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    Continuous lamination of electronic structures
    13.
    发明授权
    Continuous lamination of electronic structures 失效
    电子结构的连续层压

    公开(公告)号：US5705022A

    公开(公告)日：1998-01-06

    申请号：US482209

    申请日：1995-06-08

    申请人： David Andrew Lewis ,  Alfred Viehbeck ,  Stanley Joseph Whitehair

    发明人： David Andrew Lewis ,  Alfred Viehbeck ,  Stanley Joseph Whitehair

    IPC分类号： H05B6/70 ,  H05B6/78 ,  H05K3/02 ,  B32B31/20

    CPC分类号： H05K3/022 ,  B32B37/06 ,  H05B6/70 ,  H05B6/788 ,  B32B2309/06 ,  B32B2310/0862 ,  B32B2457/08 ,  Y10T156/1741

    摘要： A continuous process for the fabrication of metal clad, laminated core structures, such as circuit board cores, wherein the copper layers on the laminate are used to form a waveguide which propagates microwave or RF radiation in TEM mode down the length of the structure for heating the core layers while the necessary pressure is applied. The TEM mode offers substantial advantages in the uniformity and control of processing in this environment. In particular, the system may be made tunable using the positioning or two pinch points, produced by rollers applying pressure to consolidate the layered material, which points create end chokes defining a heating and pressure region wherein the radiation is reflected. Alternatively, the metal layers may also be used as capacitor-like plates for applying RF energy across the layered material.

    摘要翻译： 用于制造金属包覆层压芯结构（例如电路板芯）的连续方法，其中层压体上的铜层用于形成在TEM模式下沿着加热结构的长度传播微波或RF辐射的波导 核心层，同时施加必要的压力。 TEM模式在该环境中的均匀性和加工控制方面提供了显着的优点。 特别地，可以使用由施加压力的辊产生的定位或两个夹点来使该系统可调谐，以固结分层材料，该点产生限定辐射被反射的加热和压力区域的端扼流圈。 或者，金属层也可以用作电容器样板，用于跨层状材料施加RF能量。

    Methods of fabrication of coaxial vias and magnetic devices
    15.
    发明授权
    Methods of fabrication of coaxial vias and magnetic devices 失效
    同轴通孔和磁性器件的制造方法

    公开(公告)号：US5898991A

    公开(公告)日：1999-05-04

    申请号：US783738

    申请日：1997-01-16

    申请人： Keith Edward Fogel ,  Jeffrey Curtis Hedrick ,  David Andrew Lewis ,  Eva E. Simonyi ,  Alfred Viehbeck ,  Stanley Joseph Whitehair

    发明人： Keith Edward Fogel ,  Jeffrey Curtis Hedrick ,  David Andrew Lewis ,  Eva E. Simonyi ,  Alfred Viehbeck ,  Stanley Joseph Whitehair

    IPC分类号： H01F27/28 ,  H01F41/04 ,  H05K3/40 ,  H05K3/44 ,  H01F7/06

    CPC分类号： H01F41/046 ,  H01F27/2804 ,  H05K3/445 ,  H05K2201/09881 ,  H05K3/4046 ,  Y10T29/4902

    摘要： Methods are described for fabricating devices having vias containing more than one electrical conductor, in particular coaxial electrical conductors. A plurality of wires are bonded to a first substrate, such as a copper wire to a copper substrate. A second substrate having through-holes with side walls covered with an electrical conductor is disposed over the first substrate so that the wires are within the through-holes and spaced apart from the side walls. The first substrate is spaced apart from the second substrate by dielectric spacers. A polymer is injected into the space between the first and second substrates to provide electrical isolation therebetween. A polymer is injected into the space in the via between the elongated conductors and the conductive sidewall to provide dielectric isolation therebetween. The second substrate has electrically conductive pattern on both sides which are electrically interconnected by the electrically conductive sidewall to form an inner coil of electrical conductors. The first substrate is patterned to form an electrical conductive pattern. A pattern of electrical conductors is formed on the dielectric material on the side of the second substrate opposite the patterned first substrate and is electrically connected therewith through the elongated conductors on the through-hole to form an outer coil of electrical conductors around the inner coil of electrical conductors to from a transformer or an inductor.

    摘要翻译： 描述了用于制造具有包含多于一个电导体，特别是同轴电导体的通孔的器件的方法。 多根导线被接合到诸如铜线的第一基底到铜基底上。 具有覆盖有电导体的侧壁的通孔的第二基板设置在第一基板上，使得电线在通孔内并与侧壁间隔开。 第一衬底通过介电间隔物与第二衬底间隔开。 将聚合物注入到第一和第二基板之间的空间中以在它们之间提供电隔离。 将聚合物注入到细长导体和导电侧壁之间的通孔中的空间中，以在它们之间提供电介质隔离。 第二衬底在两侧上具有导电图案，其通过导电侧壁电互连以形成电导体的内部线圈。 图案化第一衬底以形成导电图案。 在第二基板的与图案化的第一基板相对的一侧上的电介质材料上形成电导体的图案，并且通过通孔上的细长导体与其电连接，以形成围绕内部线圈的电导体的外部线圈 电导体来自变压器或电感器。