Thermally-conductive polymer and components

    公开(公告)号:US11117346B2

    公开(公告)日:2021-09-14

    申请号:US16515772

    申请日:2019-07-18

    Abstract: A method of forming a component includes depositing a ceramic material within an open-cell void of a polymer body. The ceramic material deposited around the periphery of the open-cell void structure forms a thermally-conductive path through the polymer body. The ceramic material circumscribes an open volume extending the entire length of the thermally-conductive path that is filled with a sealant such that fluids are incommunicable from the first surface to the second surface via the thermally-conductive path. A method of forming a heat exchanger includes forming a plurality of plates, each plate formed as a thermally-conductive polymer body. The method of forming the heat exchanger further includes arranging the plurality of plates within a housing to form a plate and frame heat exchanger configured to place a first flowpath in a heat exchange relationship with a second flowpath.

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