公开(公告)号：US12119417B2

公开(公告)日：2024-10-15

申请号：US17335201

申请日：2021-06-01

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Satoshi Inada ,  Kenichi Ono ,  Takeshi Minamiru ,  Akemi Murakami ,  Junichiro Hayakawa ,  Tsutomu Otsuka

IPC: H01S5/042 ,  H01L31/0224 ,  H01L31/18 ,  H01S5/02 ,  H01S5/0239 ,  H01S5/183

CPC classification number: H01L31/022408 ,  H01L31/18 ,  H01S5/0208 ,  H01S5/0239 ,  H01S5/0425 ,  H01S5/183

Abstract: An optical semiconductor element includes: a semiconductor substrate that is semi-insulating; a columnar body that is formed on a front surface-side of the semiconductor substrate and configured to emit or receive light from the front surface-side; a front surface-side electrode that is connected to the columnar body; a back surface-side electrode formed on a back surface-side of the semiconductor substrate; and an electrically conductive member that is formed to penetrate through the semiconductor substrate to connect the front surface-electrode and the back surface-side electrode, and has a protruding portion protruding on the front surface-side of the semiconductor substrate.

公开(公告)号：US12027510B2

公开(公告)日：2024-07-02

申请号：US17355270

申请日：2021-06-23

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Takashi Kondo ,  Satoshi Inada ,  Takeshi Minamiru ,  Daisuke Iguchi ,  Kazuhiro Sakai ,  Tomoaki Sakita ,  Michiaki Murata

IPC: H01L25/16 ,  G01B11/24 ,  G06V20/64 ,  G06V40/16 ,  H01S5/02257 ,  H01S5/02345 ,  H01S5/0236 ,  H01S5/0239 ,  H01S5/026 ,  H01S5/183 ,  H01S5/343 ,  H01S5/42 ,  H01L33/46 ,  H01L33/60

CPC classification number: H01L25/167 ,  G01B11/24 ,  G06V20/64 ,  G06V40/172 ,  H01S5/02257 ,  H01S5/0236 ,  H01S5/0239 ,  H01S5/0262 ,  H01S5/18361 ,  H01S5/34313 ,  H01S5/423 ,  H01L33/46 ,  H01L33/60

Abstract: A light-emitting element array chip includes: a first light-emitting element array that includes a first light-emitting element including a first substrate, a light-emitting element layer formed on the first substrate, and a first cathode electrode electrically connected to the light-emitting element layer; and a second light-emitting element array that includes a second light-emitting element including a second substrate, a non-p-type lower reflector formed on the second substrate, and a second cathode electrode electrically connected to the non-p-type lower reflector, in which the first light-emitting element array is provided on an emission surface side of the second light-emitting element array.

公开(公告)号：US11973321B2

公开(公告)日：2024-04-30

申请号：US18326981

申请日：2023-05-31

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro Sakai ,  Daisuke Iguchi ,  Takeshi Minamiru ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: H01S5/42 ,  G01B11/24 ,  G01K7/22 ,  G02B5/02 ,  G02B27/42 ,  G06F3/044 ,  G06F21/32 ,  G06V10/145 ,  G06V20/64 ,  G06V40/16 ,  H01S5/02 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/026 ,  H01S5/042 ,  H01S5/068 ,  H01S5/0687 ,  H01S5/183 ,  H01S5/343 ,  H01S5/20 ,  H01S5/30

CPC classification number: H01S5/423 ,  G02B5/0278 ,  G02B27/4205 ,  G06V10/145 ,  G06V20/64 ,  G06V40/166 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/06804 ,  H01S5/0687 ,  H01S5/0206 ,  H01S5/04252 ,  H01S5/04254 ,  H01S5/18347 ,  H01S5/18361 ,  H01S5/2054 ,  H01S5/3054 ,  H01S5/34353

Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

公开(公告)号：US11936164B2

公开(公告)日：2024-03-19

申请号：US18326981

申请日：2023-05-31

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Kazuhiro Sakai ,  Daisuke Iguchi ,  Takeshi Minamiru ,  Yoshinori Shirakawa ,  Tomoaki Sakita ,  Tsutomu Otsuka

IPC: H01S5/42 ,  G01B11/24 ,  G01K7/22 ,  G02B5/02 ,  G02B27/42 ,  G06F3/044 ,  G06F21/32 ,  G06V10/145 ,  G06V20/64 ,  G06V40/16 ,  H01S5/02 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/026 ,  H01S5/042 ,  H01S5/068 ,  H01S5/0687 ,  H01S5/183 ,  H01S5/343 ,  H01S5/20 ,  H01S5/30

CPC classification number: H01S5/423 ,  G02B5/0278 ,  G02B27/4205 ,  G06V10/145 ,  G06V20/64 ,  G06V40/166 ,  H01S5/02255 ,  H01S5/02325 ,  H01S5/06804 ,  H01S5/0687 ,  H01S5/0206 ,  H01S5/04252 ,  H01S5/04254 ,  H01S5/18347 ,  H01S5/18361 ,  H01S5/2054 ,  H01S5/3054 ,  H01S5/34353

Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.

公开(公告)号：US11657130B2

公开(公告)日：2023-05-23

申请号：US16511095

申请日：2019-07-15

Applicant: FUJIFILM BUSINESS INNOVATION CORP.

Inventor： Satoshi Inada ,  Kenichi Ono ,  Takeshi Minamiru ,  Michiaki Murata ,  Takafumi Higuchi

IPC: G01S7/481 ,  G01S17/89 ,  G06F21/45 ,  G01B11/24 ,  G01S17/04 ,  H01S5/183

CPC classification number: G01S7/4815 ,  G01B11/24 ,  G01S17/04 ,  G01S17/89 ,  G06F21/45 ,  H01S5/183

Abstract: A light emitter includes: a substrate; a driving section provided on the substrate; a light source that is provided on the substrate and is driven by the driving section; a cover section through which light emitted from the light source is transmitted and that is disposed in an optical axial direction of the light source; and a support section that is provided on a part of the substrate excluding a part between the driving section and the light source and supports the cover section.

公开(公告)号：US11050217B2

公开(公告)日：2021-06-29

申请号：US16546305

申请日：2019-08-21

Applicant: FUJIFILM Business Innovation Corp.

Inventor： Takashi Kondo ,  Tsutomu Otsuka ,  Takeshi Minamiru ,  Kazuhiro Sakai

IPC: G09G5/02 ,  H01S5/042 ,  H01S5/062 ,  G01S7/481 ,  H04N9/31 ,  H01S5/42 ,  H01S5/30 ,  H01S5/026 ,  G01S17/10

Abstract: A light-emitting device includes a light-emitting unit. The light-emitting unit includes an array of multiple light-emitting element groups, each including multiple light-emitting elements. In the light-emitting unit, the multiple light-emitting element groups are sequentially driven along the array such that, for each of the multiple light-emitting element groups, the multiple light-emitting elements included in the light-emitting element group are concurrently set to a state of emitting light or a state of not emitting light.