公开(公告)号：US20240272355A1

公开(公告)日：2024-08-15

申请号：US18640293

申请日：2024-04-19

Applicant: IBIDEN CO., LTD.

Inventor： Masatoshi KUNIEDA

IPC: G02B6/122 ,  H01L23/00 ,  H01L23/498 ,  H01L25/16

CPC classification number: G02B6/122 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/167 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16227

Abstract: A wiring substrate includes an electrical wiring part including insulating layers and conductor layers, and an optical wiring part formed on a surface of the electrical wiring part and including a support plate and an optical waveguide formed on the support plate. The optical wiring part is formed such that the optical waveguide includes at least one core part that transmits light and a cladding part surrounding the at least one core part and that the support plate has a thermal expansion coefficient that is lower than a thermal expansion coefficient of the optical waveguide.

公开(公告)号：US20230007771A1

公开(公告)日：2023-01-05

申请号：US17809373

申请日：2022-06-28

Applicant: IBIDEN CO., LTD.

Inventor： Masatoshi KUNIEDA

IPC: H05K1/11 ,  H05K1/02

Abstract: A wiring substrate includes an insulating layer, a conductor layer formed on surface of the insulating layer and including a conductor pad, a covering layer covering a portion of the insulating layer, an optical waveguide positioned on the surface of the insulating layer and including core part, and a conductor post including plating metal and formed on the conductor pad such that the post is penetrating through the covering layer and connected to a component. The insulating layer has component region covered by the component when the component is connected, the core part has side surface extending in direction along the surface of the insulating layer, the side surface has an exposed portion exposed in the component region and facing the opposite direction with respect to the insulating layer, and distance between the exposed portion and the surface of the insulating layer is greater than thickness of the covering layer.

公开(公告)号：US20170027057A1

公开(公告)日：2017-01-26

申请号：US15216735

申请日：2016-07-22

Applicant: IBIDEN CO., LTD.

Inventor： Masatoshi KUNIEDA ,  Takafumi OKUMURA

IPC: H05K1/11 ,  H01L23/31 ,  H05K1/09 ,  H01L23/00 ,  H05K3/18 ,  H05K3/42

CPC classification number: H05K1/115 ,  H01L23/3114 ,  H01L24/14 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H05K3/185 ,  H05K3/422 ,  H05K3/424 ,  H05K2201/09545 ,  H05K2201/09627 ,  H05K2201/09645 ,  H05K2203/0723

Abstract: A method for manufacturing a printed wiring board includes forming, on a surface of an insulating layer, a patterned catalyst film including a catalyst for electroless plating such that the patterned catalyst film has a pattern corresponding to a conductor circuit, and applying electroless plating on the patterned catalyst film such that a conductor metal is deposited on the patterned catalyst film and that the conductor circuit is formed on the surface of the insulating layer.

Abstract translation: 一种制造印刷电路板的方法包括在绝缘层的表面上形成图案化催化剂膜，该图案化催化剂膜包括用于化学镀的催化剂，使得图案化的催化剂膜具有与导体电路相对应的图案，并且在 图案化的催化剂膜，使得导体金属沉积在图案化的催化剂膜上，并且导体电路形成在绝缘层的表面上。

公开(公告)号：US20150264817A1

公开(公告)日：2015-09-17

申请号：US14723520

申请日：2015-05-28

Applicant: IBIDEN CO., LTD.

Inventor： Makoto TERUI ,  Daiki KOMATSU ,  Masatoshi KUNIEDA ,  Takashi KARIYA

IPC: H05K3/30 ,  H01L23/00 ,  H05K3/32 ,  H05K3/20 ,  H05K3/10 ,  H05K3/46 ,  H01L25/00 ,  H01L23/498

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5382 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/03 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2924/12042 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/115 ,  H05K3/10 ,  H05K3/103 ,  H05K3/20 ,  H05K3/32 ,  H05K3/4602 ,  H05K3/4658 ,  H05K3/4694 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/1053 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2924/014

Abstract: A method for manufacturing a wiring board includes positioning on a first insulation layer a wiring structure including an insulation layer and conductive patterns formed on the insulation layer, forming a second insulation layer on the first insulation layer and the wiring structure such that the wiring structure is interposed between the first insulation layer and the second insulation layer, forming a via conductor through the second insulation layer, and forming conductive patterns on the second insulation layer such that one of the conductive patterns on the second insulation layer is connected to the via conductor in the second insulation layer.

Abstract translation: 一种布线基板的制造方法，其特征在于，在第一绝缘层上具有绝缘层和形成于绝缘层上的导电图案的布线结构，在第一绝缘层和布线结构上形成第二绝缘层，使布线结构为 插入在第一绝缘层和第二绝缘层之间，通过第二绝缘层形成通孔导体，并且在第二绝缘层上形成导电图案，使得第二绝缘层上的导电图案之一连接到通孔导体 第二绝缘层。