公开(公告)号：USRE36396E

公开(公告)日：1999-11-16

申请号：US379991

申请日：1995-01-27

Applicant: David J. Arthur ,  John C. Mosko ,  Connie S. Jackson ,  G. Robert Traut

Inventor： David J. Arthur ,  John C. Mosko ,  Connie S. Jackson ,  G. Robert Traut

IPC: H01B3/44 ,  H01L23/14 ,  H05K1/03 ,  H05K3/46 ,  B32B5/16

CPC classification number: H01L23/145 ,  H01B3/445 ,  H05K1/0373 ,  H01L2924/0002 ,  H05K1/034 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/068 ,  H05K3/4626 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2995 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31692

Abstract: A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials and integrated circuit chip carriers is presented which exhibits improved electrical performance over other printed wiring board materials and circuit chip carriers. Also, the low coefficients of thermal expansion and compliant nature of this electrical substrate material results in improved surface mount reliability and plated through-hole reliability. The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount of microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material which renders the surface of the ceramic hydrophobic and provides improved tensile strength, peel strength and dimensional stability.

Abstract translation: 提出了一种非常适合形成刚性印刷线路板基板材料和集成电路芯片载体的基于陶瓷填充的基于氟聚合物的电气基板材料，其表现出比其它印刷线路板材料和电路芯片载体更好的电性能。 此外，该电气基板材料的低的热膨胀系数和顺从性导致改进的表面贴装可靠性和电镀通孔可靠性。 电气基材材料优选包含填充有二氧化硅的聚四氟乙烯以及少量的微纤维。 在本发明的一个重要特征中，陶瓷填料（二氧化硅）涂有硅烷涂层材料，使陶瓷表面疏水，提供更好的拉伸强度，剥离强度和尺寸稳定性。

公开(公告)号：US4849284A

公开(公告)日：1989-07-18

申请号：US15191

申请日：1987-02-17

Applicant: David J. Arthur ,  John C. Mosko ,  Connie S. Jackson ,  G. Robert Traut

Inventor： David J. Arthur ,  John C. Mosko ,  Connie S. Jackson ,  G. Robert Traut

IPC: C08K3/00 ,  B32B15/08 ,  B32B15/082 ,  C08K9/06 ,  C08L27/12 ,  C09D127/12 ,  H01B3/44 ,  H01L23/08 ,  H01L23/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K1/0373 ,  C08K9/06 ,  H01B3/445 ,  H01L23/145 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/056 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/068 ,  H05K3/389 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2995 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31692

Abstract: A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials and integrated circuit chip carriers is presented which exhibits improved electrical performance over other printed wiring board materials and circuit chip carriers. Also, the low coefficients of thermal expansion and compliant nature of this electrical substrate material results in improved surface mount reliability and plated through-hole reliability. The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount of microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material which renders the surface of the ceramic hydrophobic and provides improved tensile strength, peel strength and dimensional stability.

公开(公告)号：US4647940A

公开(公告)日：1987-03-03

申请号：US424836

申请日：1982-09-27

Applicant: G. Robert Traut ,  Geoff J. Wilson

Inventor： G. Robert Traut ,  Geoff J. Wilson

IPC: H01Q13/10 ,  H01Q17/00 ,  H01Q21/00 ,  H01Q13/18

CPC classification number: H01Q21/0012 ,  H01Q17/001

Abstract: A parallel plate waveguide microwave antenna is presented in which transmission or reception of microwave energy is effected by radiating waveguide slots or apertures in a metallized glass plate or plate of other rigid dielectric material. The metallized glass plate cooperates with another metallized glass plate or other rigid dielectric material or a metal plate to define a parallel plate waveguide with air or an inert gas or vacuum as the dielectric between the plates. When used as a transmitter antenna, a central electrode propagates waves in the dielectric medium in expanding circles; and the slots or apertures in the metal layer act as scattering sites to couple the waves to free space. When used as a receiver antenna, the reverse will occur.

Abstract translation: 提出了一种平行板波导微波天线，其中微波能量的传输或接收是通过在其它刚性介电材料的金属化玻璃板或板中辐射波导槽或孔来实现的。 金属化玻璃板与另一金属化玻璃板或其它刚性介电材料或金属板配合以限定具有空气或惰性气体或真空的平行板波导作为板之间的电介质。 当用作发射天线时，中心电极在扩展圆中的介电介质中传播波; 并且金属层中的槽或孔用作散射位置以将波浪耦合到自由空间。 当用作接收天线时，会发生相反的反应。

公开(公告)号：US4633262A

公开(公告)日：1986-12-30

申请号：US424833

申请日：1982-09-27

Applicant: G. Robert Traut

Inventor： G. Robert Traut

IPC: H01Q13/08 ,  H01Q1/40 ,  H01Q13/20 ,  H01Q21/06 ,  H01Q1/38

CPC classification number: H01Q1/40 ,  H01Q13/206 ,  H01Q21/065

Abstract: A microstrip antenna is presented in which the circuit pattern is on the inner side of a glass plate and is spaced from the ground plane by an air dielectric. The outer side of the glass plate serves as a protective cover for the circuit pattern and the ground plane.

Abstract translation: 提出了一种微带天线，其中电路图案位于玻璃板的内侧，并通过空气电介质与接地平面隔开。 玻璃板的外侧用作电路图案和接地平面的保护盖。

公开(公告)号：US4335180A

公开(公告)日：1982-06-15

申请号：US213876

申请日：1980-12-08

Applicant: G. Robert Traut

Inventor： G. Robert Traut

IPC: B29C67/02 ,  B29C70/02 ,  B29C70/88 ,  B32B15/08 ,  H01B3/44 ,  H01B3/48 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B27/00

CPC classification number: B32B15/08 ,  B29C67/02 ,  B29C70/025 ,  B29C70/88 ,  H01B3/445 ,  H01B3/48 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/0373 ,  B29K2105/0064 ,  B29K2105/007 ,  B29K2105/12 ,  B29K2105/122 ,  B29K2105/16 ,  B29K2995/0006 ,  B29L2007/002 ,  H05K1/024 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0251 ,  Y10T428/249951 ,  Y10T428/31544 ,  Y10T428/31692 ,  Y10T428/31699

Abstract: Microwave circuit boards and methods of making microwave circuit boards, the circuit boards having relatively high dielectric constants, excellent moisture resistance, and reduced tendency to incur changes in dimensions after processing. The method comprises blending in a polymer dispersion, a particulate filler material having a high dielectric constant and microfibrous material to form a slurry of polymer, filler, and fiber. A flocculant is added to the slurry to agglomerate the polymer particles, the filler particles, and the microfibers to produce a dough-like material. The dough-like material is eventually formed into a sheet, and is thereafter dried. A conductive foil such as copper is then applied to both sides of the sheet to provide a microwave circuit board.

Abstract translation: 微波电路板和制造微波电路板的方法，电路板具有相对较高的介电常数，优异的耐湿性，并且减少加工后的尺寸变化的倾向。 该方法包括在聚合物分散体中混合具有高介电常数的微粒填充材料和微纤维材料，以形成聚合物，填料和纤维的浆料。 将絮凝剂加入到浆料中以使聚合物颗粒，填料颗粒和微纤维聚集以产生面团状材料。 面团状材料最终形成片材，然后干燥。 然后将诸如铜的导电箔施加到片材的两侧以提供微波电路板。