Method of manufacturing a semiconductor device by forming at least three
regions of different lifetimes of carriers at different depths
    12.
    发明授权
    Method of manufacturing a semiconductor device by forming at least three regions of different lifetimes of carriers at different depths 失效
    通过在不同深度形成载体的不同寿命的至少三个区域来制造半导体器件的方法

    公开(公告)号:US5250446A

    公开(公告)日:1993-10-05

    申请号:US959465

    申请日:1992-10-09

    摘要: A mixture of at least two types of charged particles of ions having the same value obtained by dividing the electric charge of an ion by the mass of the ion, i.e., a mixture of charged particles including hydrogen molecular ions H.sub.2.sup.+ and deuterium ions D.sup.+, is accelerated in a charged particle accelerator. Since the mass spectrograph unit in the accelerator cannot divide the hydrogen molecular ions H.sub.2.sup.+ and the deuterium ion D.sup.+, both ions are accelerated together. When the hydrogen molecular ion H.sub.2.sup.+ collides against a silicon substrate, it is divided into two hydrogen ions 2H.sup.+. Since the hydrogen ion H.sup.+ and the deuterium ion D.sup.+ have different ranges in silicon, two regions including a great number of crystal defects are formed in the silicon substrate in one ion irradiating step. As a result, at least three regions of different lifetimes of carriers are formed at different depths of the semiconductor substrate.

    摘要翻译: 将离子电荷除以离子质量,即包含氢分子离子H 2 +和氘离子D +的带电粒子的混合物获得的具有相同值的至少两种类型的带电粒子的混合物是 在带电粒子加速器中加速。 由于加速器中的质谱仪单元不能分离氢分子离子H2 +和氘离子D +,所以两个离子一起被加速。 当氢分子离子H2 +碰撞硅衬底时,它被分为两个氢离子2H +。 由于氢离子H +和氘离子D +在硅中具有不同的范围,因此在一个离子照射步骤中在硅衬底中形成包括大量晶体缺陷的两个区域。 结果,在半导体衬底的不同深度形成载流子寿命不同的至少三个区域。

    Method of production of vertical MOS transistor
    13.
    发明授权
    Method of production of vertical MOS transistor 失效
    垂直MOS晶体管的制造方法

    公开(公告)号:US5242845A

    公开(公告)日:1993-09-07

    申请号:US866418

    申请日:1992-04-10

    摘要: A vertical MOS transistor comprises a semiconductor substrate, a first impurity region defined on the surface of the semiconductor substrate, a second impurity region defined under the first impurity region, the conduction type of the second impurity region being opposite to that of the first impurity region, a trench engraved on the surface of the semiconductor substrate to cut through the first and second impurity regions deeper than at least the bottom of the second impurity region, and a gate electrode disposed in the trench with a gate insulation film interposing between the wall of the trench and the gate electrode. The gate insulation film is thicker on the bottom of the trench and on part of the side walls of the trench continuous to the bottom than on the other parts.

    摘要翻译: 垂直MOS晶体管包括半导体衬底,限定在半导体衬底的表面上的第一杂质区域,限定在第一杂质区域下方的第二杂质区域,第二杂质区域的导电类型与第一杂质区域的导电类型相反 刻蚀在所述半导体衬底的表面上的沟槽,以切割穿过所述第一和第二杂质区域至少比所述第二杂质区域的底部更深;以及栅电极,设置在所述沟槽中,栅极绝缘膜插入在所述第二杂质区域的壁之间 沟槽和栅电极。 栅极绝缘膜在沟槽的底部和沟槽的侧壁的一部分比底部更厚,而不是其它部分。

    Vertical MOS transistor and its production method
    14.
    发明授权
    Vertical MOS transistor and its production method 失效
    垂直MOS晶体管及其制作方法

    公开(公告)号:US5126807A

    公开(公告)日:1992-06-30

    申请号:US713505

    申请日:1991-06-12

    摘要: A vertical MOS transistor comprises a semiconductor substrate, a first impurity region defined on the surface of the semiconductor substrate, a second impurity region defined under the first impurity region, the conduction type of the second impurity region being opposite to that of the first impurity region, a trench engraved on the surface of the semiconductor substrate to cut through the first and second impurity regions deeper than at least the bottom of the second impurity region, and a gate electrode disposed in the trench with a gate insulation film interposing between the wall of the trench and the gate electrode. THE gate insulation film is thicker on the bottom of the trench and on part of the side walls of the trench continuous to the bottom than on the other parts.

    摘要翻译: 垂直MOS晶体管包括半导体衬底,限定在半导体衬底的表面上的第一杂质区域,限定在第一杂质区域下方的第二杂质区域,第二杂质区域的导电类型与第一杂质区域的导电类型相反 刻蚀在所述半导体衬底的表面上的沟槽,以切割穿过所述第一和第二杂质区域至少比所述第二杂质区域的底部更深;以及栅电极,设置在所述沟槽中,栅极绝缘膜插入在所述第二杂质区域的壁之间 沟槽和栅电极。 栅极绝缘膜在沟槽的底部和沟槽的侧壁的一部分比底部的部分更厚,而不是其他部分。

    Semiconductor device
    15.
    发明授权

    公开(公告)号:US06740931B2

    公开(公告)日:2004-05-25

    申请号:US10417110

    申请日:2003-04-17

    IPC分类号: H01L2994

    摘要: A semiconductor device which comprises a semiconductor substrate, semiconductor pillar regions each having first and second semiconductor pillar portions, the second semiconductor pillar portion being sandwiched by the first semiconductor pillar portions, a base layer formed in the second semiconductor pillar portion, a source diffusion layer formed in the base layer, a gate insulating film formed on a portion of the base layer, a gate electrode formed on the gate insulating film, and isolation regions which isolates the semiconductor pillar regions from each other and are formed in trenches between the semiconductor pillar regions, wherein each of the isolation regions comprises an oxide film formed on an inner surface of the trench and a nitride film formed on the oxide film, the nitride film being filled in the trench, and a film thickness ratio of the oxide film and the nitride film is in a range of 2:1 to 5:1.

    Power device having high breakdown voltage and method of manufacturing
the same
    18.
    发明授权
    Power device having high breakdown voltage and method of manufacturing the same 失效
    具有高击穿电压的功率器件及其制造方法

    公开(公告)号:US6084263A

    公开(公告)日:2000-07-04

    申请号:US27727

    申请日:1998-02-23

    CPC分类号: H01L29/7395 H01L29/0611

    摘要: The main characteristic feature of the invention is to prevent a leakage current from flowing when a planar type semiconductor device having a high breakdown voltage is reverse-biased. For example, a semiconductive film is formed on the surface of an n-type Si substrate between a second p-type base layer selectively formed on the surface of the Si substrate and a channel stop layer formed to surround the second p-type base layer at a predetermined interval. The dangling bond density of the semiconductive film is set at 1.25.times.1018 cm.sup.-3. With this structure, the discrete level in the band gap approach a continuum, and the time required to populate the trapping level in the semiconductive film with carriers is shortened.

    摘要翻译: 本发明的主要特征是当具有高击穿电压的平面型半导体器件被反向偏置时,防止漏电流流动。 例如,在n型Si衬底的表面上形成半导体膜,该第二p型基极层选择性地形成在Si衬底表面上的第二p型基极层和形成为围绕第二p型基极层的沟道阻挡层 以预定间隔。 半导体膜的悬挂键密度设定为1.25×10 18 cm -3。 利用这种结构,带隙中的离散水平接近连续体,缩短了用载体填充半导体薄膜中的捕获水平所需的时间。

    Power MOS transistor having trench gate
    19.
    发明授权
    Power MOS transistor having trench gate 失效
    功率MOS晶体管具有沟槽栅极

    公开(公告)号:US07227223B2

    公开(公告)日:2007-06-05

    申请号:US10618624

    申请日:2003-07-15

    摘要: A semiconductor device, and particularly an MOS transistor device, wherein in order to increase a channel region density and to achieve a low resistance of a transistor device there is provided a first gate electrode group having a plurality of gate electrodes formed on a semiconductor substrate to be away from each other at first equal spacings, a second gate electrode group having a plurality of gate electrodes formed on the semiconductor substrate to be away from each other at the first equal spacings, a source contact portion formed away from the first or the second gate electrode group at a second spacing, and source regions for electrically interconnecting the first gate electrode group and the source contact. The source regions are connected to each other at one end of the first gate electrode group, and separated at the other end of the first gate electrode group. In addition, the gate electrodes of the first group are connected each other at the other end. The second spacing is greater than the first spacing.

    摘要翻译: 一种半导体器件,特别是MOS晶体管器件,其中为了增加沟道区密度并实现晶体管器件的低电阻,提供了一种第一栅极电极组,其具有形成在半导体衬底上的多个栅极电极 在第一等间隔处彼此远离的第二栅极电极组,具有形成在半导体衬底上的多个栅电极以彼此间隔开的第一等间距彼此远离的第二栅电极组;远离第一或第二 第二间隔的栅极电极组和用于将第一栅极电极组和源极接触电互连的源极区域。 源极区域在第一栅电极组的一端彼此连接,并在第一栅电极组的另一端分离。 此外,第一组的栅电极在另一端彼此连接。 第二个间距大于第一个间距。

    Semiconductor device with overvoltage protective function
    20.
    发明授权
    Semiconductor device with overvoltage protective function 失效
    半导体器件具有过压保护功能

    公开(公告)号:US5243205A

    公开(公告)日:1993-09-07

    申请号:US899123

    申请日:1992-06-18

    摘要: In a photothyristor, a main thyristor consisting of a P emitter layer, an N base layer, a P gate base layer and an N emitter layer is formed on a semiconductor substrate. Also a pilot thyristor surrounded with the main thyristor and consisting of a P emitter layer, an N base layer, a P gate base layer and an N emitter layer is formed. In the P gate base layer, a trigger light irradiation surface including the inner surface of a recess is formed on the center of the pilot thyristor. In the N base layer, a crystal defect layer is formed under the trigger light irradiation surface by the irradiation with a radiant ray. A breakdown voltage to protect the thyristor from overvoltage is controlled by the crystal defect layer.

    摘要翻译: 在光闸晶体管中,在半导体衬底上形成由P发射极层,N基极层,P栅极基极层和N发射极层构成的主晶闸管。 另外,由主晶闸管包围并由P发射极层,N基极层,P栅极基极层和N发射极层构成的导频晶闸管。 在P栅极基极层中,在导频晶闸管的中心形成有包括凹部的内表面的触发光照射面。 在N基层中,通过用辐射线照射在触发光照射面下形成晶体缺陷层。 用于保护晶闸管的过电压的击穿电压由晶体缺陷层控制。