devices on the metal layer of the substrate are embedded in the molding layer. The plurality of pins is electrically coupled to the metal layer and embedded in the molding layer, at least a contact surface of each of the pins which is electrically coupled to the system board is exposed, and the contact surface is parallel and/or perpendicular to the thermal conductive layer. The package module with this structure occupies a small area, and facilitates batch production.

公开(公告)号：US09748205B2

公开(公告)日：2017-08-29

申请号：US15081365

申请日：2016-03-25

Applicant: DELTA ELECTRONICS, INC.

Inventor： Kai Lu ,  Zhenqing Zhao ,  Tao Wang ,  Le Liang

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/31 ,  H05K1/02 ,  H05K3/28

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L2224/16225 ,  H01L2224/48137 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0263 ,  H05K3/284 ,  H05K2201/10166 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device.

公开(公告)号：US09679786B2

公开(公告)日：2017-06-13

申请号：US15051852

申请日：2016-02-24

Applicant: DELTA ELECTRONICS, INC.

Inventor： Shouyu Hong ,  Kai Lu ,  Zhenqing Zhao

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L25/07 ,  H01L23/498 ,  H01L23/373

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/97 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85

Abstract: The disclosure discloses a packaging module of a power converting circuit and a method for manufacturing the same. The packaging module of the power converting circuit includes a substrate, a molding layer and a plurality of pins. A power device is assembled at the substrate, a plurality of pins electrically are coupled to the power device, the molding layer covers the surface of the substrate with the power device, and at least a contact surface of the pins configured to electrically connect an external circuit is exposed. The molding layer includes a main hat-body part and a hat-brim part, the main hat-body part and the hat-brim part form a hat-shaped molding layer, and the hat-brim part is used to increase a creepage distance between the contact surfaces of the pins located at the top of the molding layer and the bottom of the substrate.

公开(公告)号：US20160366780A1

公开(公告)日：2016-12-15

申请号：US15168262

申请日：2016-05-31

Applicant: Delta Electronics, Inc.

Inventor： Le Liang ,  Shouyu Hong ,  Zhenqing Zhao

IPC: H05K7/02 ,  H02M7/04 ,  H02M7/44 ,  H01R12/58 ,  H02M1/42 ,  H05K7/20 ,  H02M7/00 ,  H01R12/52 ,  H02M3/04 ,  H02M5/04

CPC classification number: H01R12/585 ,  H01R12/52 ,  H02M3/04

Abstract: A power module with vertically stacked structure and a pin thereof are disclosed. The power module comprises at least three circuit modules. The at least three circuit modules are a first circuit module, a second circuit module and a third circuit module. The pin is led from the first circuit module. The pin comprises: a main body, a first connection surface and a second connection surface. An upper part of the main body is electrically connected with the first circuit module. The first connection surface is provided at a middle part of the main body and electrically connected with the second circuit module. The second connection surface is provided at a terminal of the main body and electrically connected with the third circuit module.

Abstract translation: 公开了具有垂直堆叠结构的电源模块及其引脚。 功率模块包括至少三个电路模块。 所述至少三个电路模块是第一电路模块，第二电路模块和第三电路模块。 引脚从第一个电路模块引出。 销包括：主体，第一连接表面和第二连接表面。 主体的上部与第一电路模块电连接。 第一连接表面设置在主体的中间部分并与第二电路模块电连接。 第二连接表面设置在主体的端子处并与第三电路模块电连接。