MEMORY DEVICE AND SYSTEM WITH IMPROVED ERASE OPERATION
    11.
    发明申请
    MEMORY DEVICE AND SYSTEM WITH IMPROVED ERASE OPERATION 有权
    具有改进的擦除操作的存储器件和系统

    公开(公告)号:US20130308370A1

    公开(公告)日:2013-11-21

    申请号:US13948138

    申请日:2013-07-22

    IPC分类号: G11C13/00

    摘要: A memory device includes a memory cell array including a plurality of memory blocks, each memory block including a plurality of memory cells, a plurality of word lines coupled to rows of the plurality of memory cells, a plurality of bit lines coupled to columns of the plurality of memory cells, and a control unit controlling an erase operation so that erase data is simultaneously written in the plurality of memory cells corresponding to an erase unit. A first erase mode may include a first erase unit and a first erase data pattern. A second erase mode may include a second erase unit and a second erase pattern. At least one of the first and second erase units and the first and second erase data patterns are different.

    摘要翻译: 存储器件包括存储单元阵列,该存储单元阵列包括多个存储器块,每个存储器块包括多个存储器单元,耦合到多个存储器单元中的行的多个字线,耦合到多个存储器单元的列的多个位线 多个存储单元,以及控制擦除操作的控制单元,使得擦除数据被同时写入与擦除单元对应的多个存储单元中。 第一擦除模式可以包括第一擦除单元和第一擦除数据模式。 第二擦除模式可以包括第二擦除单元和第二擦除模式。 第一和第二擦除单元以及第一和第二擦除数据模式中的至少一个是不同的。

    Method for the hydrogenation of poly-si
    12.
    发明授权
    Method for the hydrogenation of poly-si 有权
    多晶硅氢化方法

    公开(公告)号:US08580661B1

    公开(公告)日:2013-11-12

    申请号:US13216304

    申请日:2011-08-24

    申请人: Qi Wang

    发明人: Qi Wang

    IPC分类号: H01L21/20

    摘要: A method for hydrogenating poly-si. Poly-si is placed into the interior of a chamber. A filament is placed into the interior of a chamber. The base pressure of the interior of the chamber is evacuated, preferably to 10−6 Torr or less. The poly-si is heated for a predetermined poly-si heating time. The filament is heated by providing an electrical power to the filament. Hydrogen is supplied into the pressurized interior of the chamber comprising the heated poly-si and the heated filament. Atomic hydrogen is produced by the filament at a rate whereby the atomic hydrogen surface density at the poly-si is less than the poly-si surface density. Preferably, the poly-si is covered from the atomic hydrogen produced by the heated filament for a first predetermined covering time. Preferably, the poly-si is then uncovered from the atomic hydrogen produced by the heated filament for a first hydrogenation time.

    摘要翻译: 一种氢化多晶硅的方法。 多晶硅放置在室内。 灯丝放置在室内。 室内部的基础压力被抽真空,优选为10-6托或更低。 将多晶硅加热预定的多晶硅加热时间。 通过向灯丝提供电力来加热灯丝。 将氢气供应到包括加热的多晶硅和加热的细丝的腔室的加压内部。 原子氢由细丝以多晶硅中的原子氢表面密度小于多晶硅表面密度的速率产生。 优选地,多晶硅由加热的细丝产生的原子氢覆盖第一预定覆盖时间。 优选地,多晶硅然后从被加热的细丝产生的原子氢中暴露出第一个氢化时间。

    High sensitivity, solid state neutron detector
    13.
    发明授权
    High sensitivity, solid state neutron detector 有权
    高灵敏度,固态中子探测器

    公开(公告)号:US08569708B2

    公开(公告)日:2013-10-29

    申请号:US13146780

    申请日:2009-01-30

    IPC分类号: G01T3/08

    摘要: An apparatus (200) for detecting slow or thermal neutrons (160) including an alpha particle-detecting layer (240) that is a hydrogenated amorphous silicon p-i-n diode structure. The apparatus includes a bottom metal contact (220) and a top metal contact (250) with the diode structure (240) positioned between the two contacts (220, 250) to facilitate detection of alpha particles (170). The apparatus (200) includes a neutron conversion layer (230) formed of a material containing boron-10 isotopes. The top contact (250) is pixilated with each contact pixel extending to or proximate to an edge of the apparatus to facilitate electrical contacting. The contact pixels have elongated bodies to allow them to extend across the apparatus surface (242) with each pixel having a small surface area to match capacitance based upon a current spike detecting circuit or amplifier connected to each pixel. The neutron conversion layer (860) may be deposited on the contact pixels (830) such as with use of inkjet printing of nanoparticle ink.

    摘要翻译: 一种用于检测包括作为氢化非晶硅p-i-n二极管结构的α粒子检测层(240)的慢或热中子(160)的装置(200)。 该装置包括底部金属触点(220)和顶部金属触点(250),二极管结构(240)位于两个触点(220,250)之间,以便于检测α粒子(170)。 装置(200)包括由含有硼-10同位素的材料形成的中子转换层(230)。 顶部接触(250)被像素化,每个接触像素延伸到或靠近设备的边缘以促进电接触。 接触像素具有细长体以允许它们跨越装置表面(242)延伸,每个像素具有小的表面积,以基于连接到每个像素的电流尖峰检测电路或放大器匹配电容。 中子转换层(860)可以沉积在接触像素(830)上,例如使用纳米颗粒油墨的喷墨印刷。

    Synchronization structure and method for a receiving apparatus of a communication system
    14.
    发明授权
    Synchronization structure and method for a receiving apparatus of a communication system 失效
    通信系统的接收装置的同步结构和方法

    公开(公告)号:US08553812B2

    公开(公告)日:2013-10-08

    申请号:US12638369

    申请日:2009-12-15

    IPC分类号: H03D1/00 H04L27/06

    CPC分类号: H04L7/042

    摘要: Discussed herein is a synchronization structure for a receiving apparatus for receiving signals in a communication system, in which the signals are transmitted in frames, each frame comprising a synchronization part with synchronization sequences, wherein at least one of the synchronization sequences has a different phase than the other synchronization sequences. The synchronization structure includes a correlation unit configured to perform a correlation on the synchronization part, a peak detection unit configured to detect candidate correlation peaks and the correlation result, and a correlation peak detection unit configured to detect a correlation peak among said candidate correlation peaks on the basis of a confidence value and phase information. Further, a corresponding synchronization method that enables frame synchronization with a higher performance in low signal to noise ratio environments is also discussed.

    摘要翻译: 这里讨论的是用于在通信系统中接收信号的接收装置的同步结构,其中以帧的形式发送信号,每帧包括具有同步序列的同步部分,其中至少一个同步序列具有与 其他同步序列。 所述同步结构包括被配置为对所述同步部进行相关的相关单元,配置为检测候选相关峰的峰值检测单元和所述相关结果,以及相关峰检测单元,被配置为检测所述候选相关峰中的相关峰, 置信度和相位信息的基础。 此外,还讨论了在低信噪比环境中实现具有更高性能的帧同步的相应同步方法。

    NANO SMART GLASS SYSTEM
    15.
    发明申请
    NANO SMART GLASS SYSTEM 审中-公开
    纳诺智能玻璃系统

    公开(公告)号:US20130242370A1

    公开(公告)日:2013-09-19

    申请号:US13824312

    申请日:2012-05-25

    申请人: Qi Wang

    发明人: Qi Wang

    IPC分类号: G02F1/163 G02F1/153

    摘要: The present invention provides a nano smart glass system, including nano smart glass, DC power supply, sensor, and control unit. Wherein, the nano smart glass includes glass and the electrochromic thin-film device; The anode of the DC power supply connects to the at least one conductive anode layer of the electrochromic thin-film device; the cathode of the DC power supply connects to the at least one conductive cathode layer of the electrochromic thin-film device; the DC power supply is used to provide 1V-50V DC voltage to the electrochromic thin-film device; the electrochromic thin-film device adheres to the inside surface of the glass through the at least one conductive cathode layer or the at least one conductive anode layer; The sensor measures outdoor or indoor conditions and send the real-time measurement data to the control unit. The control unit connects to the DC power supply, and it can control the output voltage of the DC power supply to the electrochromic thin-film device. The present invention can real-time and intelligently adjust the color of the glass, which can help saving energy and reducing green house gas emission.

    摘要翻译: 本发明提供一种纳米智能玻璃系统,包括纳米智能玻璃,直流电源,传感器和控制单元。 其中,纳米智能玻璃包括玻璃和电致变色薄膜器件; 直流电源的阳极连接到电致变色薄膜器件的至少一个导电阳极层; 直流电源的阴极连接到电致变色薄膜器件的至少一个导电阴极层; 直流电源用于向电致变色薄膜器件提供1V-50V的直流电压; 所述电致变色薄膜器件通过所述至少一个导电阴极层或所述至少一个导电阳极层粘附到所述玻璃的内表面; 传感器测量户外或室内条件,并将实时测量数据发送到控制单元。 控制单元连接到直流电源,可以控制电致变色薄膜器件的直流电源的输出电压。 本发明可以实时智能地调节玻璃的颜色,这有助于节省能源并减少温室气体的排放。

    Subsequent association identifier (AID) update within single user, multiple user, multiple access, and/or MIMO wireless communications
    16.
    发明申请
    Subsequent association identifier (AID) update within single user, multiple user, multiple access, and/or MIMO wireless communications 有权
    在单用户,多用户,多访问和/或MIMO无线通信中的后续关联标识符(AID)更新

    公开(公告)号:US20130142184A1

    公开(公告)日:2013-06-06

    申请号:US13563064

    申请日:2012-07-31

    申请人: Qi Wang

    发明人: Qi Wang

    IPC分类号: H04W84/12

    摘要: Subsequent association identifier (AID) update within single user, multiple user, multiple access, and/or MIMO wireless communications. Even while a given communication device maintains continuous association within a given communication system, a unique identifier associated with that particular communication device may be updated. For example, considering and implementation including an access point (AP) and a number of wireless stations (STAs), even while at least some of the STAs remain in association with the AP, the respective unique identifiers associated with one or more of those STAs may be updated (e.g., the respective AID values associated with one or more of those STAs may be updated). For example, after an initial assignment of unique identifiers associated with a group of respective communication devices within the communication network, the unique identifier associated with one or more of those respective communication devices may be updated or changed after the initial assignment.

    摘要翻译: 在单用户,多用户,多访问和/或MIMO无线通信中的后续关联标识符(AID)更新。 即使在给定通信设备在给定的通信系统内保持连续关联的情况下,也可以更新与该特定通信设备相关联的唯一标识符。 例如,即使在至少一些STA保持与AP相关联的情况下,包括接入点(AP)和多个无线站(STA)的考虑和实现,与这些STA中的一个或多个相关联的相应的唯一标识符 可以被更新(例如,可以更新与这些STA中的一个或多个相关联的各个AID值)。 例如,在与通信网络中的各个通信设备的组相关联的唯一标识符的初始分配之后,可以在初始分配之后更新或改变与这些相应通信设备中的一个或多个相关联的唯一标识符。

    Rapid thermal processing by stamping
    17.
    发明授权
    Rapid thermal processing by stamping 有权
    快速热处理冲压

    公开(公告)号:US08389422B2

    公开(公告)日:2013-03-05

    申请号:US12675117

    申请日:2007-08-31

    IPC分类号: H01L21/00

    摘要: A rapid thermal processing device and methods are provided for thermal processing of samples such as semiconductor wafers. The device has components including a stamp (35) having a stamping surface and a heater or cooler (40) to bring it to a selected processing temperature, a sample holder (20) for holding a sample (10) in position for intimate contact with the stamping surface; and positioning components (25) for moving the stamping surface and the stamp (35) in and away from intimate, substantially non-pressured contact. Methods for using and making such devices are also provided. These devices and methods allow inexpensive, efficient, easily controllable thermal processing.

    摘要翻译: 提供快速热处理装置和方法用于诸如半导体晶片的样品的热处理。 该装置具有包括具有冲压表面的印模(35)和使其处于选定的处理温度的加热器或冷却器(40)的部件,用于将样品(10)保持在适当位置的样品保持器(20),以便与 冲压表面; 以及用于将冲压表面和印模(35)移动到和远离紧密的基本上无压力的接触件的定位部件(25)。 还提供了使用和制造这些装置的方法。 这些装置和方法允许廉价,有效,易于控制的热处理。

    SYSTEM AND METHOD FOR PROVIDING A MESSAGE AND AN EVENT BASED VIDEO SERVICES CONTROL PLANE
    18.
    发明申请
    SYSTEM AND METHOD FOR PROVIDING A MESSAGE AND AN EVENT BASED VIDEO SERVICES CONTROL PLANE 审中-公开
    提供基于消息和事件的视频服务控制平面的系统和方法

    公开(公告)号:US20130013704A1

    公开(公告)日:2013-01-10

    申请号:US13543620

    申请日:2012-07-06

    IPC分类号: G06F15/16

    摘要: A method is provided in one example embodiment and includes establishing a connection between a client and a messaging fabric of a conductor element associated with a video system and authenticating the client (e.g., involving a plurality of device credentials associated with the device). The method also includes assigning a name to identify a device associated with the client; updating a client directory with the name and a device status associated with the device; and establishing a service connection to the conductor element to enable message exchanges with the device. The service connection establishes an Extensible Messaging and Presence Protocol (XMPP)-based service.

    摘要翻译: 在一个示例性实施例中提供了一种方法,并且包括在客户机和与视频系统相关联的导体元件的消息传送结构之间建立连接并认证客户端(例如,涉及与设备相关联的多个设备凭证)。 该方法还包括分配名称以识别与客户端相关联的设备; 使用与设备相关联的名称和设备状态来更新客户端目录; 以及建立到所述导体元件的服务连接以使得能够与所述设备进行消息交换。 服务连接建立了基于可扩展消息传递和存在协议(XMPP)的服务。

    Method and structure for dividing a substrate into individual devices
    19.
    发明授权
    Method and structure for dividing a substrate into individual devices 有权
    将基板分割为各个装置的方法和结构

    公开(公告)号:US08343852B2

    公开(公告)日:2013-01-01

    申请号:US13095584

    申请日:2011-04-27

    IPC分类号: H01L21/00

    CPC分类号: H01L21/78

    摘要: A method for obtaining individual dies from a semiconductor structure is disclosed. The semiconductor structure includes a device layer, and the device layer in turn includes active regions separated by predefined spacings. Thick metal is selectively formed on backside of the device layer such that thick metal is formed on backside of active regions but not on backside of the predefined spacings. The semiconductor structure is then cut along the predefined spacings to separate the active regions with thick metal on their backside into individual dies.

    摘要翻译: 公开了一种从半导体结构获得单个管芯的方法。 半导体结构包括器件层,器件层又包括由预定间隔隔开的有源区。 在器件层的背侧选择性地形成厚金属,使得在有源区的背面形成厚金属,而不在预定间隔的背面形成厚金属。 然后沿着预定的间隔切割半导体结构,以将其背面的厚金属的活性区域分离成单独的管芯。