Abstract:
The present invention provides a chemical liquid that causes a small variation in a dissolving amount of a first metal-containing substance in a case where the chemical liquid is applied to an object to be treated containing the first metal-containing substance. The present invention also provides a method for treating an object to be treated. The chemical liquid according to an embodiment of the present invention contains water, a hydroxylamine compound selected from the group consisting of hydroxylamine and a hydroxylamine salt, and a specific compound represented by Formula (1).
Abstract:
There is provided an etching method of a semiconductor substrate that includes a first layer containing germanium (Ge) and a second layer containing at least one metal element selected from nickel platinum (NiPt), titanium (Ti), nickel (Ni), and cobalt (Co), the method including: bringing an etching liquid which contains a specific acid compound into contact with the second layer and selectively removing the second layer.
Abstract:
There is provided an etching solution of a semiconductor substrate that includes a first layer containing germanium (Ge) and a second layer containing a specific metal element other than germanium (Ge), the etching solution selectively removing the second layer and including an organic alkali compound.
Abstract:
The present disclosure relates to a method for manufacturing a color filter being capable of suppressing residue from being generated on a colored layer planarized by a planarization treatment, a color filter, and a solid-state imaging device.
Abstract:
The present invention provides a treatment liquid exhibiting excellent selectivity in dissolving SiGe in a case where the SiGe is etched with the treatment liquid. The present invention also provides a treatment liquid container relating to the treatment liquid. The treatment liquid according to an embodiment of the present invention contains a fluoride ion source, an oxidant, an acetate solvent, and an additive, in which the additive is an additive that does not contain a Si atom.
Abstract:
An object of the present invention is to provide a treatment method excellently flattens an object to be treated in a case where the treatment method is applied to an object to be treated having a metal layer. Another object of the present invention is to provide a treatment liquid for an object to be treated. The method for treating an object to be treated according to an embodiment of the present invention is a method for treating an object to be treated having a step A of performing an oxidation treatment on an object to be treated having a metal layer so as to form a metal oxide layer and a step B of bringing a treatment liquid into contact with the object to be treated obtained by the step A so as to dissolve and remove the metal oxide layer, in which the treatment liquid contains an organic solvent and an acidic compound, and a content of the organic solvent is 50% by mass or more with respect to a total mass of the treatment liquid.
Abstract:
Provided is a stripping method for stripping a modified resist from a semiconductor substrate by applying an etching solution to the semiconductor substrate, in which the etching solution contains an alcohol compound and a quaternary ammonium hydroxide compound and the quaternary ammonium hydroxide compound is at least one of tetraethylammonium hydroxide and tetrabutylammonium hydroxide.
Abstract:
There is provided an etching liquid including nitric acid; a fluorine-containing compound; and a nitrogen-containing organic compound A containing a nitrogen atom, or a phosphorus-containing compound B.
Abstract:
There is provided a coloring composition including: a colorant; and a resin, wherein a content of the colorant is 50% by mass or more based on total solids of the coloring composition, and a solid acid number of a resin having a highest solid acid number among all kinds of resins contained in the coloring composition, is 80 mg KOH/g or less.
Abstract:
The invention is directed to a colored composition for forming a green color filter, containing a color pigment, wherein a content of the color pigment to a total solid content of the colored composition is 60% by weight or more, and a layer having a thickness of 0.6 μm formed from the colored composition has light transmittance of 80% or more at a wavelength of 550 nm and light transmittance of 50% or less at a wavelength of 450 nm, and a method of producing a color filter including (A) forming a first colored layer containing a first colored composition and (B) patterning with dry etching so as to from a through-hole group in the first colored layer, wherein the first colored composition is the colored composition as defined herein.