公开(公告)号：US11906777B2

公开(公告)日：2024-02-20

申请号：US16797657

申请日：2020-02-21

Applicant: Intel Corporation

Inventor： John Heck ,  Lina He ,  Sungbong Park ,  Olufemi Isiade Dosunmu ,  Harel Frish ,  Kelly Christopher Magruder ,  Seth M. Slavin ,  Wei Qian ,  Ansheng Liu ,  Nutan Gautam ,  Mark Isenberger

IPC: G02B6/12 ,  H04J14/02 ,  G02B6/122

CPC classification number: G02B6/12007 ,  G02B6/12004 ,  G02B6/1228 ,  H04J14/02 ,  G02B2006/12061

Abstract: Embodiments may relate to a wavelength-division multiplexing (WDM) transceiver that has a silicon waveguide layer coupled with a silicon nitride waveguide layer. In some embodiments, the silicon waveguide layer may include a tapered portion that is coupled with the silicon nitride waveguide layer. In some embodiments, the silicon waveguide layer may be coupled with a first oxide layer with a first z-height, and the silicon nitride waveguide layer may be coupled with a second oxide layer with a second z-height that is greater than the first z-height. Other embodiments may be described or claimed.

公开(公告)号：US11894474B2

公开(公告)日：2024-02-06

申请号：US16562889

申请日：2019-09-06

Applicant: Intel Corporation

Inventor： Priyanka Dobriyal ,  Ankur Agrawal ,  Susheel Jadhav ,  Quan Tran ,  Raghuram Narayan ,  Raiyomand Aspandiar ,  Kenneth Brown ,  John Heck

IPC: H01L31/02 ,  H01L31/0232 ,  G02B3/00 ,  H01L31/0216 ,  H01L25/16 ,  H01L31/18 ,  G02B1/11 ,  G02B6/42 ,  H01L23/538 ,  G02B6/24

CPC classification number: H01L31/02327 ,  G02B1/11 ,  G02B3/0012 ,  G02B3/0056 ,  G02B6/428 ,  H01L23/5385 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/02161 ,  H01L31/1876 ,  G02B6/241

Abstract: Embodiments disclosed herein include optoelectronic systems and methods of forming such systems. In an embodiment the optoelectronic system comprises a board, and a carrier attached to the board. In an embodiment, a first die is on the carrier. In an embodiment, the first die is a photonics die, and a surface of the first die is covered by an optically transparent layer.

公开(公告)号：US20220413213A1

公开(公告)日：2022-12-29

申请号：US17358912

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Harel Frish ,  John Heck ,  Randal Appleton ,  Stefan Meister ,  Haisheng Rong ,  Joshua Keener ,  Michael Favaro ,  Wesley Harrison ,  Hari Mahalingam ,  Sergei Sochava

IPC: G02B6/12 ,  H01S5/026 ,  G02B6/122

Abstract: Silicon photonic integrated circuit (PIC) on a multi-zone semiconductor on insulator (SOI) substrate having at least a first zone and a second zone. Various optical devices of the PIC may be located above certain substrate zones that are most suitable. A first length of a photonic waveguide structure comprises the crystalline silicon and is within the first zone, while a second length of the waveguide structure is within the second zone. Within a first zone, the crystalline silicon layer is spaced apart from an underlying substrate material by a first thickness of dielectric material. Within the second zone, the crystalline silicon layer is spaced apart from the underlying substrate material by a second thickness of the dielectric material.

公开(公告)号：US10914874B2

公开(公告)日：2021-02-09

申请号：US16793740

申请日：2020-02-18

Applicant: Intel Corporation

Inventor： Khaled Ahmed ,  John Heck ,  Ramon Cancel Olmo ,  Richmond Hicks ,  Olga Gorbounova

IPC: G02B5/02 ,  G02B6/42 ,  G02B6/30

Abstract: Disclosed herein are display and photonic devices utilizing metasurfaces. An optical device comprising an optical component and an optical transmission medium is disclosed. A waveguide couples the optical component and the optical transmission medium. A metasurface is disposed on an end of the waveguide and arranged to increase an optical coupling between the waveguide and the optical transmission medium. Additionally, a display comprising a number of light emitting elements and a metasurface for each of the light emitting elements. The metasurface arranged to eliminate screen door effect in virtual reality display systems.

公开(公告)号：US10466515B2

公开(公告)日：2019-11-05

申请号：US15071105

申请日：2016-03-15

Applicant: Intel Corporation

Inventor： John Heck ,  David N. Hutchison ,  Jie Sun ,  Haisheng Rong ,  Woosung Kim

IPC: G02B6/13 ,  G02B6/12 ,  G02B6/27 ,  G02B6/293 ,  G02F1/095 ,  H01S5/00 ,  G02B6/132 ,  G02F1/00

Abstract: Embodiments herein relate to photonic integrated circuits with an on-chip optical isolator. A photonic transmitter chip may include a laser and an on-chip isolator optically coupled with the laser that includes an optical waveguide having a section coupled with a magneto-optic liquid phase epitaxy grown garnet film. In some embodiments, a cladding may be coupled with the garnet film, the on-chip isolator may be arranged in a Mach-Zehnder interferometer configuration, the waveguide may include one or more polarization rotators, and/or the garnet film may be formed of a material from a rare-earth garnet family. Other embodiments may be described and/or claimed.

公开(公告)号：US20190121036A1

公开(公告)日：2019-04-25

申请号：US16225248

申请日：2018-12-19

Applicant: Intel Corporation

Inventor： John Heck ,  Hari Mahalingam ,  Paul Yu ,  Kumar Satya Harinadh Potluri

IPC: G02B6/42

Abstract: In various embodiments, optical fibers may be placed into V-shaped grooves in a substrate. A lid may then be placed on top of the optical fibers to hold them accurately in place, and the lid may be attached to the substrate using a reflow solder technique. Epoxy may then be applied as a strain relief. Because the V-shaped grooves and optical waveguides are manufactured with precision on the same substrate, precise alignment between these two may be achieved. Because the epoxy is applied after reflow, the epoxy may not be exposed to reflow temperatures, which might otherwise cause the epoxy to distort during the cure process.

公开(公告)号：US20160195397A1

公开(公告)日：2016-07-07

申请号：US14106158

申请日：2013-12-13

Applicant: Intel Corporation

Inventor： Suraj Bramhavar ,  David N. Hutchison ,  John Heck

IPC: G01C19/72 ,  G01C19/56 ,  G01D5/353

CPC classification number: G01C19/722 ,  G01C19/56 ,  G01C19/5719 ,  G01D5/35374 ,  G01P15/093 ,  G01P2015/084 ,  G02B6/4225

Abstract: Embodiments of the present disclosure are directed towards a micro-electromechanical system (MEMS) sensing apparatus, including a laser arrangement configured to generate a light beam, a first waveguide configured to receive and output the light beam, and a second waveguide aligned endface to endface with the first waveguide. The second waveguide may be configured to receive at least a portion of the light beam from the first waveguide via optical coupling through the aligned endfaces. Either the first or second waveguide may be configured to be moveable in response to an inertial change of the apparatus, wherein movement of the first or second waveguide causes a corresponding change in light intensity of the portion of the light beam, the change in light intensity indicating a measure of the inertial change. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及一种微机电系统（MEMS）感测装置，其包括被配置为产生光束的激光装置，被配置为接收和输出光束的第一波导，以及将端面与端面对准的第二波导 与第一波导。 第二波导可以被配置为通过经由对准的端面的光耦合来接收来自第一波导的光束的至少一部分。 第一或第二波导可以被配置为响应于设备的惯性变化而可移动，其中第一或第二波导的移动导致光束部分的光强度的相应变化，光强度的变化 表明惯性变化的度量。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09285391B2

公开(公告)日：2016-03-15

申请号：US14106259

申请日：2013-12-13

Applicant: Intel Corporation

Inventor： David N. Hutchison ,  John Heck

IPC: G01B9/02 ,  G01P15/093 ,  G01C19/56 ,  G01P15/08

CPC classification number: G01P15/093 ,  G01B9/02023 ,  G01C19/56 ,  G01C19/5712 ,  G01C19/5733 ,  G01C19/5776 ,  G01P2015/0848

Abstract: Embodiments of the present disclosure are directed towards techniques and configurations for MEMS sensing device configured to determine inertial change applied to the device. In one instance, the device may comprise a laser arrangement configured to generate a light beam, and a waveguide configured to split the light beam into two portions. The waveguide may include two arms through which the respective portions of the light beam may respectively pass, and disposed substantially parallel with each other and joined together around their respective ends to recombine the portions into a light beam. One of the arms may be deformable. A deformation of the arm may result in a change of an optical path length of a portion of the light beam traveling through the arm, causing a detectable change in light intensity of the recombined light beam outputted by the waveguide. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及用于确定施加到该装置的惯性变化的MEMS感测装置的技术和配置。 在一个实例中，该装置可以包括被配置为产生光束的激光装置和被配置为将光束分成两部分的波导。 波导可以包括两个臂，光束的各个部分可以分别通过该臂，并且基本上彼此平行地设置并且在其各自的端部处连接在一起，以将这些部分重新组合成光束。 其中一个臂可以是可变形的。 臂的变形可能导致穿过臂的光束的一部分的光路长度的变化，导致由波导输出的复合光束的光强度的可检测变化。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20150316580A1

公开(公告)日：2015-11-05

申请号：US14106172

申请日：2013-12-13

Applicant: Intel Corporation

Inventor： David N. Hutchison ,  John Heck

IPC: G01P15/093 ,  G01P15/14 ,  G02F1/025 ,  G01D5/26

CPC classification number: G01P15/093 ,  G01C19/56 ,  G01D5/268 ,  G01P15/14 ,  G02B26/0858 ,  G02F1/025

Abstract: Embodiments of the present disclosure are directed towards a micro-electromechanical system (MEMS) sensing device, including a laser arrangement configured to generate a light beam, a first waveguide configured to receive and output a first portion of the light beam, and a second waveguide having a section that is evanescently coupled to the first waveguide and configured to receive and output a second portion of the light beam. The section of the second waveguide is configured to be movable substantially parallel to the first waveguide, wherein a movement of the section of the second waveguide may be caused by an inertial change applied to the sensing device. The movement of the section may cause a detectable change in light intensity between the first and second portions of the light beam. Based on the detected change, the inertial change may be determined. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及一种微机电系统（MEMS）感测装置，其包括被配置为产生光束的激光装置，被配置为接收和输出光束的第一部分的第一波导和第二波导 具有湮灭地耦合到第一波导并被配置为接收和输出光束的第二部分的部分。 第二波导的部分被配置为可基本上平行于第一波导移动，其中第二波导的部分的运动可能由施加到感测装置的惯性变化引起。 该部分的运动可能导致光束的第一和第二部分之间的光强度的可检测变化。 基于检测到的变化，可以确定惯性变化。 可以描述和/或要求保护其他实施例。

公开(公告)号：US11222987B2

公开(公告)日：2022-01-11

申请号：US15927391

申请日：2018-03-21

Applicant: Intel Corporation

Inventor： John Heck ,  Harel Frish ,  Paul R. West

IPC: H01L31/0232 ,  G02B6/42 ,  H01L31/18 ,  G02B1/00

Abstract: In embodiments, an optoelectronic apparatus may include a substrate with a first side and a second side opposite the first side; a photodetector disposed on the first side of the substrate, the photodetector to convert a light signal into an electrical signal; and a dielectric metasurface lens etched into the second side of the substrate, the dielectric metasurface lens to collect incident light and focus it through the substrate onto the photodetector.