公开(公告)号：US20070024371A1

公开(公告)日：2007-02-01

申请号：US11398627

申请日：2006-04-06

申请人： Seiki Gotou ,  Akira Inoue ,  Akira Ohta

发明人： Seiki Gotou ,  Akira Inoue ,  Akira Ohta

IPC分类号： H03F3/68

CPC分类号： H03F3/193 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/00014

摘要： A high frequency power amplifier includes: a multi-finger transistor including transistor cells electrically connected in parallel; an input side matching circuit connected to gate electrodes of the transistor cells; and resonant circuits, each resonant circuit being connected between a gate electrode of a respective one of the transistor cells and the input side matching circuit. The resonant circuits resonate at a second harmonic of the operational frequency of the transistor or at a frequency within a predetermined range centered at the second harmonic and act as a short circuit or exhibit low impedance as seen from the gate electrode.

公开(公告)号：US06833771B1

公开(公告)日：2004-12-21

申请号：US09717215

申请日：2000-11-22

申请人： Akira Ohta ,  Akira Inoue

发明人： Akira Ohta ,  Akira Inoue

IPC分类号： H03H738

CPC分类号： H04B1/04 ,  H03H7/38

摘要： A low impedance high efficiency amplifier is connected to a low impedance isolator. The low impedance high efficiency amplifier includes a plurality of amplifiers and an output matching circuit having a harmonic processing circuit arranged between a fundamental wave regulator circuit/a final stage amplifier and the low impedance isolator.

摘要翻译： 低阻抗高效率放大器连接到低阻抗隔离器。 低阻抗高效率放大器包括多个放大器和具有布置在基波调节器电路/末级放大器与低阻抗隔离器之间的谐波处理电路的输出匹配电路。

公开(公告)号：US06177841B1

公开(公告)日：2001-01-23

申请号：US09258069

申请日：1999-02-26

申请人： Akira Ohta ,  Akira Inoue ,  Tetsuya Heima

发明人： Akira Ohta ,  Akira Inoue ,  Tetsuya Heima

IPC分类号： H03F3191

CPC分类号： H03F3/601 ,  H01L2224/48091 ,  H03F1/0205 ,  H03F1/565 ,  H01L2924/00014

摘要： A high frequency power amplifier with reduced power loss and improved power amplification efficiency has an output matching circuit providing an open circuit to a second harmonic and a short circuit to a third harmonic of a high frequency signal. This is accomplished by, for example, adjusting lengths of a drain bias line and a plurality of signal lines so that the phase of S parameter S11 (input reflection coefficient) to the second harmonic is from −80° to 140°, and the phase of S parameter S11 to the third harmonic is from 160° to 220°. The line length of each line in an input matching circuit is also adjusted so that the phase of S parameter S22 (output reflection coefficient) at the fundamental frequency is between +5° to −75°.

摘要翻译： 具有降低的功率损耗和提高的功率放大效率的高频功率放大器具有输出匹配电路，其提供对二次谐波的开路和与高频信号的三次谐波的短路。 这通过例如调整漏极偏置线和多条信号线的长度来实现，使得S参数S11（输入反射系数）相对于二次谐波的相位为-80°至140°，相位 S参数S11与三次谐波的关系为160°〜220°。 也调整输入匹配电路中每条线的线路长度，使得基频下的S参数S22（输出反射系数）的相位在+ 5°至-75°之间。

公开(公告)号：US06998943B2

公开(公告)日：2006-02-14

申请号：US10756624

申请日：2004-01-14

申请人： Akira Ohta ,  Akira Inoue ,  Kazuhiro Ueda

发明人： Akira Ohta ,  Akira Inoue ,  Kazuhiro Ueda

IPC分类号： H01P3/08 ,  H01P5/00

CPC分类号： H05K1/0251 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0253 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/09845 ,  H01L2924/00

摘要： A second strip conductor is located, in a lamination direction of a multilayer substrate, at a is different position from that of a first strip conductor. A first grounding conductor and a second grounding conductor are disposed sequentially in the lamination direction of the multilayer substrate and sandwich the first strip conductor and the second strip conductor. The first grounding conductor includes a first grounding conductor portion for a wiring prohibited area in which no wiring may be placed, and a second grounding conductor portion for an area other than the wiring prohibited area. The second grounding conductor portion is positioned, in the lamination direction of the multilayer substrate, at a location is different from that of the first grounding conductor portion.

摘要翻译： 第二带状导体在多层基板的层叠方向上位于与第一带状导体的位置不同的位置。 第一接地导体和第二接地导体沿多层基板的层叠方向依次配置，并夹着第一带状导体和第二带状导体。 第一接地导体包括用于不布线的布线禁止区域的第一接地导体部分和除了布线禁止区域之外的区域的第二接地导体部分。 第二接地导体部在多层基板的层叠方向上位于与第一接地导体部的位置不同的位置。

公开(公告)号：US06876258B2

公开(公告)日：2005-04-05

申请号：US09987579

申请日：2001-11-15

申请人： Akira Ohta ,  Akira Inoue

发明人： Akira Ohta ,  Akira Inoue

IPC分类号： H03F3/60 ,  H01P1/203 ,  H03F3/189 ,  H03F3/193 ,  H03H7/01 ,  H04B1/04

CPC分类号： H01P1/2039 ,  H03F1/56 ,  H03F3/601 ,  H03F2200/387 ,  H03H7/0115

摘要： A high-frequency amplifier in a power amplifier module includes, on a substrate on which the amplifier is formed, first- and second-stage amplifiers for receiving and amplifying an input signal, a harmonic processing circuit for matching of harmonics included in an output signal from the second-stage amplifier, and a low-pass filter receiving an output from the harmonic processing circuit to selectively pass a signal to be supplied to a non-reciprocal circuit element using a predetermined frequency as a cutoff frequency.

摘要翻译： 功率放大器模块中的高频放大器在其上形成有放大器的基板上包括用于接收和放大输入信号的第一和第二级放大器，用于匹配包括在输出信号中的谐波的谐波处理电路 接收来自谐波处理电路的输出的低通滤波器，以选择性地将要提供给不可逆电路元件的信号作为截止频率使用预定频率。

公开(公告)号：US06600383B2

公开(公告)日：2003-07-29

申请号：US09729087

申请日：2000-12-05

申请人： Akira Ohta ,  Akira Inoue

发明人： Akira Ohta ,  Akira Inoue

IPC分类号： H01P132

CPC分类号： H01P1/36 ,  H01L2924/16152

摘要： A radio-frequency composite element includes an element substrate carrying a high-efficiency amplifier, a transmission line, and an isolator. The amplifier is a semiconductor element mounted on a multilayer substrate and enveloped by a cover. The transmission line furnished on the element substrate connecting an output terminal of the high-efficiency amplifier with an input terminal of the isolator, so that the components make up an integral composite element.

摘要翻译： 射频复合元件包括承载高效放大器，传输线和隔离器的元件衬底。 放大器是安装在多层基板上并由盖子包围的半导体元件。 配置在元件基板上的传输线，其将高效放大器的输出端子与隔离器的输入端子连接，使得这些部件构成一体的复合元件。

公开(公告)号：US07310019B2

公开(公告)日：2007-12-18

申请号：US11398627

申请日：2006-04-06

申请人： Seiki Gotou ,  Akira Inoue ,  Akira Ohta

发明人： Seiki Gotou ,  Akira Inoue ,  Akira Ohta

IPC分类号： H03F3/68

CPC分类号： H03F3/193 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/00014

摘要： A high frequency power amplifier includes: a multi-finger transistor including transistor cells electrically connected in parallel; an input side matching circuit connected to gate electrodes of the transistor cells; and resonant circuits, each resonant circuit being connected between a gate electrode of a respective one of the transistor cells and the input side matching circuit. The resonant circuits resonate at a second harmonic of the operational frequency of the transistor or at a frequency within a predetermined range centered at the second harmonic and act as a short circuit or exhibit low impedance as seen from the gate electrode.

摘要翻译： 高频功率放大器包括：多指晶体管，其包括并联电连接的晶体管单元; 连接到晶体管单元的栅电极的输入侧匹配电路; 和谐振电路，每个谐振电路连接在晶体管单元的相应一个的栅电极和输入侧匹配电路之间。 谐振电路以晶体管的工作频率的二次谐波或在以二次谐波为中心的预定范围内的频率谐振，并且作为短路或从栅极观察到的低阻抗。

公开(公告)号：US07061329B2

公开(公告)日：2006-06-13

申请号：US10792856

申请日：2004-03-05

申请人： Akira Inoue ,  Akira Ohta ,  Seiki Goto

发明人： Akira Inoue ,  Akira Ohta ,  Seiki Goto

IPC分类号： H03F3/191

CPC分类号： H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6644 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H03F1/565 ,  H03F3/602 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor chip for amplification is connected between input-side and output-side matching circuits, and each of matching circuits includes balanced circuits which receive signals different in phase by 180 degrees, divided from an input signal. The balanced circuits are connected at a virtual grounding point, which is used as a grounding point sensitive to RF characteristics in an IPD. Thus, a semiconductor device can be free from influence of variations of grounding wires and can be reduced in size, weight, and cost.

摘要翻译： 用于放大的半导体芯片连接在输入侧和输出侧匹配电路之间，并且每个匹配电路包括从输入信号中分离出相位不同180度的信号的平衡电路。 平衡电路连接在虚拟接地点，用作IPD中对RF特性敏感的接地点。 因此，半导体器件可以不受接地线的变化的影响，并且可以减小尺寸，重量和成本。

公开(公告)号：US06778020B2

公开(公告)日：2004-08-17

申请号：US10379557

申请日：2003-03-06

申请人： Akira Ohta ,  Shingo Matsuda ,  Akira Inoue ,  Seiki Goto

发明人： Akira Ohta ,  Shingo Matsuda ,  Akira Inoue ,  Seiki Goto

IPC分类号： H03F304

CPC分类号： H03F1/56 ,  H03F3/191

摘要： A resonance circuit of a transmission line and a capacitor is connected to the base circuit of a transistor. The transmission line is shorter than one-quarter wavelength to make the resonant frequency of the resonant circuit higher than the frequency of a second harmonic. As a result, the angle of the reflection coefficient of the second harmonic when an input matching circuit side is viewed from the input terminal of the transistor ranges from 170° to 270° on a polar chart, and phase difference between the fundamental wave of the base current and the second harmonic decreases.

摘要翻译： 传输线和电容器的谐振电路连接到晶体管的基极。 传输线短于四分之一波长，以使谐振电路的谐振频率高于二次谐波的频率。 结果，从极性图的晶体管的输入端子观察输入匹配电路侧的二次谐波的反射系数的角度在极坐标图上为170°〜270°，并且基波的相位差 基极电流和二次谐波减小。

公开(公告)号：US09037345B2

公开(公告)日：2015-05-19

申请号：US14001070

申请日：2012-03-08

申请人： Akira Inoue

发明人： Akira Inoue

IPC分类号： G06F3/14 ,  H04M1/725

CPC分类号： G06F3/1423 ,  H04M1/7253 ,  H04M1/72577

摘要： A mobile terminal displays a screen image provided by an image data which is produced. An in-vehicle apparatus is fixed to a vehicle or is mounted on the vehicle to be portable. The mobile terminal sends the image data to the in-vehicle apparatus through communication such that a vehicle display portion of the in-vehicle apparatus displays a screen image provided by the image data. In a case where a communication between the in-vehicle apparatus and the mobile terminal is established, when one of the mobile terminal or the in-vehicle apparatus, in which an input operation has been performed prior to the other of the mobile terminal or the in-vehicle apparatus, is in operation, only the one of the mobile terminal or the in-vehicle apparatus is operable.

摘要翻译： 移动终端显示由所生成的图像数据提供的屏幕图像。 车载设备固定在车辆上或安装在车辆上以便携带。 移动终端通过通信将图像数据发送到车载设备，使得车载设备的车辆显示部分显示由图像数据提供的屏幕图像。 在建立车载设备与移动终端之间的通信的情况下，当移动终端或车载设备中的一个在移动终端或另一个移动终端之前进行了输入操作时 车载设备正在操作中，只有移动终端或车载设备中的一个可操作。