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公开(公告)号:US09348099B2
公开(公告)日:2016-05-24
申请号:US14335756
申请日:2014-07-18
Applicant: Intel Corporation
Inventor: Mahesh Krishnamurthi , Judson Ryckman , Haisheng Rong , Ling Liao , Harel Frish , Oshrit Harel , Assia Barkai , Yun-Chung Na , Han-Din Liu
CPC classification number: G02B6/122 , G02B6/12002 , G02B6/1228 , G02B6/132 , G02B6/136 , G02B6/4214 , G02B6/4296 , G02B2006/12061 , G02B2006/121 , G02B2006/12104 , G02B2006/12147 , G02B2006/12152
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler. In some embodiments, the device may include an optical waveguide to transmit light input from a light source. The optical waveguide may include a semiconductor layer, having a trench with one facet that comprises an edge formed under an approximately 45 degree angle and another facet formed substantially normal to the semiconductor layer. The edge may interface with another medium to form a mirror to receive inputted light and reflect received light substantially perpendicularly to propagate the received light. Other embodiments may be described and/or claimed.
Abstract translation: 本公开的实施例涉及用于光耦合器的技术和配置。 在一些实施例中,该装置可以包括用于透射从光源输入的光的光波导。 光波导可以包括具有一个沟槽的半导体层,该沟槽包括形成在大约45度角的边缘,以及基本垂直于半导体层形成的另一个小面。 边缘可以与另一介质接合以形成反射镜以接收输入的光并且基本垂直地反射接收的光以传播接收到的光。 可以描述和/或要求保护其他实施例。
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公开(公告)号:US09250388B1
公开(公告)日:2016-02-02
申请号:US14334260
申请日:2014-07-17
Applicant: Intel Corporation
Inventor: Mahesh Krishnamurthi , I-Wei Hsieh , Haisheng Rong , Oshrit Harel , Harel Frish , Assia Barkai , Wenhua Lin
IPC: G02B6/12 , H01L21/30 , G02B6/132 , G02B6/136 , G02B6/34 , G02B6/26 , C03C15/00 , C23F1/00 , B29D11/00 , G02B6/293
CPC classification number: G02B6/29328 , G02B6/12004 , G02B6/12007 , G02B6/124 , G02B6/136 , G02B6/29308 , G02B6/2931 , G02B6/2938 , G02B2006/12061 , G02B2006/12097 , G02B2006/121 , G02B2006/12104 , G02B2006/12107 , G02B2006/12121 , G02B2006/12176 , H04B10/501
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical device having a semiconductor layer to propagate light and a mirror disposed inside the semiconductor layer and having echelle grating reflective surface to substantially totally internally reflect the propagating light inputted by one or more input waveguides, to be received by one or more output waveguides. The waveguides may be disposed in the semiconductor layer under a determined angle relative to the mirror reflective surface. The determined angle may be equal to or greater than a total internal reflection angle corresponding to the interface, to provide substantially total internal reflection of light by the mirror. The mirror may be formed by an interface of the semiconductor layer comprising the mirror reflective surface and another medium filling the mirror, such as a dielectric. Other embodiments may be described and/or claimed.
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公开(公告)号:US20160018610A1
公开(公告)日:2016-01-21
申请号:US14335756
申请日:2014-07-18
Applicant: Intel Corporation
Inventor: MAHESH KRISHNAMURTHI , Judson Ryckman , Haisheng Rong , Ling Liao , Harel Frish , Oshrit Harel , Assia Barkai , Shu-Lu Chen , Yun-Chung Na , Han-Din Liu
IPC: G02B6/42
CPC classification number: G02B6/122 , G02B6/12002 , G02B6/1228 , G02B6/132 , G02B6/136 , G02B6/4214 , G02B6/4296 , G02B2006/12061 , G02B2006/121 , G02B2006/12104 , G02B2006/12147 , G02B2006/12152
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler. In some embodiments, the device may include an optical waveguide to transmit light input from a light source. The optical waveguide may include a semiconductor layer, having a trench with one facet that comprises an edge formed under an approximately 45 degree angle and another facet formed substantially normal to the semiconductor layer. The edge may interface with another medium to form a mirror to receive inputted light and reflect received light substantially perpendicularly to propagate the received light. Other embodiments may be described and/or claimed.
Abstract translation: 本公开的实施例涉及用于光耦合器的技术和配置。 在一些实施例中,该装置可以包括用于透射从光源输入的光的光波导。 光波导可以包括具有一个沟槽的半导体层,该沟槽包括形成在大约45度角的边缘,以及基本垂直于半导体层形成的另一个小面。 边缘可以与另一介质接合以形成反射镜以接收输入的光并且基本垂直地反射接收的光以传播接收到的光。 可以描述和/或要求保护其他实施例。
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公开(公告)号:US12197004B2
公开(公告)日:2025-01-14
申请号:US17358912
申请日:2021-06-25
Applicant: Intel Corporation
Inventor: Harel Frish , John Heck , Randal Appleton , Stefan Meister , Haisheng Rong , Joshua Keener , Michael Favaro , Wesley Harrison , Hari Mahalingam , Sergei Sochava
Abstract: Silicon photonic integrated circuit (PIC) on a multi-zone semiconductor on insulator (SOI) substrate having at least a first zone and a second zone. Various optical devices of the PIC may be located above certain substrate zones that are most suitable. A first length of a photonic waveguide structure comprises the crystalline silicon and is within the first zone, while a second length of the waveguide structure is within the second zone. Within a first zone, the crystalline silicon layer is spaced apart from an underlying substrate material by a first thickness of dielectric material. Within the second zone, the crystalline silicon layer is spaced apart from the underlying substrate material by a second thickness of the dielectric material.
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公开(公告)号:US20240345319A1
公开(公告)日:2024-10-17
申请号:US18750754
申请日:2024-06-21
Applicant: Intel Corporation
Inventor: Hari Mahalingam , Harel Frish , Sean McCargar , Joshua Keener , Shane Yerkes , John Heck , Ling Liao
CPC classification number: G02B6/1228 , G02B6/13 , G02B6/26 , G02B6/305
Abstract: Embodiments of the present disclosure are directed to low numerical aperture (NA) optical couplers, or spot size converters, that include a lateral taper section and/or a vertical adiabatic taper section. In embodiments, the optical couplers may be positioned on a silicon substrate proximate to V-grooves within the substrate to contain optical fibers to self-align and to couple with the optical couplers. Other embodiments may be described and/or claimed.
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公开(公告)号:US12019270B2
公开(公告)日:2024-06-25
申请号:US17004429
申请日:2020-08-27
Applicant: Intel Corporation
Inventor: Hari Mahalingam , Harel Frish , Sean McCargar , Joshua Keener , Shane Yerkes , John Heck , Ling Liao
CPC classification number: G02B6/1228 , G02B6/13 , G02B6/26 , G02B6/305
Abstract: Embodiments of the present disclosure are directed to low numerical aperture (NA) optical couplers, or spot size converters, that include a lateral taper section and/or a vertical adiabatic taper section. In embodiments, the optical couplers may be positioned on a silicon substrate proximate to V-grooves within the substrate to contain optical fibers to self-align and to couple with the optical couplers. Other embodiments may be described and/or claimed.
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公开(公告)号:US11908687B2
公开(公告)日:2024-02-20
申请号:US17563968
申请日:2021-12-28
Applicant: Intel Corporation
Inventor: Khaled Ahmed , Anup Pancholi , John Heck , Thomas Sounart , Harel Frish , Sansaptak Dasgupta
IPC: H01L21/00 , H01L21/02 , H01L21/8234 , H01L21/8222
CPC classification number: H01L21/02458 , H01L21/02389 , H01L21/02452 , H01L21/8222 , H01L21/823418
Abstract: A device includes a layer including a first III-Nitride (III-N) material, a channel layer including a second III-N material, a release layer including nitrogen and a transition metal, where the release layer is between the first III-N material and the second III-N material. The device further includes a polarization layer including a third III-N material above the release layer, a gate structure above the polarization layer, a source structure and a drain structure on opposite sides of the gate structure where the source structure and the drain structure each include a fourth III-N material. The device further includes a source contact on the source structure and a drain contact on the drain structure.
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公开(公告)号:US11251228B2
公开(公告)日:2022-02-15
申请号:US16225130
申请日:2018-12-19
Applicant: Intel Corporation
Inventor: Boping Xie , Ansheng Liu , Olufemi Isiade Dosunmu , Alexander Krichevsky , Kelly Christopher Magruder , Harel Frish
Abstract: Optical receiver packages and device assemblies that include photodetector (PD) chips having focus lenses monolithically integrated on PD die backsides are disclosed. An example receiver package includes a support structure, a PD die, and an optical input device. The PD die includes a PD, integrated proximate to a first face of the PD die, and further includes a lens, integrated on, or proximate to, an opposite second face. The first face of the PD die faces the support structure, while the second face (“backside”) faces the optical input device. The optical receiver architectures described herein may provide an improvement for the optical alignment tolerance issues, especially for high-speed operation in which the active aperture of the PD may have to be very small. Furthermore, architectures described herein advantageously enable integrating a focus lens in a PD die that may be coupled to the support structure in a flip-chip arrangement.
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公开(公告)号:US11217964B2
公开(公告)日:2022-01-04
申请号:US16236211
申请日:2018-12-28
Applicant: Intel Corporation
Inventor: Pierre Doussiere , George A. Ghiurcan , Jonathan K. Doylend , Harel Frish
IPC: H01S5/02 , H01S5/065 , H04J14/02 , H04B10/25 , H01S5/40 , G02B6/122 , H01S5/0683 , H04B10/50 , G02B6/42 , G02B6/12
Abstract: There is disclosed in one example a fiberoptic communication device, including: a modulator to modulate data onto a laser pulse; and a semiconductor laser source including an active optical waveguide to provide optical gain and support an optical mode, the laser source further including a V-shaped current channel superimposed on the optical waveguide, and disposed to feed the active optical waveguide with electrical current along its length, the current channel having a proximate end to the optical mode, the proximate end having a width substantially matching a diameter of the optical mode, and a removed end from the optical mode, wherein the removed end is substantially wider than the proximate end.
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公开(公告)号:US10996408B2
公开(公告)日:2021-05-04
申请号:US16517159
申请日:2019-07-19
Applicant: Intel Corporation
Inventor: John Heck , Harel Frish , Reece DeFrees , George A. Ghiurcan , Hari Mahalingam , Pegah Seddighian
Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler including an optical waveguide to guide light to an optical fiber. In embodiments, the optical waveguide includes a tapered segment to propagate the received light to the optical fiber. In embodiments, the tapered segment is buried below a surface of a semiconductor substrate to transition the received light within the semiconductor substrate from a first optical mode to a second optical mode to reduce a loss of light during propagation of the received light from the optical waveguide to the optical fiber. In embodiments, the surface of the semiconductor substrate comprises a bottom planar surface of a silicon photonic chip that includes at least one or more of passive or active photonic components. Other embodiments may be described and/or claimed.
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