Optical coupler
    11.
    发明授权
    Optical coupler 有权
    光耦合器

    公开(公告)号:US09348099B2

    公开(公告)日:2016-05-24

    申请号:US14335756

    申请日:2014-07-18

    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler. In some embodiments, the device may include an optical waveguide to transmit light input from a light source. The optical waveguide may include a semiconductor layer, having a trench with one facet that comprises an edge formed under an approximately 45 degree angle and another facet formed substantially normal to the semiconductor layer. The edge may interface with another medium to form a mirror to receive inputted light and reflect received light substantially perpendicularly to propagate the received light. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例涉及用于光耦合器的技术和配置。 在一些实施例中,该装置可以包括用于透射从光源输入的光的光波导。 光波导可以包括具有一个沟槽的半导体层,该沟槽包括形成在大约45度角的边缘,以及基本垂直于半导体层形成的另一个小面。 边缘可以与另一介质接合以形成反射镜以接收输入的光并且基本垂直地反射接收的光以传播接收到的光。 可以描述和/或要求保护其他实施例。

    OPTICAL COUPLER
    13.
    发明申请
    OPTICAL COUPLER 有权
    光耦合器

    公开(公告)号:US20160018610A1

    公开(公告)日:2016-01-21

    申请号:US14335756

    申请日:2014-07-18

    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler. In some embodiments, the device may include an optical waveguide to transmit light input from a light source. The optical waveguide may include a semiconductor layer, having a trench with one facet that comprises an edge formed under an approximately 45 degree angle and another facet formed substantially normal to the semiconductor layer. The edge may interface with another medium to form a mirror to receive inputted light and reflect received light substantially perpendicularly to propagate the received light. Other embodiments may be described and/or claimed.

    Abstract translation: 本公开的实施例涉及用于光耦合器的技术和配置。 在一些实施例中,该装置可以包括用于透射从光源输入的光的光波导。 光波导可以包括具有一个沟槽的半导体层,该沟槽包括形成在大约45度角的边缘,以及基本垂直于半导体层形成的另一个小面。 边缘可以与另一介质接合以形成反射镜以接收输入的光并且基本垂直地反射接收的光以传播接收到的光。 可以描述和/或要求保护其他实施例。

    Optical receiver package with backside lens-integrated photodetector die

    公开(公告)号:US11251228B2

    公开(公告)日:2022-02-15

    申请号:US16225130

    申请日:2018-12-19

    Abstract: Optical receiver packages and device assemblies that include photodetector (PD) chips having focus lenses monolithically integrated on PD die backsides are disclosed. An example receiver package includes a support structure, a PD die, and an optical input device. The PD die includes a PD, integrated proximate to a first face of the PD die, and further includes a lens, integrated on, or proximate to, an opposite second face. The first face of the PD die faces the support structure, while the second face (“backside”) faces the optical input device. The optical receiver architectures described herein may provide an improvement for the optical alignment tolerance issues, especially for high-speed operation in which the active aperture of the PD may have to be very small. Furthermore, architectures described herein advantageously enable integrating a focus lens in a PD die that may be coupled to the support structure in a flip-chip arrangement.

    Optical device including buried optical waveguides and output couplers

    公开(公告)号:US10996408B2

    公开(公告)日:2021-05-04

    申请号:US16517159

    申请日:2019-07-19

    Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler including an optical waveguide to guide light to an optical fiber. In embodiments, the optical waveguide includes a tapered segment to propagate the received light to the optical fiber. In embodiments, the tapered segment is buried below a surface of a semiconductor substrate to transition the received light within the semiconductor substrate from a first optical mode to a second optical mode to reduce a loss of light during propagation of the received light from the optical waveguide to the optical fiber. In embodiments, the surface of the semiconductor substrate comprises a bottom planar surface of a silicon photonic chip that includes at least one or more of passive or active photonic components. Other embodiments may be described and/or claimed.

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