公开(公告)号：US6136733A

公开(公告)日：2000-10-24

申请号：US874902

申请日：1997-06-13

申请人： Lawrence Robert Blumberg ,  Robert Maynard Japp ,  William John Rudik ,  John Frank Surowka

发明人： Lawrence Robert Blumberg ,  Robert Maynard Japp ,  William John Rudik ,  John Frank Surowka

IPC分类号： B32B5/28 ,  H05K1/03 ,  B32B5/26 ,  C09J5/02

CPC分类号： B32B5/28 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10T29/4913

摘要： A simple, inexpensive, drillable, reduced CTE laminate and circuitized structures comprising the reduced CTE laminate, is provided. The reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0.05% to 0.3%, preferably from about 0.08% to 0.10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The present invention also generally relates to a method for reducing the CTE of circuitized structures, and to methods for making reduced CTE laminate and circuitized structures comprising reduced CTE laminate. The method for making reduced CTE laminate and laminate structures comprises the following steps: providing non-woven quartz mat; providing a prepreg, preferably B-stage cured to not more than about 40%, preferably not more than 30% of full cure; sandwiching the non-woven quartz mat between two layers of prepreg, and reflowing the resin of the prepreg into the quartz mat. Optionally, the reduced CTE laminate is sandwiched between two layers of metal, preferably copper.

摘要翻译： 提供了一种简单，便宜，可钻，减少的CTE层压板和包括减小的CTE层压板的电路结构。 减少的CTE层压材料包括：约40％至75％，优选约55％至65％的树脂; 约0.05％至0.3％，优选约0.08％至0.10％的固化剂; 约25％至60％，优选约30％至40％的织布; 约1％至15％，优选约5％至10％体积的无纺石英垫。 本发明还通常涉及一种用于减小电路化结构的CTE的方法，以及用于制造减少的CTE层压体和包括减少的CTE层压体的电路化结构的方法。 制造减薄的CTE层压板和层压结构的方法包括以下步骤：提供无纺石英垫; 提供预浸料，优选B阶固化至不超过完全固化的约40％，优选不超过30％; 将无纺石英垫夹在两层预浸料之间，并将预浸料坯的树脂回流到石英垫中。 任选地，还原的CTE层压体夹在两层金属之间，优选为铜。

公开(公告)号：US5858461A

公开(公告)日：1999-01-12

申请号：US891629

申请日：1997-07-09

申请人： Bernd Karl Appelt ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  William John Rudik

发明人： Bernd Karl Appelt ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  William John Rudik

IPC分类号： B29B15/12 ,  B29C70/08 ,  B29C70/22 ,  B32B15/14 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/48 ,  C08J3/24 ,  C08J5/04 ,  D06N7/00 ,  H01L23/498 ,  H05K1/03 ,  H05K3/02 ,  B32B31/08 ,  B32B7/00

CPC分类号： H05K1/0366 ,  B29B15/125 ,  B29C70/086 ,  B29C70/088 ,  B29C70/22 ,  B32B15/14 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/48 ,  C08J3/243 ,  H01L23/49894 ,  B29C2791/001 ,  B29K2063/00 ,  B29K2105/0809 ,  B29K2105/24 ,  B29K2105/243 ,  B29K2705/00 ,  B29L2009/00 ,  C08J2363/00 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/029 ,  H05K3/022 ,  Y10S428/901 ,  Y10T428/2857 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/131 ,  Y10T442/2025 ,  Y10T442/2041 ,  Y10T442/2057 ,  Y10T442/2098

摘要： A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture as well as most of the interstices or openings, although some of the interstices or openings have holes where the coating does not completely fill in. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in any holes in the first coating. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets. This substantially reduces pinholing.

公开(公告)号：US5756405A

公开(公告)日：1998-05-26

申请号：US716814

申请日：1996-09-10

申请人： Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

发明人： Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

IPC分类号： B29B15/12 ,  B29C70/22 ,  B29C70/54 ,  B32B15/04 ,  B32B27/04 ,  B32B27/38 ,  B32B37/00 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/50 ,  C08J3/24 ,  C08J5/04 ,  C08J5/24 ,  D06N7/00 ,  H01L23/498 ,  H05K1/03 ,  H05K3/02 ,  B32B31/08 ,  B32B7/00

CPC分类号： B32B37/0038 ,  B29B15/125 ,  B29C70/22 ,  B29C70/543 ,  B32B15/04 ,  B32B27/04 ,  B32B27/38 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/50 ,  C08J3/243 ,  C08J3/244 ,  C08J3/245 ,  C08J5/24 ,  H01L23/49894 ,  H05K1/0366 ,  B29K2063/00 ,  B29L2031/3425 ,  B32B2305/18 ,  B32B2311/12 ,  B32B2457/08 ,  C08J2363/00 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/029 ,  H05K3/022 ,  Y10S428/901 ,  Y10T428/2857 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/131 ,  Y10T442/2025 ,  Y10T442/2041 ,  Y10T442/2057 ,  Y10T442/2098 ,  Y10T442/2738

摘要： A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture while maintaining the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets. During lamination, the first coating acts like an impenetrable insulating sheet, preventing resin displacement and, therefore, preventing glass fiber contact with the conductive planes. The second coating is fluid enough to fill in spaces in the planes and to form the adhesive bond to cores and conductive layers.

公开(公告)号：US06351030B2

公开(公告)日：2002-02-26

申请号：US09276596

申请日：1999-03-25

申请人： Ross Downey Havens ,  Robert Maynard Japp ,  Jeffrey Alan Knight ,  Mark David Poliks ,  Anne M. Quinn

发明人： Ross Downey Havens ,  Robert Maynard Japp ,  Jeffrey Alan Knight ,  Mark David Poliks ,  Anne M. Quinn

IPC分类号： H01L2328

CPC分类号： H01L21/56 ,  H01L23/3107 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention is a method of providing a protective covering on an electronic package including a first circuitized substrate, a semiconductor chip positioned on and electrically coupled to the first substrate, and a plurality of conductors also on the substrate for electrically connecting the substrate to an external circuitized substrate. In one version, the method comprises covering substantially all of the external surfaces of the substrate, the semiconductor chip and a portion of the plurality of conductors with a protective covering from immersion in a dielectric solution (e.g., TEFLON AF). The coatings can also be applied by brushing, spraying, or chemical vapor deposition. In an alternative embodiment, all of the external surfaces, including all of the conductors, are coated with the protective covering (e.g., to facilitate package shipment or other handling). The resulting electronic packages are also described herein.

摘要翻译： 本发明是一种在电子封装上提供保护覆盖物的方法，该电子封装包括第一电路化基板，位于第一基板上并与之电耦合的半导体芯片，以及还在基板上的多个导体，用于将基板电连接到 外部电路化基板。 在一个版本中，该方法包括用保护覆盖物基本上覆盖衬底，半导体芯片和多个导体的一部分的外表面，以浸没在电介质溶液（例如，TEFLON AF）中。 也可以通过刷涂，喷涂或化学气相沉积来涂覆涂层。 在替代实施例中，包括所有导体的所有外表面都涂覆有保护覆盖物（例如，以便于包装运输或其他处理）。 所得到的电子封装也在此描述。

公开(公告)号：US5919525A

公开(公告)日：1999-07-06

申请号：US890196

申请日：1997-07-09

申请人： Bernd Karl Appelt ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  William John Rudik

发明人： Bernd Karl Appelt ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  William John Rudik

IPC分类号： B29B15/12 ,  B29C70/08 ,  B32B15/14 ,  B32B37/00 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C08J3/24 ,  C08J5/04 ,  D06N7/00 ,  H01L23/14 ,  H01L23/498 ,  H05K1/03 ,  H05K3/02 ,  B32B31/08 ,  B32B7/00

CPC分类号： B32B37/0038 ,  B29B15/125 ,  B29C70/08 ,  B32B15/14 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C08J3/243 ,  D06N7/0094 ,  H01L23/145 ,  H01L23/49894 ,  H05K1/0366 ,  B29K2063/00 ,  B29K2101/10 ,  B29K2105/256 ,  C08J2363/00 ,  D06N2201/082 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/029 ,  H05K3/022 ,  Y10S428/902 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/131 ,  Y10T442/2041 ,  Y10T442/2057 ,  Y10T442/2098

摘要： A method and resultant article are provided which optimize the adhesion of resin to the glass fibers in fiberglass cloth impregnated with a resin and also optimize the adhesion of the impregnated resin to metal sheets laminated to the resin-impregnated cloth. The fiberglass is treated in two or more passes. On the first pass, the fiberglass is impregnated with a first resin which is optimized for adherence to glass fibers and the coated resin is partially cured. In a last pass, the fiberglass is impregnated with a second resin, which is different from said first resin, and is optimized for bonding to metal. The second resin is then partially cured. The first and second resins are selected such that they form a bond with each other when cured.

摘要翻译： 提供一种方法和所得制品，其优化树脂与浸渍有树脂的玻璃纤维布中的玻璃纤维的粘附性，并且还优化浸渍树脂与层压在树脂浸渍布上的金属片的粘合性。 玻璃纤维在两次以上通过处理。 在第一次通过时，玻璃纤维被浸渍有第一树脂，其优化用于粘附到玻璃纤维上，并且涂覆的树脂被部分固化。 在最后一次通过中，玻璃纤维被浸渍有不同于所述第一树脂的第二树脂，并且被优化用于与金属粘结。 然后将第二树脂部分固化。 选择第一和第二树脂使得它们在固化时彼此形成结合。

公开(公告)号：US5900675A

公开(公告)日：1999-05-04

申请号：US840518

申请日：1997-04-21

申请人： Bernd Karl-Heinz Appelt ,  Donald Seton Farquhar ,  Robert Maynard Japp ,  Konstantinos I. Papathomas

发明人： Bernd Karl-Heinz Appelt ,  Donald Seton Farquhar ,  Robert Maynard Japp ,  Konstantinos I. Papathomas

IPC分类号： H01L23/13 ,  H01L23/14 ,  H01L23/48

CPC分类号： H01L23/142 ,  H01L23/13 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181

摘要： An integrated circuit chip package with an integrated chip carrier having differing coefficients of thermal expansion (CTE) in the x-y plane. The chip carrier is comprised of two main regions. The first is a core region having a CTE approximately equal to that of the semiconductor chip CTE. This core region also has approximately the same dimensions in the x-y plane as the semiconductor chip. The chip is mounted just above this core region. The second region is a peripheral region which surrounds the core region in the x-y plane. This second region has a CTE approximately equal to that of the printed circuit board CTE. During thermal cycling, the materials expand and contract. The core region expands at nearly the same rate as the chip and the area outside the chip footprint, the peripheral region, expands at a rate similar to that of the printed circuit board. This characteristic prevents thermal stress-induced fatigue on the package components and solder joints.

摘要翻译： 具有在x-y平面上具有不同热膨胀系数（CTE）的集成芯片载体的集成电路芯片封装。 芯片载体由两个主要区域组成。 第一个是具有大约等于半导体芯片CTE的CTE的核心区域。 该芯区域在半导体芯片的x-y平面上也具有大致相同的尺寸。 芯片安装在该核心区域的正上方。 第二区域是围绕x-y平面中的芯区域的周边区域。 该第二区域的CTE大致等于印刷电路板CTE的CTE。 在热循环过程中，物料膨胀和收缩。 核心区域以与芯片和芯片占用面积以外的面积几乎相同的速率扩展，周边区域以与印刷电路板类似的速率扩展。 该特性可防止封装部件和焊点发生热应力引起的疲劳。

公开(公告)号：US5783252A

公开(公告)日：1998-07-21

申请号：US890090

申请日：1997-07-09

申请人： Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

发明人： Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

IPC分类号： B29B15/12 ,  B29C70/22 ,  B29C70/54 ,  B32B15/04 ,  B32B27/04 ,  B32B27/38 ,  B32B37/00 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/50 ,  C08J3/24 ,  C08J5/04 ,  C08J5/24 ,  D06N7/00 ,  H01L23/498 ,  H05K1/03 ,  H05K3/02 ,  B05D3/02

CPC分类号： B32B37/0038 ,  B29B15/125 ,  B29C70/22 ,  B29C70/543 ,  B32B15/04 ,  B32B27/04 ,  B32B27/38 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/50 ,  C08J3/243 ,  C08J3/244 ,  C08J3/245 ,  C08J5/24 ,  H01L23/49894 ,  H05K1/0366 ,  B29K2063/00 ,  B29L2031/3425 ,  B32B2305/18 ,  B32B2311/12 ,  B32B2457/08 ,  C08J2363/00 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/029 ,  H05K3/022 ,  Y10S428/901 ,  Y10T428/2857 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/131 ,  Y10T442/2025 ,  Y10T442/2041 ,  Y10T442/2057 ,  Y10T442/2098 ,  Y10T442/2738

摘要： A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture while maintaining the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets. During lamination, the first coating acts like an impenetrable insulating sheet, preventing resin displacement and, therefore, preventing glass fiber contact with the conductive planes. The second coating is fluid enough to fill in spaces in the planes and to form the adhesive bond to cores and conductive layers.

公开(公告)号：US5719090A

公开(公告)日：1998-02-17

申请号：US716815

申请日：1996-09-10

申请人： Bernd Karl Appelt ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  William John Rudik

发明人： Bernd Karl Appelt ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  William John Rudik

IPC分类号： B29B15/12 ,  B29C70/08 ,  B29C70/22 ,  B32B15/14 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/48 ,  C08J3/24 ,  C08J5/04 ,  D06N7/00 ,  H01L23/498 ,  H05K1/03 ,  H05K3/02 ,  B32B31/08 ,  B32B7/00

CPC分类号： H05K1/0366 ,  B29B15/125 ,  B29C70/086 ,  B29C70/088 ,  B29C70/22 ,  B32B15/14 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/48 ,  C08J3/243 ,  H01L23/49894 ,  B29C2791/001 ,  B29K2063/00 ,  B29K2105/0809 ,  B29K2105/24 ,  B29K2105/243 ,  B29K2705/00 ,  B29L2009/00 ,  C08J2363/00 ,  H01L2924/0002 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/029 ,  H05K3/022 ,  Y10S428/901 ,  Y10T428/2857 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/131 ,  Y10T442/2025 ,  Y10T442/2041 ,  Y10T442/2057 ,  Y10T442/2098

摘要： A method for coating cloth especially fiberglass sheets with a resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin solvent mixture as well as most of the interstices or openings, although some of the interstices or openings have holes where the coating does not completely fill in. This first coating is then partially cured to the extent that it will not redissolve in a second coating of the same resin solution. The coated fiberglass with partially cured resin thereon is then given a second coating of the same resin mixture which coats the first coating and fills in any holes in the first coating. This second coating is then partially cured, which advances the cure of the first coating and results in an impregnated fiberglass cloth structure for use as sticker sheets. This substantially reduces pinholing.

摘要翻译： 提供了一种用于涂布特别是具有树脂和结构的玻璃纤维板的布的方法。 涂层分两步进行。 在第一步中，基本上玻璃纤维的所有股线都涂覆有树脂溶剂混合物以及大部分间隙或开口，尽管一些间隙或开口具有不完全填充涂层的孔。 然后将涂层部分固化至其不会再溶解在相同树脂溶液的第二涂层中的程度。 然后对其上具有部分固化的树脂的涂覆的玻璃纤维施加相同树脂混合物的第二涂层，其涂覆第一涂层并填充第一涂层中的任何孔。 然后将该第二涂层部分固化，这促进了第一涂层的固化，并产生用作粘贴片的浸渍玻璃纤维布结构。 这大大减少了针孔。

公开(公告)号：US06387830B1

公开(公告)日：2002-05-14

申请号：US09265210

申请日：1999-03-10

申请人： Lawrence Robert Blumberg ,  Robert Maynard Japp ,  William John Rudik ,  John Frank Surowka

发明人： Lawrence Robert Blumberg ,  Robert Maynard Japp ,  William John Rudik ,  John Frank Surowka

IPC分类号： B32B526

CPC分类号： B32B5/26 ,  B32B5/02 ,  B32B5/28 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/20 ,  B32B2553/00 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10T29/4913 ,  Y10T442/2361 ,  Y10T442/2992 ,  Y10T442/3537 ,  Y10T442/3569 ,  Y10T442/3577 ,  Y10T442/3585 ,  Y10T442/3602 ,  Y10T442/3659

摘要： A simple, inexpensive, drillable, reduced CTE laminate and circuitized structures comprising the reduced CTE laminate, is provided. The reduced CTE laminate comprises: from about 40% to 75%, preferably from about 55% to 65%, by weight resin; from about 0.05% to 0.3%, preferably from about 0.08% to 0.10%, by weight curing agent; from about 25% to 60%, preferably from about 30% to 40%, by weight, woven cloth; from about 1% to 15%, preferably from about 5% to 10%, by volume, non-woven quartz mat. The present invention also generally relates to a method for reducing the CTE of circuitized structures, and to methods for making reduced CTE laminate and circuitized structures comprising reduced CTE laminate. The method for making reduced CTE laminate and laminate structures comprises the following steps: providing non-woven quartz mat; providing a prepreg, preferably not B-stage cured to not more than about 40%, preferably not more than 30% of full cure; sandwiching the non-woven quartz mat between two layers of prepreg, and reflowing the resin of the prepreg into the quartz mat. Optionally, the reduced CTE laminate is sandwiched between two layers of metal, preferably copper.

摘要翻译： 提供了一种简单，便宜，可钻，减少的CTE层压板和包括减小的CTE层压板的电路结构。 减少的CTE层压材料包括：约40％至75％，优选约55％至65％的树脂; 约0.05％至0.3％，优选约0.08％至0.10％的固化剂; 约25％至60％，优选约30％至40％的织布; 约1％至15％，优选约5％至10％体积的无纺石英垫。 本发明还通常涉及一种用于减小电路化结构的CTE的方法，以及用于制造减少的CTE层压体和包括减少的CTE层压体的电路化结构的方法。 制造减薄的CTE层压板和层压结构的方法包括以下步骤：提供无纺石英垫; 提供预浸料，优选不B阶固化至不超过完全固化的约40％，优选不超过30％; 将无纺石英垫夹在两层预浸料之间，并将预浸料坯的树脂回流到石英垫中。 任选地，还原的CTE层压体夹在两层金属之间，优选为铜。

公开(公告)号：US06387205B1

公开(公告)日：2002-05-14

申请号：US09489724

申请日：2000-01-24

申请人： Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

发明人： Bernd Karl Appelt ,  William Thomas Fotorny ,  Robert Maynard Japp ,  Kostantinos Papathomas ,  Mark David Poliks

IPC分类号： B32B3126

CPC分类号： C08J3/243 ,  B29B15/125 ,  B29C70/08 ,  B29C70/086 ,  B29C70/088 ,  B29C70/22 ,  B29C70/543 ,  B29C2791/001 ,  B29K2063/00 ,  B29K2101/10 ,  B29K2105/0809 ,  B29K2105/24 ,  B29K2105/243 ,  B29K2105/256 ,  B29K2705/00 ,  B29L2009/00 ,  B29L2031/3425 ,  B32B15/14 ,  B32B27/04 ,  B32B27/38 ,  B32B37/0038 ,  B32B2305/18 ,  B32B2311/12 ,  B32B2457/08 ,  C03C25/10 ,  C03C25/12 ,  C03C25/26 ,  C03C25/48 ,  C03C25/50 ,  C08J3/244 ,  C08J3/245 ,  C08J5/04 ,  C08J5/24 ,  C08J2363/00 ,  D06N3/0022 ,  D06N2205/20 ,  H01L23/145 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0166 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/2857 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/131 ,  Y10T442/2025 ,  Y10T442/2041 ,  Y10T442/2049 ,  Y10T442/2057 ,  Y10T442/2098 ,  H01L2924/00

摘要： A method for coating cloth especially fiberglass sheets with a thermosetting resin and resulting structure is provided. The coating is performed in two steps. In the first step, essentially all of the strands of the fiberglass are coated with the resin/solvent mixture while maintaining at least some of the interstices or openings essentially free of the solvent mixture. This first coating is then partially cured to between about 70% and 90% of full cure. The coated fiberglass with partially cured resin thereon is then given a second coating of either the same or different thermosetting resin mixture which coats the first coating and fills in the interstices between the fibers. This second coating is then partially cured, which advances the cure of the first coating past 80% full cure and results in an impregnated fiberglass cloth structure for use as sticker sheets. During lamination, the first coating acts like an impenetrable insulating sheet, preventing resin displacement and, therefore, preventing glass fiber contact with the conductive planes. The second coating is fluid enough to fill in spaces in the planes and to form the adhesive bond to cores and conductive layers. The structure reduces the tendency of the resin to flake and produce dust during subsequent processing operations.

摘要翻译： 提供了一种用热固性树脂涂布布尤其是玻璃纤维片并得到结构的方法。 涂层分两步进行。 在第一步骤中，玻璃纤维的基本上所有的股线都涂覆有树脂/溶剂混合物，同时保持至少一些间隙或开口基本上不含溶剂混合物。 然后将该第一涂层部分固化至完全固化的约70％至90％之间。 然后将其上具有部分固化的树脂的涂覆的玻璃纤维给予相同或不同的热固性树脂混合物的第二涂层，所述热固性树脂混合物涂覆第一涂层并填充纤维之间的间隙。 然后将该第二涂层部分固化，这使得第一涂层的固化达到80％全固化，并且导致浸渍的玻璃纤维布结构用作贴纸。 在层压期间，第一涂层的作用类似于不可渗透的绝缘片，防止树脂移位，因此防止玻璃纤维与导电平面接触。 第二涂层是足够流体以填充平面中的空间并形成与芯和导电层的粘合剂粘合剂。 该结构降低了在随后的加工操作期间树脂剥落并产生灰尘的倾向。