公开(公告)号：US10410983B2

公开(公告)日：2019-09-10

申请号：US15773152

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Vijay K. Nair

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/538 ,  H01L25/10 ,  H01L23/552 ,  H01L25/18 ,  H01Q1/38 ,  H01Q1/24

Abstract: Embodiments of the invention include a microelectronic device that includes an overmolded component having a first die with a silicon based substrate. A second die is coupled to the first die with the second die being formed with compound semiconductor materials in a different substrate. A substrate is coupled to the first die. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US10147710B2

公开(公告)日：2018-12-04

申请号：US15982787

申请日：2018-05-17

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Thorsten Meyer

IPC: H01L21/44 ,  H01L25/16 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L25/10 ,  H01L25/03 ,  H01L23/538

Abstract: Embodiments of the invention include multi-die package and methods of making such multi-die packages. In an embodiment a mold layer has a first surface and a second surface that is opposite from the first surface. One or more first electrical components that each have a solderable terminal that is oriented to face the first surface of the mold layer. The mold layer may also have one or more second electrical components that each have a second type of terminal that is oriented to face the second surface of the mold layer. Embodiments may also include one or more conductive through vias formed between the first surface of the mold layer and the second surface of the mold layer. Accordingly an electrical connection may be made from the second surface of the mold layer to the first electrical components that are oriented to face the first surface of the mold layer.

公开(公告)号：US11387200B2

公开(公告)日：2022-07-12

申请号：US16827296

申请日：2020-03-23

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Javier A. Falcon ,  Yoshihiro Tomita ,  Vijay K. Nair

IPC: H01L23/66 ,  H01L23/00 ,  H01L25/18 ,  H01L25/065

Abstract: Embodiments of the invention include a microelectronic device that includes a first die formed with a silicon based substrate and a second die coupled to the first die. The second die is formed with compound semiconductor materials in a different substrate (e.g., compound semiconductor substrate, group III-V substrate). An antenna unit is coupled to the second die. The antenna unit transmits and receives communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US10573608B2

公开(公告)日：2020-02-25

申请号：US15776021

申请日：2015-12-22

Applicant: INTEL CORPORATION

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Eric J. Li ,  Javier A. Falcon ,  Yoshihiro Tomita ,  Vijay K. Nair ,  Shawna M. Liff

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552 ,  H01L25/16

Abstract: Embodiments of the invention include a microelectronic device that includes a first die having a silicon based substrate and a second die coupled to the first die. In one example, the second die is formed with compound semiconductor materials. The microelectronic device includes a substrate that is coupled to the first die with a plurality of electrical connections. The substrate including an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US10546835B2

公开(公告)日：2020-01-28

申请号：US15777040

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Georgios C. Dogiamis ,  Telesphor Kamgaing

IPC: H01L25/065 ,  H01L23/66 ,  H01L25/10 ,  H01L23/00

Abstract: Embodiments of the invention include a microelectronic device that includes a transceiver coupled to a first substrate and a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. An interposer substrate can provide a spacing between the first and second substrates.

公开(公告)号：US10483250B2

公开(公告)日：2019-11-19

申请号：US15765992

申请日：2015-11-04

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Adel A. Elsherbini ,  Lakshman Krishnamurthy ,  Johanna M. Swan ,  Alexander Essaian ,  Torrey W. Frank

IPC: H01L25/16 ,  H01L23/48 ,  H01L23/00 ,  H01L25/10 ,  H01L23/538 ,  H01L25/00 ,  H01L21/56 ,  H01L23/498

Abstract: Embodiments are generally directed to three-dimensional small form factor system in package architecture. An embodiment of an apparatus includes a first package having a first side and an opposite second side, the first package including a plurality of embedded electronic components and one or more embedded via bars, each via bar including a plurality of through vias; and a second package having a first side and an opposite second side, the second package including a plurality of embedded electronic components, wherein a first side of the first package and a second side of second package are coupled together by a plurality of connections, including at least a first connection connecting the second package to a first component of the first package and a second connection connecting the second package to a first via bar of the one or more via bars.

公开(公告)号：US10032052B2

公开(公告)日：2018-07-24

申请号：US15586820

申请日：2017-05-04

Applicant: Intel Corporation

Inventor： Adel A. Elsherbini ,  Telesphor Kamgaing ,  Feras Eid ,  Vijay K. Nair ,  Georgios C. Dogiamis ,  Johanna M. Swan ,  Valluri R. Rao

IPC: G06K19/06 ,  G06K7/10 ,  H03H9/30 ,  G06K19/067

Abstract: Embodiments of the invention include delay line circuitry that is integrated with an organic substrate. Organic dielectric material and a plurality of conductive layers form the organic substrate. The delay line circuitry includes a piezoelectric transducer to receive a guided electromagnetic wave signal and to generate an acoustic wave signal to be transmitted with an acoustic transmission medium. An acoustic reflector is communicatively coupled to the acoustic transmission medium. The acoustic reflector receives a plurality of acoustic wave signals from the acoustic transmission medium and reflects acoustic wave signals to the piezoelectric transducer using the acoustic transmission medium. The transducer converts the reflected acoustic signals into electromagnetic waves which are then transmitted back through the antenna and decoded by the reader.

公开(公告)号：US20160322707A1

公开(公告)日：2016-11-03

申请号：US15206428

申请日：2016-07-11

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Chuan Hu ,  Shawna M. Liff ,  Larry E. Mosley

IPC: H01Q7/06 ,  H01L23/66 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01Q1/22 ,  H01L23/29

CPC classification number: H01Q7/06 ,  G06F1/16 ,  H01F1/0054 ,  H01L21/565 ,  H01L21/568 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/66 ,  H01L24/17 ,  H01L24/19 ,  H01L24/96 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/01029 ,  H01L2924/05442 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/186 ,  H01L2924/19011 ,  H01L2924/19042 ,  H01L2924/19102 ,  H01L2924/19105 ,  H01Q1/2283 ,  H01Q1/2291 ,  H01Q23/00 ,  H01L2924/00

Abstract: A method apparatus and material are described for radio frequency passives and antennas. In one example, an electronic component has a synthesized magnetic nanocomposite material with aligned magnetic domains, a conductor embedded within the nanocomposite material, and contact pads extending through the nanocomposite material to connect to the conductor.

Abstract translation: 无线电频率无源和天线描述了一种方法装置和材料。 在一个示例中，电子部件具有具有对准磁畴的合成磁性纳米复合材料，嵌入在纳米复合材料内的导体以及延伸穿过纳米复合材料以连接到导体的接触垫。

公开(公告)号：US20210391638A1

公开(公告)日：2021-12-16

申请号：US17458911

申请日：2021-08-27

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Digvijay Ashokkumar Raorane

IPC: H01Q1/22 ,  H01L21/48 ,  H01L23/13 ,  H01L23/538 ,  H01L23/66 ,  H01L23/00 ,  H01L25/065 ,  H01Q13/00

Abstract: Generally discussed herein are systems, devices, and methods that include a communication cavity. According to an example a device can include substrate with a first cavity formed therein, first and second antennas exposed in and enclosed by the cavity, and an interconnect structure formed in the substrate, the interconnect structure including alternating conductive material layers and inter-layer dielectric layers.

公开(公告)号：US11037892B2

公开(公告)日：2021-06-15

申请号：US16465545

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Sasha N. Oster ,  Johanna M. Swan ,  Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Adel A. Elsherbini

IPC: H01L23/66 ,  H01L23/538 ,  H01P3/16

Abstract: Waveguides disposed in either an interposer layer or directly in the semiconductor package substrate may be used to transfer signals between semiconductor dies coupled to the semiconductor package. For example, inter-semiconductor die communications using mm-wave carrier signals launched into waveguides specifically tuned to optimize transmission parameters of such signals. The use of such high frequencies beneficially provides for reliable transmission of modulated high data rate signals with lower losses than conductive traces and less cross-talk. The use of mm-wave waveguides provides higher data transfer rates per bump for bump-limited dies as well as beneficially providing improved signal integrity even at such higher data transfer rates. Such mm-wave waveguides may be built directly into semiconductor package layers or may be incorporated into one or more interposed layers that are physically and communicably coupled between the semiconductor dies and the semiconductor package substrate.