Orientation optimization method of 2-pin logic cell
    11.
    发明授权
    Orientation optimization method of 2-pin logic cell 有权
    2引脚逻辑单元的方向优化方法

    公开(公告)号:US07913219B2

    公开(公告)日:2011-03-22

    申请号:US12147729

    申请日:2008-06-27

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5072

    摘要: In an orientation optimization, at least one signal chain path starting from a signal source and passing through a series of M 2-pin logic cells is located according to a netlist. An output of the Nth 2-pin logic cell in the series of M 2-pin logic cells, where N

    摘要翻译: 在取向优化中,根据网表定位从信号源开始并通过一系列M 2引脚逻辑单元的至少一个信号链路径。 将N

    Method for selectively controlling damascene CD bias
    12.
    发明授权
    Method for selectively controlling damascene CD bias 失效
    选择性控制镶嵌CD偏压的方法

    公开(公告)号:US06972258B2

    公开(公告)日:2005-12-06

    申请号:US10634086

    申请日:2003-08-04

    摘要: A method for selectively etching a semiconductor feature opening to controllably achieve a critical dimension accuracy including providing a semiconductor wafer including a first opening formed extending through a thickness of at least one dielectric insulating layer and having an uppermost inorganic BARC layer; depositing a photoresist layer over the uppermost BARC layer and patterning the photoresist layer to form an etching pattern for etching a second opening overlying and encompassing the first opening; carrying out a first plasma assisted etching process to etch through a thickness of the BARC layer including a predetermined amount of CO in a plasma etching chemistry to increase an etching resistance of the photoresist layer; and, carrying out a second plasma assisted etching process to etch through a thickness portion of the at least one dielectric insulating layer to form the second opening.

    摘要翻译: 一种用于选择性蚀刻半导体特征开口以可控地实现临界尺寸精度的方法,包括提供半导体晶片,所述半导体晶片包括延伸穿过至少一个介电绝缘层的厚度并具有最上层的无机BARC层的第一开口; 在最上层的BARC层上沉积光致抗蚀剂层并图案化光致抗蚀剂层以形成用于蚀刻覆盖并包围第一开口的第二开口的蚀刻图案; 执行第一等离子体辅助蚀刻工艺以在等离子体蚀刻化学中蚀刻包括预定量的CO的BARC层的厚度,以增加光致抗蚀剂层的耐腐蚀性; 以及进行第二等离子体辅助蚀刻工艺以蚀刻通过所述至少一个介电绝缘层的厚度部分以形成所述第二开口。

    Fin structure of fin field effect transistor
    15.
    发明授权
    Fin structure of fin field effect transistor 有权
    翅片场效应晶体管的鳍结构

    公开(公告)号:US09484462B2

    公开(公告)日:2016-11-01

    申请号:US12766233

    申请日:2010-04-23

    IPC分类号: H01L29/06 H01L29/78 H01L29/66

    摘要: An exemplary structure for the fin field effect transistor comprises a substrate comprising a major surface; a plurality of fin structures protruding from the major surface of the substrate, wherein each fin structure comprises an upper portion and a lower portion separated at a transition location at where the sidewall of the fin structure is at an angle of 85 degrees to the major surface of the substrate, wherein the upper portion has sidewalls that are substantially perpendicular to the major surface of the substrate and a top surface having a first width, wherein the lower portion has tapered sidewalls on opposite sides of the upper portion and a base having a second width larger than the first width; and a plurality of isolation structures between the fin structures, wherein each isolation structure extends from the major surface of the substrate to a point above the transition location.

    摘要翻译: 鳍状场效应晶体管的示例性结构包括:包括主表面的衬底; 多个翅片结构,从所述基底的主表面突出,其中每个翅片结构包括在翅片结构的侧壁与主表面成85度角的过渡位置处分离的上部和下部 ,其中所述上部具有基本上垂直于所述基底的主表面的侧壁和具有第一宽度的顶表面,其中所述下部具有在所述上部的相对侧上的锥形侧壁和具有第二宽度的基部 宽度大于第一宽度; 以及在翅片结构之间的多个隔离结构,其中每个隔离结构从基板的主表面延伸到过渡位置上方的点。

    Silicide formation and associated devices
    16.
    发明授权
    Silicide formation and associated devices 有权
    硅化物形成和相关设备

    公开(公告)号:US08466027B2

    公开(公告)日:2013-06-18

    申请号:US13227979

    申请日:2011-09-08

    IPC分类号: H01L21/336

    摘要: Improved silicide formation and associated devices are disclosed. An exemplary method includes providing a semiconductor material having spaced source and drain regions therein, forming a gate structure interposed between the source and drain regions, performing a gate replacement process on the gate structure to form a metal gate electrode therein, forming a hard mask layer over the metal gate electrode, forming silicide layers on the respective source and drain regions in the semiconductor material, removing the hard mask layer to expose the metal gate electrode, and forming source and drain contacts, each source and drain contact being conductively coupled to a respective one of the silicide layers.

    摘要翻译: 公开了改进的硅化物形成和相关装置。 一种示例性方法包括提供其间具有间隔的源极和漏极区域的半导体材料,形成插入在源极和漏极区域之间的栅极结构,在栅极结构上执行栅极替换处理以在其中形成金属栅电极,形成硬掩模层 在所述金属栅极电极上,在所述半导体材料中的相应源极和漏极区域上形成硅化物层,去除所述硬掩模层以暴露所述金属栅电极,以及形成源极和漏极接触,每个源极和漏极接触导电耦合到 相应的一个硅化物层。

    CMOS Device with Raised Source and Drain Regions
    17.
    发明申请
    CMOS Device with Raised Source and Drain Regions 审中-公开
    CMOS器件具有引出源和漏极区域

    公开(公告)号:US20110298049A1

    公开(公告)日:2011-12-08

    申请号:US13210993

    申请日:2011-08-16

    IPC分类号: H01L27/092

    摘要: A semiconductor structure includes a semiconductor substrate comprising a PMOS region and an NMOS region; a PMOS device in the PMOS region; and an NMOS device in the NMOS region. The PMOS device includes a first gate stack on the semiconductor substrate; a first offset spacer on a sidewall of the first gate stack; a stressor in the semiconductor substrate and adjacent to the first offset spacer; and a first raised source/drain extension region on the stressor and adjoining the first offset spacer, wherein the first raised source/drain extension region has a higher p-type dopant concentration than the stressor. The NMOS device in the NMOS region includes a second gate stack on the semiconductor substrate; a second offset spacer on a sidewall of the second gate stack; a second raised source/drain extension region on the semiconductor substrate and adjoining the second offset spacer; and a deep source/drain region adjoining the second raised source/drain extension region, wherein the deep source/drain region is free from stressors formed in the semiconductor substrate.

    摘要翻译: 半导体结构包括:包括PMOS区域和NMOS区域的半导体衬底; PMOS区域中的PMOS器件; 和NMOS区域中的NMOS器件。 PMOS器件包括在半导体衬底上的第一栅叠层; 在所述第一栅极堆叠的侧壁上的第一偏移间隔物; 所述半导体衬底中的应力源并且与所述第一偏移间隔物相邻; 以及在所述应力器上并与所述第一偏移间隔物邻接的第一升高的源极/漏极延伸区域,其中所述第一升高的源极/漏极延伸区域具有比所述应力源更高的p型掺杂剂浓度。 NMOS区域中的NMOS器件包括在半导体衬底上的第二栅极堆叠; 在所述第二栅极堆叠的侧壁上的第二偏移间隔物; 在所述半导体衬底上的第二凸起的源极/漏极延伸区域,并邻接所述第二偏移间隔物; 以及与第二升高源极/漏极延伸区域相邻的深源极/漏极区域,其中深的源极/漏极区域没有形成在半导体衬底中的应力源。

    STI Shape Near Fin Bottom of Si Fin in Bulk FinFET
    18.
    发明申请
    STI Shape Near Fin Bottom of Si Fin in Bulk FinFET 有权
    在散装FinFET中的Si Fin附近的STI形状的STI形状

    公开(公告)号:US20110097889A1

    公开(公告)日:2011-04-28

    申请号:US12843693

    申请日:2010-07-26

    IPC分类号: H01L21/28

    摘要: A method of forming an integrated circuit structure includes providing a semiconductor substrate including a top surface; forming a first insulation region and a second insulation region in the semiconductor substrate; and recessing the first insulation region and the second insulation region. Top surfaces of remaining portions of the first insulation region and the second insulation region are flat surfaces or divot surfaces. A portion of the semiconductor substrate between and adjoining removed portions of the first insulation region and the second insulation region forms a fin.

    摘要翻译: 形成集成电路结构的方法包括提供包括顶表面的半导体衬底; 在所述半导体衬底中形成第一绝缘区域和第二绝缘区域; 并使第一绝缘区域和第二绝缘区域凹陷。 第一绝缘区域和第二绝缘区域的剩余部分的顶表面是平坦表面或表面。 第一绝缘区域和第二绝缘区域的相邻去除部分之间的半导体衬底的一部分形成翅片。

    CMOS devices with graded silicide regions
    19.
    发明授权
    CMOS devices with graded silicide regions 有权
    具有分级硅化物区域的CMOS器件

    公开(公告)号:US07545006B2

    公开(公告)日:2009-06-09

    申请号:US11496857

    申请日:2006-08-01

    IPC分类号: H01L29/76

    摘要: A semiconductor device includes a semiconductor substrate, a gate stack overlying the semiconductor substrate, a spacer on a sidewall of the gate stack, a lightly doped source/drain (LDD) region adjacent the gate stack, a deep source/drain region adjoining the LDD region, and a graded silicide region on the deep source/drain region and the LDD region. The graded silicide region includes a first portion having a first thickness and a second portion adjoining the first portion and having a second thickness substantially less than the first thickness. The second portion is closer to a channel region than the first portion.

    摘要翻译: 半导体器件包括半导体衬底,覆盖半导体衬底的栅极堆叠,栅叠层的侧壁上的间隔物,邻近栅叠层的轻掺杂源/漏(LDD)区,与LDD相邻的深源/漏区 区域,以及深源极/漏极区域和LDD区域上的渐变硅化物区域。 分级硅化物区域包括具有第一厚度的第一部分和与第一部分相邻并具有基本上小于第一厚度的第二厚度的第二部分。 第二部分比第一部分更靠近通道区域。

    Method and apparatus for integrating ACPI functionality and power button functionality into a single power key
    20.
    发明授权
    Method and apparatus for integrating ACPI functionality and power button functionality into a single power key 失效
    将ACPI功能和电源按钮功能集成到单个电源键中的方法和设备

    公开(公告)号:US07472291B2

    公开(公告)日:2008-12-30

    申请号:US11106493

    申请日:2005-04-15

    IPC分类号: G06F1/00 G06F1/26 G06F1/32

    CPC分类号: G06F1/3215

    摘要: A power-managing key apparatus uses a power key to integrate the function of ACPI management of computer hardware and hibernation on/off of operation system. A processor coupled to the power key detects pressing-time parameters of the power key and a current state of the computer. The processor sends a hardware signal to emulate ACPI power button function in order to power on/off computer and awake the computer from a power saving mode. The processor sends a software signal to an operation system of the computer to disable/enable a hibernation state. Therefore, the complicated power management performed by computer hardware and operation system can be simplified.

    摘要翻译: 电源管理密钥设备使用电源密钥来整合计算机硬件的ACPI管理功能和操作系统的休眠模式。 耦合到电源键的处理器检测电源键的按压时间参数和计算机的当前状态。 处理器发送硬件信号以模拟ACPI电源按钮功能,以便打开/关闭计算机,并从计算机唤醒电脑。 处理器将软件信号发送到计算机的操作系统以禁用/启用休眠状态。 因此,可以简化由计算机硬件和操作系统执行的复杂功率管理。