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29 条记录 (耗时 0.039 秒)

    Thermal transfer device and system and method incorporating same
    12.
    发明授权
    Thermal transfer device and system and method incorporating same 失效
    热转印装置及其组合方法

    公开(公告)号：US07805950B2

    公开(公告)日：2010-10-05

    申请号：US11925396

    申请日：2007-10-26

    申请人： Stanton Earl Weaver, Jr.

    发明人： Stanton Earl Weaver, Jr.

    IPC分类号： F25B21/02 ,  F25B21/00 ,  H01L35/28

    CPC分类号： F25B21/00 ,  F25B2321/003 ,  Y02B30/66 ,  Y10T29/49147

    摘要： A thermal transfer device having a first substrate layer, a second substrate layer and first and second electrodes disposed between the first substrate layer and the second substrate layer. The thermal transfer device also includes a release layer disposed between the first electrode and the second electrode and an actuator disposed adjacent the first and second electrodes. The actuator is adapted to separate the first and second electrodes from the release layer to open a thermotunneling gap between the first and second electrodes, and wherein the actuator is adapted to actively control the thermotunneling gap.

    摘要翻译： 一种热转印装置，具有第一基底层，第二基底层和设置在第一基底层和第二基底层之间的第一和第二电极。 热转印装置还包括设置在第一电极和第二电极之间的释放层和邻近第一和第二电极设置的致动器。 致动器适于将第一和第二电极与释放层分开以打开第一和第二电极之间的热电穿孔间隙，并且其中致动器适于主动地控制热电穿孔间隙。

    LOW WORK FUNCTION ELECTRICAL COMPONENT
    13.
    发明申请
    LOW WORK FUNCTION ELECTRICAL COMPONENT 审中-公开
    低功能电气元件

    公开(公告)号：US20100018843A1

    公开(公告)日：2010-01-28

    申请号：US12179263

    申请日：2008-07-24

    申请人： Marco Francesco Aimi ,  Stanton Earl Weaver, Jr. ,  Sudhakar Eddula Reddy ,  Om Prakash ,  Ertugrul Berkcan

    发明人： Marco Francesco Aimi ,  Stanton Earl Weaver, Jr. ,  Sudhakar Eddula Reddy ,  Om Prakash ,  Ertugrul Berkcan

    IPC分类号： H01H57/00

    CPC分类号： H01H59/0009 ,  H01H2001/0052

    摘要： An electrical component is disclosed. The electrical component includes at least two electrical contacts movable relative to each other between an open position and a closed position, wherein at least one of the electrical contacts includes a material having a work function that is less than about 3.5 eV, and wherein the distance between the electrical contacts, in the closed position, is greater than 0 nm and up to about 30 nm. A device including a plurality of electrical switches is also disclosed.

    摘要翻译： 公开了电气部件。 电气部件包括在打开位置和关闭位置之间相对于彼此可移动的至少两个电触点，其中至少一个电触点包括具有小于约3.5eV的功函数的材料，并且其中， 在闭合位置之间的电触点之间大于0nm且高达约30nm。 还公开了一种包括多个电开关的装置。

    Two-stage valve suitable as high-flow high-pressure microvalve
    14.
    发明授权
    Two-stage valve suitable as high-flow high-pressure microvalve 失效
    两级阀适用于高流量高压微型阀

    公开(公告)号：US06830229B2

    公开(公告)日：2004-12-14

    申请号：US10376150

    申请日：2003-02-28

    申请人： Todd Garrett Wetzel ,  Mathew Christian Nielsen ,  Stanton Earl Weaver, Jr. ,  Renato Guida ,  James Wilson Rose ,  Laura Jean Meyer

    发明人： Todd Garrett Wetzel ,  Mathew Christian Nielsen ,  Stanton Earl Weaver, Jr. ,  Renato Guida ,  James Wilson Rose ,  Laura Jean Meyer

    IPC分类号： F16K3112

    CPC分类号： F15C5/00 ,  F16K31/402 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0048 ,  F16K99/0059 ,  Y10T137/87209

    摘要： A two-stage valve for controlling the flow of fluid from a pressurized fluid supply with an upper main body including a cavity with a contoured inner surface; a lower main body with at least one flow exhaust passage forming a primary flow path through the two-stage valve; a pre-stressed diaphragm sandwiched between the upper and lower main bodies, and pressure control capability for controlling the pressure in the cavity. A first valve opens and closes the flow of gas from the pressurized gas supply to the cavity. A second valve allows the pressure in the cavity to exhaust to the environment. Raising and lowering of the pressure in the cavity causes the pre-stressed diaphragm to open and close the flow of gas from the pressurized gas supply through the primary flow path of the two-stage valve. The design is suitable as a microvalve using Micro-Electro-Mechanical Systems (MEMS) concepts.

    摘要翻译： 一种用于控制来自加压流体供应源的流体流动的两级阀，其中上部主体包括具有轮廓内表面的空腔; 具有形成通过所述两级阀的主流路的至少一个流动排气通道的下主体; 夹在上下主体之间的预应力隔膜和用于控制空腔中的压力的​​压力控制能力。 第一阀打开并关闭气体从加压气体供给到空腔的流动。 第二个阀允许空腔中的压力排放到环境中。 升高和降低空腔中的压力导致预应力隔膜打开和关闭来自加压气体供应通过两级阀的主流路的气体流。 该设计适用于使用微机电系统（MEMS）概念的微型阀。

    Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip
    16.
    发明授权
    Support with recessed electrically conductive chip attachment material for flip-chip bonding a light emitting chip 失效
    支持嵌入式导电芯片附件材料，用于倒装芯片接合发光芯片

    公开(公告)号：US07635869B2

    公开(公告)日：2009-12-22

    申请号：US11520905

    申请日：2006-09-14

    申请人： Boris Kolodin ,  Michael Hsing ,  Stanton Earl Weaver, Jr. ,  Ivan Eliashevich ,  Srinath K. Aanegola

    发明人： Boris Kolodin ,  Michael Hsing ,  Stanton Earl Weaver, Jr. ,  Ivan Eliashevich ,  Srinath K. Aanegola

    IPC分类号： H01L33/00

    CPC分类号： H01L33/483 ,  H01L33/62 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00

    摘要： In a light emitting device, a light emitting chip (12, 112) includes a stack of semiconductor layers (14) and an electrode (24, 141, 142) disposed on the stack of semiconductor layers. A support (10, 10′, 110, 210) has a generally planar surface (30) supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material (40, 41, 141, 142) is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (36, 36′) of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.

    摘要翻译： 在发光器件中，发光芯片（12,112）包括堆叠的半导体层（14）和设置在半导体层堆叠上的电极（24,141,142）。 支撑件（10,10'，110,210）具有以倒装芯片方式支撑发光芯片的大致平坦的表面（30）。 导电芯片附接材料（40,41,141,142）凹入到支撑件的大致平坦的表面中，使得附接材料基本不突出在支撑体的大致平坦的表面上方。 附着材料提供发光芯片的电极与支撑体的导电路径（36,36'）之间的电连通。 可选地，至少半导体层的叠层和发光芯片的电极也凹入到支撑体的大致平坦的表面中。

    Method of making devices for solid state thermal transfer and power generation
    17.
    发明授权
    Method of making devices for solid state thermal transfer and power generation 有权
    制造固态热转印和发电装置的方法

    公开(公告)号：US07572973B2

    公开(公告)日：2009-08-11

    申请号：US12328788

    申请日：2008-12-05

    申请人： Stanton Earl Weaver, Jr. ,  Robert John Wojnarowski

    发明人： Stanton Earl Weaver, Jr. ,  Robert John Wojnarowski

    IPC分类号： H01L35/34 ,  H02N10/00

    CPC分类号： H01L35/32 ,  Y10T156/1092

    摘要： A method of making a solid state thermal transfer device includes first and second electrically conductive substrates that are positioned opposite from one another. The solid state thermal transfer device also includes a sealing layer disposed between the first and second electrically conductive substrates and a plurality of hollow structures having a conductive material, wherein the plurality of hollow structures is contained by the sealing layer between the first and second electrically conductive substrates.

    摘要翻译： 制造固态热转印装置的方法包括彼此相对定位的第一和第二导电基板。 固态热转移装置还包括设置在第一和第二导电基板之间的密封层和具有导电材料的多个中空结构，其中多个中空结构由第一和第二导电 底物。

    Led lighting system with reflective board
    19.
    发明授权
    Led lighting system with reflective board 有权
    带反光板的LED照明系统

    公开(公告)号：US07201497B2

    公开(公告)日：2007-04-10

    申请号：US10891722

    申请日：2004-07-15

    申请人： Stanton Earl Weaver, Jr. ,  Thomas Elliot Stecher

    发明人： Stanton Earl Weaver, Jr. ,  Thomas Elliot Stecher

    IPC分类号： F21V7/00

    CPC分类号： H05K1/181 ,  F21K9/00 ,  H01L25/0753 ,  H01L2924/0002 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02292 ,  H01S5/4025 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/2054 ,  Y02P70/611 ,  Y10S362/80 ,  H01L2924/00

    摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.

    摘要翻译： 发光装置（8）包括设置在印刷电路板（12）上的一个或多个发光芯片（10），并且发射主要在约400纳米至约470纳米的波长范围内。 印刷电路板包括：（i）电绝缘板（14）; （ii）导电印刷电路（20）; 和（iii）具有通孔（24）的电绝缘的焊接掩模（22），所述一个或多个发光芯片通过该通孔与印刷电路电接触。 焊料掩模（22）具有大于60％的反射率，至少在约400纳米和约470纳米之间。

    Light emitting diode apparatuses with heat pipes for thermal management
    20.
    发明授权
    Light emitting diode apparatuses with heat pipes for thermal management 有权
    具有用于热管理的热管的发光二极管装置

    公开(公告)号：US07095110B2

    公开(公告)日：2006-08-22

    申请号：US10851273

    申请日：2004-05-21

    申请人： Mehmet Arik ,  Stanton Earl Weaver, Jr. ,  Charles Becker

    发明人： Mehmet Arik ,  Stanton Earl Weaver, Jr. ,  Charles Becker

    IPC分类号： H01L23/10

    CPC分类号： F21V29/51 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/648 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

    摘要翻译： 发光设备（10,110,210,310,410）包括设置在芯片支撑壁（16,116,216）上的一个或多个发光二极管芯片（12,112,212,312,412），其包括印刷电路 （34,134,234,360,362,460,462），与发光二极管芯片连接。 热管（24,124,224,324,424）具有由包括芯片支撑壁和至少一个附加壁（18,20,28）的壁限定的密封体积（22,122,222,322,422） 120,218）。 热管还包括设置在密封体积中的传热流体（26,226,326,426）。