公开(公告)号：US07400470B2

公开(公告)日：2008-07-15

申请号：US11112719

申请日：2005-04-21

申请人： Yuhsuke Matsumoto ,  Tatsushi Yoshida ,  Takaaki Murokawa ,  Tatsumi Tsuchiya ,  Yoshio Uematsu ,  Nobuyuki Hashi

发明人： Yuhsuke Matsumoto ,  Tatsushi Yoshida ,  Takaaki Murokawa ,  Tatsumi Tsuchiya ,  Yoshio Uematsu ,  Nobuyuki Hashi

IPC分类号： G11B5/60

CPC分类号： G11B5/4826 ,  H01L2224/742 ,  H01L2924/01322 ,  H05K3/3442 ,  H05K2201/0397 ,  H05K2201/10727 ,  H05K2203/041 ,  H05K2203/0465 ,  Y02P70/613

摘要： Embodiments of the invention provide a head gimbal assembly (HGA) capable of effecting solder ball connection with use of low energy. In one embodiment, the HGA includes a head/slider. In the head/slider, slider pads and lead wire pads are connected to each other by reflow of solder balls under the radiation of a laser beam. Lead layers are connected to a magnetic head and electrode studs are connected to the lead layers, respectively, and are also connected to the slider pads. The diameter R (m) of a solder ball and a sectional area S (m2) of an electrode stud are in a relation of R2≧4S.

摘要翻译： 本发明的实施例提供一种能够使用低能量实现焊球连接的头万向架组件（HGA）。 在一个实施例中，HGA包括头/滑块。 在头/滑块中，通过在激光束的辐射下回流焊球，滑块和引线焊盘彼此连接。 引线层连接到磁头，电极柱分别连接到引线层，并且还连接到滑块。 焊球的直径R（m）和电极柱的截面积S（m 2）之间的关系为R 2 2 / S 2 = 4S。

公开(公告)号：US20050028353A1

公开(公告)日：2005-02-10

申请号：US10929322

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B21/21 ,  G11B5/48 ,  G11B21/20 ,  G11B5/012 ,  G11B17/00

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assemblingjigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要其数量至少等于在各个组装过程中保留的未完成的HG组件的数量的组装。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US06628380B1

公开(公告)日：2003-09-30

申请号：US09897183

申请日：2001-07-02

申请人： Masashi Fujimori ,  Kenji Itoh ,  Toru Koike ,  Yuhsuke Matsumoto ,  Seiji Nakagawa ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

发明人： Masashi Fujimori ,  Kenji Itoh ,  Toru Koike ,  Yuhsuke Matsumoto ,  Seiji Nakagawa ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

IPC分类号： G01N2100

CPC分类号： G01N21/8806 ,  G11B5/4806

摘要： A jig for inspecting the appearance of small parts with an optical microscope, the jig is equipped with a base, having an upper flat surface which becomes a mounting stage of the optical microscope, and is also provided with a member for moving the upper flat surface at least in a direction approximately parallel to a direction of an optical axis of an objective lens of the optical microscope in order to focus the optical microscope on an inspection portion of the small parts mounted on the upper flat surface. The jig is also equipped with an inspection-object supporting portion, provided with a member for supporting the small parts at the predetermined portion on the base. Furthermore, the jig is equipped with reflecting mirrors which have a mirrorlike surface with an inclined angle of approximately 45 degrees to the upper flat surface of the base.

摘要翻译： 一种用光学显微镜检查小部件的外观的夹具，该夹具具有基部，具有成为光学显微镜的安装台的上部平坦面，并且还设置有用于使上部平坦面 至少在与光学显微镜的物镜的光轴的方向大致平行的方向上，以将光学显微镜聚焦在安装在上平坦表面上的小部件的检查部分上。 该夹具还配备有检查对象支撑部，该检查对象支撑部设置有用于在基部上的预定部分处支撑小部件的部件。 此外，夹具配备有反射镜，反射镜具有与基座的上平坦表面大约45度的倾斜角的镜面。

公开(公告)号：US06366431B1

公开(公告)日：2002-04-02

申请号：US09430995

申请日：1999-11-01

申请人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Naoki Fujii

发明人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Naoki Fujii

IPC分类号： G11B548

CPC分类号： G11B5/4826

摘要： The object of the present invention is to provide a structure of a head supporting arm for preventing a read/write head from being damaged during a heating process for bonding a slider to a flexure and a method for fabricating the head supporting arm with preventing the read/write head from being damaged during the heating process. A head supporting arm of the present invention comprises: a load beam, a flexure including a portion coupled to said load beam and a bonding portion; and a slider bonded on said bonding portion by an adhesive; wherein said bonding portion of said flexure includes an edge placed on a surface of said slider; and wherein an exposing aperture, which exposes both a portion of a surface region, including said one edge, of said bonding portion and a portion of said surface of said slider, is formed on said load beam.

摘要翻译： 本发明的目的是提供一种用于防止读/写头在用于将滑块接合到挠曲件的加热过程中被损坏的头部支撑臂的结构以及用于制造头部支撑臂的方法，以防止读取 /写头在加热过程中被损坏。 本发明的头部支撑臂包括：负载梁，挠曲件，其包括联接到所述负载梁的部分和接合部分; 以及通过粘合剂粘结在所述接合部分上的滑块; 其中所述挠曲件的所述接合部分包括放置在所述滑块的表面上的边缘; 并且其中在所述负载梁上形成暴露孔，所述曝光孔暴露所述结合部分的所述一个边缘的表面区域的一部分和所述滑块的所述表面的一部分。

公开(公告)号：US06321974B1

公开(公告)日：2001-11-27

申请号：US09553596

申请日：2000-04-20

申请人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Takuya Satoh ,  Akiko Hayashi

发明人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Takuya Satoh ,  Akiko Hayashi

IPC分类号： B23K106

CPC分类号： B23K20/10

摘要： A plurality of bonding pads formed on a slider are integrally joined to an elastic flexure for a disk drive suspension. The pads are ultrasonically bonded to the slider with leads that are held by the flexure. The bonding portions of the leads face and are pressed against the pads with ultrasonic waves. The leads are plastically deformed during these steps to prevent the flexure from being deformed after the ultrasonic bonding process.

摘要翻译： 形成在滑块上的多个接合焊盘与用于磁盘驱动器悬架的弹性挠曲件一体地接合。 焊盘通过由挠曲件保持的引线超声波地结合到滑块。 引线的接合部分面对并用超声波压在焊盘上。 引线在这些步骤期间发生塑性变形，以防止在超声波接合工艺之后挠曲变形。

公开(公告)号：US07380329B2

公开(公告)日：2008-06-03

申请号：US10929322

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B5/48

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A method of assembling a head gimbal assembly. The method comprises a series of steps which include: stacking a base plate, a load beam, and a flexure to form a three-layered stacked series with at least a bottom layer being a base plate series; joining portions of the load beam to the base plate, and the flexure to the load beam in the three-layered stacked series to make a suspension section; attaching a slider to the flexure in the suspension section to make a head gimbal assembly; load-bending a hinge portion formed in the head gimbal assembly; and heating the hinge portion in order to adjust a bending load on the hinge portion at a predetermined bending angle to a predetermined value.

摘要翻译： 头部万向节组件的组装方法。 该方法包括一系列步骤，其包括：堆叠基板，负载梁和挠曲件以形成至少底层为基板系列的三层堆叠系列; 将所述负载梁的部分接合到所述基板，并且将所述弯曲部分连接到所述三层堆叠系列中的所述负载梁以形成悬挂部; 将滑块附接到悬架部分中的挠曲件以制造头部万向节组件; 负载弯曲形成在头部万向节组件中的铰链部分; 并加热铰链部分，以便以预定的弯曲角度将铰链部分上的弯曲载荷调整到预定值。

公开(公告)号：US07161766B2

公开(公告)日：2007-01-09

申请号：US10929507

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： G11B5/48

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. The base plate structure comprises a band portion having conveying holes and positioning holes formed at a predetermined pith respectively in a longitudinal direction. A plurality of the base plates are disposed via connecting portions integrally formed at a predetermined pitch at edges on one side of the band portion.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 基板结构包括具有分别在纵向方向上形成在预定的髓上的输送孔和定位孔的带部分。 多个基板通过在带部分的一侧的边缘处以预定间距整体形成的连接部分设置。

公开(公告)号：US20050199680A1

公开(公告)日：2005-09-15

申请号：US11066949

申请日：2005-02-25

申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

IPC分类号： G11B5/60 ,  B23K1/00 ,  G11B21/21 ,  H05K1/11 ,  H05K3/34

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H05K1/111 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.

摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。

公开(公告)号：US06382499B1

公开(公告)日：2002-05-07

申请号：US09140361

申请日：1998-08-26

申请人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Naoki Kurosu

发明人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Naoki Kurosu

IPC分类号： B21D3900

CPC分类号： G11B5/484 ,  Y10T29/49025 ,  Y10T29/4903

摘要： An integrated suspension for a slider in a magnetic record system has a simplified structure relatively easy to manufacture. This new integrated suspension is assembled from separate pieces including a load beam a flexure and a mount plate. The flexure includes a flexible member and a conductive lead integrally formed thereon. Since the flexible member is of super-thin type, the flexion of the flexure is minimized by the support using a platform support in an ultrasonic bonding of its conductive lead with a bonding pad of the slider. Besides, to minimize the deflection, an ultrasonic bonding is executed in close order of distance to support portion. Furthermore, a tab extending from the tip of the load beam is used so as not to affect the flexure regarded as a fine piece.

摘要翻译： 用于磁记录系统中的滑块的集成悬架具有相对容易制造的简化结构。 这种新的集成悬架由单独的部件组装，包括负载梁弯曲件和安装板。 挠性件包括柔性构件和一体地形成在其上的导电引线。 由于柔性构件是超薄型的，所以通过在其导电引线与滑块的接合焊盘的超声波接合中使用平台支撑件的支撑件使弯曲的屈曲最小化。 此外，为了最小化偏转，以与支撑部分的距离的紧密顺序执行超声波接合。 此外，使用从负载梁的尖端延伸的突片，以便不影响被认为是微细的挠曲。

公开(公告)号：US5754370A

公开(公告)日：1998-05-19

申请号：US893446

申请日：1997-07-11

申请人： Tatsumi Tsuchiya ,  Seiji Nakagawa ,  Tatsushi Yoshida ,  Yasuhiro Mita

发明人： Tatsumi Tsuchiya ,  Seiji Nakagawa ,  Tatsushi Yoshida ,  Yasuhiro Mita

IPC分类号： G11B5/60 ,  G11B5/48 ,  G11B21/00 ,  G11B21/16 ,  G11B21/21 ,  G11B3/10

CPC分类号： G11B5/4806 ,  G11B21/00 ,  G11B21/16 ,  G11B5/4826

摘要： The present invention provides a new tab structure for a head suspension assembly in a magnetic storage system. In the prior art method of assembly, a harness temporarily holds a wire assembly. The present invention eliminates the need for the harness, thereby reducing the number of parts and steps as well as improving productivity and quality. A flexure of a suspension assembly must be manufactured very precisely. The present invention provides a new tab structure either integral with or separate from the flexure. Wires bridge over to an extension on the tab structure at a predetermined distance from the end of the load beam. Positioning holes, using the extreme flatness of the tab structure, align the wires with the bonding pads of a head. The suspension assembly is subsequently bonded to the head, and the unwanted tab structure is removed to complete the head suspension assembly.

摘要翻译： 本发明提供了一种用于磁存储系统中的磁头悬挂组件的新的凸片结构。 在现有技术的组装方法中，线束暂时保持线组件。 本发明消除了对线束的需要，从而减少了部件和步骤的数量，并且提高了生产率和质量。 必须非常精确地制造悬架组件的弯曲。 本发明提供了与弯曲部一体或与挠曲件分离的新的凸片结构。 导线在距离负载梁的端部预定距离处跨接到翼片结构上的延伸部。 使用突片结构的极度平坦度的定位孔将导线与头部的接合垫对准。 悬挂组件随后结合到头部，并且去除不需要的翼片结构以完成头部悬挂组件。