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44 条记录 (耗时 0.028 秒)

    Method and apparatus for cutting a keyway in a mill roll
    12.
    发明授权
    Method and apparatus for cutting a keyway in a mill roll 失效
    用于在轧辊中切割键槽的方法和装置

    公开(公告)号：US5247740A

    公开(公告)日：1993-09-28

    申请号：US971940

    申请日：1992-11-05

    申请人： Gary L. Curtis ,  Gregory A. Johnson ,  Paula M. Tuebo

    发明人： Gary L. Curtis ,  Gregory A. Johnson ,  Paula M. Tuebo

    IPC分类号： B23D1/00 ,  B21B45/02 ,  B23D37/04

    CPC分类号： B21B45/0275 ,  B23D37/04 ,  Y10T29/49549 ,  Y10T29/49554 ,  Y10T409/400175 ,  Y10T409/4028 ,  Y10T409/40595

    摘要： A method for forming a longitudinally extending keyway portion in a mill roll having a central bore, in which the keyway portion may be either a keyway or a tab portion. A cutting head is provided, and includes a body and one or more cutting tools extending from the periphery of the cutting head body. The cutting head is driven through the central bore of the mill roll, and the cutting tools form one or more keyway portions adjacent and communicating with the central bore.

    摘要翻译： 一种用于在具有中心孔的轧辊中形成纵向延伸的键槽部分的方法，其中键槽部分可以是键槽或突片部分。 提供切割头，并且包括主体和从切割头本体的周边延伸的一个或多个切割工具。 切割头被驱动通过轧辊的中​​心孔，并且切割工具形成与中心孔相邻并连通的一个或多个键槽部分。

    Methods and apparatus for rinsing and drying
    13.
    发明授权
    Methods and apparatus for rinsing and drying 有权
    冲洗和干燥的方法和设备

    公开(公告)号：US07429537B2

    公开(公告)日：2008-09-30

    申请号：US11292823

    申请日：2005-12-02

    申请人： Brian K. Aegerter ,  Curt T. Dundas ,  Tom L. Ritzdorf ,  Gary L. Curtis ,  Michael Jolley

    发明人： Brian K. Aegerter ,  Curt T. Dundas ,  Tom L. Ritzdorf ,  Gary L. Curtis ,  Michael Jolley

    IPC分类号： H01L21/302

    CPC分类号： H01L21/67051 ,  B08B3/02 ,  H01L21/67028

    摘要： A method for rinsing and drying a workpiece includes placing the workpiece into a chamber and spinning the workpiece. A rinsing fluid, such as water, is applied onto the workpiece through a first outlet in the chamber, with the rinsing fluid moving outwardly towards the edge of the workpiece via centrifugal force, to rinse the workpiece. A drying fluid, such as an alcohol vapor, is applied onto the workpiece through the first outlet, with the drying fluid moving outwardly towards the edge of the workpiece via centrifugal force, to dry the workpiece. The drying fluid advantageously follows a meniscus of the rinsing fluid across the workpiece surface. The rinsing fluid, or the drying fluid, or both fluids, may be applied near or at a central area of the workpiece.

    摘要翻译： 用于冲洗和干燥工件的方法包括将工件放置在室中并旋转工件。 冲洗流体例如水通过腔室中的第一出口施加到工件上，漂洗流体通过离心力向外移动到工件的边缘，以冲洗工件。 干燥流体，例如醇蒸汽，通过第一出口施加到工件上，干燥流体通过离心力向外移动到工件的边缘，以干燥工件。 干燥流体有利地沿着穿过工件表面的冲洗流体的弯液面。 冲洗流体或干燥流体或两种流体可以施加在工件的中心区域附近或其附近。

    Semiconductor wafer processing apparatus
    15.
    发明授权
    Semiconductor wafer processing apparatus 失效
    半导体晶片处理装置

    公开(公告)号：US06799932B2

    公开(公告)日：2004-10-05

    申请号：US10457944

    申请日：2003-06-09

    申请人： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

    发明人： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

    IPC分类号： B65G49107

    CPC分类号： H01L21/67754 ,  H01L21/67173 ,  H01L21/6732 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

    摘要： A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism that is adapted to seal with a pod disposed in the interface section. The article insertion mechanism is disposed to allow insertion of the articles into the pod after processing by the at least one processing station. The article insertion mechanism allows the insertion of the articles without exposing the articles to ambient atmospheric conditions in the interface section.

    摘要翻译： 阐述了一种用于在基本上清洁的气氛中处理诸如半导体晶片的制品的处理器。 处理器包括限定基本封闭的清洁处理室的外壳和设置在处理室中的至少一个处理站。 接口部分设置在外壳的接口端附近。 接口部分包括至少一个接口端口，通过该至少一个接口端口将包含用于处理的物品的容器装载或者从处理器卸载。 接口部分与处理室卫生地分开，因为界面部分通常不像高度卫生的处理室那么干净。 采用适于与荚密封的物品提取机构。 该机构被设置为允许将容纳在容器内的物品提取到处理室中，而不会使物品暴露于接口部分中的环境大气条件。 物品处理器还优选地包括物品插入机构，其适于与设置在界面部分中的容器密封。 物品插入机构设置成允许在由至少一个处理站处理之后将物品插入容器中。 物品插入机构允许物品的插入，而不会使物品暴露在界面部分中的环境大气条件下。

    Automated coolant delivery method and system for a machine tool
    16.
    发明授权
    Automated coolant delivery method and system for a machine tool 失效
    自动冷却液输送方法和机床系统

    公开(公告)号：US06715971B2

    公开(公告)日：2004-04-06

    申请号：US10118678

    申请日：2002-04-09

    申请人： Gary L. Curtis

    发明人： Gary L. Curtis

    IPC分类号： B23Q1110

    CPC分类号： B23Q11/1084 ,  B23H1/10 ,  B23Q11/1076 ,  Y10T408/458 ,  Y10T408/46 ,  Y10T409/303752 ,  Y10T409/303808 ,  Y10T409/303976 ,  Y10T409/304032 ,  Y10T409/304088

    摘要： A method and apparatus for directing a coolant stream onto a cutting tool is made up of a nozzle pivotally mounted on a machine tool, the nozzle being automatically adjusted in response to movement of the machine tool via a retractable plunger or other linear drive member so as to cause the coolant stream to intersect the interface between a workpiece and each cutting tool that is brought into cutting position on the machine tool; and the nozzle is pivotal between a reference position and a different intermediate position corresponding to the length or diameter of the cutting tool which is advanced into cutting position.

    摘要翻译： 用于将冷却剂流引导到切削工具上的方法和装置由可枢转地安装在机床上的喷嘴构成，喷嘴根据机床通过可伸缩柱塞或其它线性驱动构件的运动而被自动调节，以便 使冷却剂流与工件和被切割位置上的每个切削工具之间的界面相交; 并且喷嘴在参考位置与对应于进入切割位置的切割工具的长度或直径相对应的不同中间位置之间枢转。

    Reactor for processing a semiconductor wafer
    18.
    发明授权
    Reactor for processing a semiconductor wafer 有权

    公开(公告)号：US06447633B1

    公开(公告)日：2002-09-10

    申请号：US09710530

    申请日：2000-11-09

    申请人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

    发明人： Steven L. Peace ,  Gary L. Curtis ,  Raymon F. Thompson ,  Brian Aegerter ,  Curt T. Dundas

    IPC分类号： C28F102

    CPC分类号： H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

    摘要： A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid flows off of the circumferential edge of the wafer, it is contained in an annular reservoir, so that the fluid also flows onto an outer annular area of the second side of the wafer. An opening allows fluid to flow out of the reservoir. The opening defines the location of a parting line beyond which the fluid will not travel on the second side of the wafer. An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

    Reactor for processing a microelectronic workpiece
    19.
    发明授权
    Reactor for processing a microelectronic workpiece 失效
    用于处理微电子工件的反应器

    公开(公告)号：US06264752B1

    公开(公告)日：2001-07-24

    申请号：US09113435

    申请日：1998-07-10

    申请人： Gary L. Curtis ,  Raymon F. Thompson

    发明人： Gary L. Curtis ,  Raymon F. Thompson

    IPC分类号： C23L1600

    CPC分类号： H01L21/67017 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/6708

    摘要： An apparatus for processing a microelectronic workpiece in a micro-environment is set forth. The apparatus includes a first chamber member having an interior chamber wall and a second chamber member having an interior chamber wall. The first and second chamber members are adapted for relative movement between a loading position in which the first and second chamber members are distal one another and a processing position in which the first and second chamber members are proximate one another to define a processing chamber. At least one workpiece support assembly is disposed between the first and second chamber members for supporting the microelectronic workpiece. The workpiece support assembly is operable to space the workpiece a first distance, x1, from an interior chamber wall of at least one of the first and second chamber members when the first and second chamber members are in the loading position and to space the workpiece a second distance, x2, from the interior chamber wall when the first and second chamber members are in the processing position, wherein x1>x2.

    摘要翻译： 阐述了在微环境中处理微电子工件的装置。 该装置包括具有内部室壁的第一室构件和具有内部室壁的第二室构件。 第一和第二室构件适于在第一和第二室构件彼此远离的装载位置和第一和第二室构件彼此靠近以限定处理室的处理位置之间的相对运动。 至少一个工件支撑组件设置在第一和第二室构件之间，用于支撑微电子工件。 工件支撑组件可操作以当第一和第二室构件处于装载位置时将工件与第一和第二室构件中的至少一个室内构件的内室壁隔开第一距离x1，并使工件空间 第二距离x2，当第一和第二腔室构件处于加工位置时，其中x1> x2。