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    ELASTOMERIC LAYER FABRICATION FOR LIGHT EMITTING DIODES
    11.
    发明申请
    ELASTOMERIC LAYER FABRICATION FOR LIGHT EMITTING DIODES 审中-公开

    公开(公告)号：US20190148348A1

    公开(公告)日：2019-05-16

    申请号：US16164629

    申请日：2018-10-18

    申请人： Facebook Technologies, LLC

    发明人： Daniel Brodoceanu ,  Oscar Torrents Abad

    IPC分类号： H01L25/16 ,  H01L21/67

    摘要： An elastomeric interface layer (elayer) is formed over multiple light emitting diode (LED) dies by depositing photoresist materials across multiple LED dies, and using the LED dies as a photolithography mask to facilitate formation of the elayer on each LED die. The elayer facilitates adhesive attachment of each LED die with a pick and place head (PPH), allowing the LED dies to be picked up and placed onto a display substrate including control circuits for sub-pixels of an electronic display. In some embodiments, the LED dies are micro-LED (μLED) dies.

    Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers
    12.
    发明授权
    Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers 有权

    公开(公告)号：US11575069B2

    公开(公告)日：2023-02-07

    申请号：US16748697

    申请日：2020-01-21

    申请人： Facebook Technologies, LLC

    发明人： Daniel Brodoceanu ,  Oscar Torrents Abad ,  Jeb Wu ,  Zheng Sung Chio ,  Sharon Nanette Farrens ,  Ali Sengul

    IPC分类号： H01L33/00 ,  H01L33/52 ,  H01L33/62 ,  H01L25/075 ,  H01L23/00 ,  G02B27/01

    摘要： The invention is directed towards enhanced systems and methods for employing a pulsed photon (or EM energy) source, such as but not limited to a laser, to electrically couple, bond, and/or affix the electrical contacts of a semiconductor device to the electrical contacts of another semiconductor devices. Full or partial rows of LEDs are electrically coupled, bonded, and/or affixed to a backplane of a display device. The LEDs may be μLEDs. The pulsed photon source is employed to irradiate the LEDs with scanning photon pulses. The EM radiation is absorbed by either the surfaces, bulk, substrate, the electrical contacts of the LED, and/or electrical contacts of the backplane to generate thermal energy that induces the bonding between the electrical contacts of the LEDs' electrical contacts and backplane's electrical contacts. The temporal and spatial profiles of the photon pulses, as well as a pulsing frequency and a scanning frequency of the photon source, are selected to control for adverse thermal effects.

    Molded etch masks
    14.
    发明授权
    Molded etch masks 有权

    公开(公告)号：US10910514B1

    公开(公告)日：2021-02-02

    申请号：US16229966

    申请日：2018-12-21

    申请人： Facebook Technologies, LLC

    发明人： Daniel Brodoceanu ,  David Massoubre ,  Karsten Moh

    IPC分类号： H01L33/24 ,  H01L33/58 ,  H01L33/32 ,  H01L27/15 ,  H01S5/12 ,  H01S5/22 ,  H01L33/00 ,  H01L33/20 ,  G03F7/00 ,  H01L21/027

    摘要： Techniques related to molded etch masks are disclosed. Etch masks can be formed based on pressing a mold against a layer of pliable masking material applied to a surface of an epitaxial layered structure. The epitaxial layered structure includes a first semiconductor layer, a second semiconductor layer, and a light-emitting layer between the first and second semiconductor layers. The epitaxial layered structure is etched using the molded etch masks to form etched structures. The etched structures may be optical structures that modify light emitted through the surface or epitaxial mesas that collimate light within the epitaxial layered structure.

    BRIDGE PICK-UP HEAD FOR TRANSFERRING SEMICONDUCTOR DEVICES
    15.
    发明申请
    BRIDGE PICK-UP HEAD FOR TRANSFERRING SEMICONDUCTOR DEVICES 审中-公开

    公开(公告)号：US20200343121A1

    公开(公告)日：2020-10-29

    申请号：US16682545

    申请日：2019-11-13

    申请人： Facebook Technologies, LLC

    发明人： Oscar Torrents Abad ,  Daniel Brodoceanu ,  Ali Sengül ,  Pooya Saketi

    IPC分类号： H01L21/683 ,  B65G47/90

    摘要： A pick-up tool (PUT) includes a bridge pick-up head. The bridge pick-up head includes: a first bridge leg portion, a second bridge leg portion, and a bridge center portion between the first and second leg portions, the first and second bridge leg portions each including a top surface and side surfaces, the top surfaces of the first and second bridge leg portions extending above the bridge center portion; a bridge base portion on the bridge center portion, the bridge base portion including a bottom side on the bridge center portion, a top side that is smaller than the bottom side, and one or more sloped surfaces defined between the top and bottom sides; and a tip configured to attach with a semiconductor device on the top side of the bridge base portion.

    Rigid pickup head with conformable layer
    16.
    发明授权
    Rigid pickup head with conformable layer 有权

    公开(公告)号：US10818643B1

    公开(公告)日：2020-10-27

    申请号：US16732723

    申请日：2020-01-02

    申请人： Facebook Technologies, LLC

    发明人： Daniel Brodoceanu ,  Oscar Torrents Abad ,  Ali Sengül ,  Pooya Saketi

    IPC分类号： H01L25/075 ,  H01L21/67 ,  F21V23/06 ,  H01L21/683 ,  H01L33/00 ,  F21Y115/10

    摘要： Embodiments relate to using a pickup assembly to place light emitting diodes (LEDs) onto an electronic display substrate after fabrication of the LEDs. An LED assembly system places LEDs on a temporary substrate after fabrication. Pickup heads of the pickup assembly are coated with a conformable material to enable attachment of each LED to a pickup head. The pickup head removes the LEDs away from the temporary substrate and aligns the LEDs onto a target substrate. The LED assembly system provides heat to an electrode of the LEDs and a corresponding electrical contact pad of the target substrate. The pickup assembly applies force to the LED on the target substrate, such that with the heat, the electrode of the LED and the electrical contact pad are bonded. The pickup assembly releases the LED onto the target substrate.