公开(公告)号：US11538638B2

公开(公告)日：2022-12-27

申请号：US16918251

申请日：2020-07-01

Applicant: International Business Machines Corporation

Inventor： Layne A. Berge ,  Matthew Doyle ,  John R. Dangler ,  Kyle Schoneck ,  Thomas W. Liang ,  Matthew A. Walther ,  Jason J. Bjorgaard

IPC: H01G4/35 ,  H05K1/02 ,  H01G4/28 ,  H01L49/02 ,  H05K1/16

Abstract: A grid array capacitor can be used to physically and electrically couple an integrated circuit (IC) package to a printed circuit board (PCB). The grid array capacitor includes an inner conductor and an inner dielectric coaxially surrounding the inner conductor. A secondary conductor can be located to surround, in a coaxial orientation, the inner dielectric. Both the inner conductor and the secondary conductor can be electrically connected to the IC package and to the PCB. In certain applications, the structure of the inner conductor, inner dielectric, and secondary conductor can provide capacitance used to decouple electronic circuits.

公开(公告)号：US11519957B2

公开(公告)日：2022-12-06

申请号：US16583464

申请日：2019-09-26

Applicant: International Business Machines Corporation

Inventor： Layne A. Berge ,  Matthew Doyle ,  Kyle Schoneck ,  Thomas W. Liang ,  Matthew A. Walther ,  Jason J. Bjorgaard ,  John R. Dangler

IPC: H01L23/48 ,  H01L23/52 ,  G01R31/28 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48 ,  G01R19/25 ,  H01L23/498 ,  B23K101/42

Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.

公开(公告)号：US11488571B2

公开(公告)日：2022-11-01

申请号：US16919864

申请日：2020-07-02

Applicant: International Business Machines Corporation

Inventor： Layne A. Berge ,  Jason J. Bjorgaard ,  John R. Dangler ,  Matthew Doyle ,  Thomas W. Liang ,  Kyle Schoneck ,  Matthew A. Walther ,  Jeffrey N. Judd ,  Henry Michael Newshutz ,  Matthew S Kelly

IPC: G10K11/175 ,  H04R1/10 ,  H04M1/02

Abstract: A system and method to prevent eavesdropping by a device. An anti-eavesdrop component is installed on the device. The anti-eavesdrop component is configured to actively prevent the device from capturing audio from the environment. In response to installing the anti-eavesdrop component, the device recognizes the anti-eavesdrop component as a primary audio input for the device. The anti-eavesdrop component then proceeds to block the device from capturing outside audio by injecting noise or otherwise interfering with the primary audio input.

公开(公告)号：US20220344568A1

公开(公告)日：2022-10-27

申请号：US17811364

申请日：2022-07-08

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  Joseph Kuczynski ,  Patrick Egan ,  Jeffrey N. Judd ,  Timothy J. Tofil

IPC: H01L41/09 ,  H01R4/62 ,  H01L41/04 ,  H01H57/00 ,  H01L41/193

Abstract: Provided is an apparatus comprising a conductive particle interconnect (CPI) and an electroactive polymer (EAP) structure. The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The EAP structure is disposed around at least a portion of the CPI. The EAP structure is configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP structure is in the first position and a second, different electrical resistance when the EAP structure is in the second position.

公开(公告)号：US11100514B2

公开(公告)日：2021-08-24

申请号：US16157367

申请日：2018-10-11

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John R. Dangler ,  Layne Berge ,  Jason J. Bjorgaard ,  Thomas Liang ,  Manuel Orozco ,  Matthew Doyle

IPC: G06Q40/00 ,  G06Q20/40 ,  G06Q20/34 ,  G06K19/07 ,  G06K7/10

Abstract: Systems, methods, and cards utilized for an authentication protection layer for payment card transactions are provided. Aspects include receiving, by a transaction processing terminal, the card for the potential transaction. Obtaining card holder information for the card and transmitting a radio frequency (RF) signal and receiving RFID data from an RFID tag associated with the card. Comparing, by a processor, the card holder information to the RFID data to determine whether to authorize the potential card transaction and authorizing the potential card transaction based at least on a determination that the RFID data corresponds to the card holder information.

公开(公告)号：US20210210448A1

公开(公告)日：2021-07-08

申请号：US16734583

申请日：2020-01-06

Applicant: International Business Machines Corporation

Inventor： Jason J. Bjorgaard ,  Layne A. Berge ,  John R. Dangler ,  Matthew Doyle ,  Thomas W. Liang ,  Kyle Schoneck ,  Matthew A. Walther

IPC: H01L23/00

Abstract: A solder ball assembly can include a first spring element having a first shape and formed from a first elastic electrically conductive material. The solder ball assembly can also include a second spring element having a second shape and formed from a second elastic electrically conductive material. The second spring element is mechanically attached to the first spring element to form a spring assembly. The solder ball can be configured to enclose the spring assembly.

公开(公告)号：US10984957B1

公开(公告)日：2021-04-20

申请号：US16701815

申请日：2019-12-03

Applicant: International Business Machines Corporation

Inventor： Samuel R. Connor ,  Stuart Brett Benefield ,  Matthew Doyle

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/22 ,  H05K3/32 ,  H05K3/36 ,  H05K3/42 ,  H01G4/005 ,  H01G4/02 ,  H01G4/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  H01G4/33 ,  H01G4/35 ,  H01G4/38 ,  H01G4/228 ,  H01G4/232 ,  H01G4/248 ,  H01G4/224 ,  H05K1/11 ,  H05K3/00

Abstract: A capacitor comprises a housing and a first stack of parallel plates within the housing. A first plate and a second plate in the first stack are capacitively coupled. The capacitor comprises a second stack of parallel plates within the housing. A third plate and a fourth plate in the stack are capacitively coupled. The capacitor also comprises a first input electrode and a second input electrode. The capacitor also comprises a first output electrode and a second output electrode on a side surface of the capacitor. The capacitor also comprises a dielectric material located between each plate in the first stack and the second stack. The first stack is not capacitively coupled with the second stack.

公开(公告)号：US20200342125A1

公开(公告)日：2020-10-29

申请号：US16394816

申请日：2019-04-25

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  Gerald Bartley

IPC: G06F21/62 ,  G06F1/30 ,  G06F13/16 ,  G06F13/42 ,  H01R12/73 ,  H01R12/70 ,  H01R13/66 ,  H05K1/11

Abstract: A printed circuit (PC) card apparatus can, in an absence of external power provided to a Peripheral Component Interconnect Express (PCIe) PC card, prevent and detect unauthorized access to secure data stored on a memory device mounted on the PCIe PC card. The PCIe card includes a primary battery to supply, when external power is disconnected from the PCIe card, power to an electronic security device mounted on the PCIe card. The PC card apparatus also includes a PCIe edge connector protector enclosing electrically conductive fingers of a PCIe edge card connector. The PCIe edge connector protector includes a hidden supplemental charge storage device integrated into the PCIe edge connector protector. The PCIe edge connector protector also includes electrically conductive contacts to transfer supplemental power from the supplemental charge storage device to the electronic security device.

公开(公告)号：US20200314997A1

公开(公告)日：2020-10-01

申请号：US16368926

申请日：2019-03-29

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  Gerald Bartley ,  Darryl Becker ,  Mark J. Jeanson

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/36 ,  H05K1/14 ,  H05K3/32

Abstract: An interconnect device may include a first center conductor of a first material that has a first durometer. The first center conductor may be surrounded by a first inner dielectric ring, which may be surrounded by a conductive region of a second material having a second durometer. The second durometer may be different from the first durometer. The conductive region may have a first end that defines a first plane and a second end that defines a second plane. An outer dielectric ring may surround the conductive region. The first center conductor may have a first bulb and a second bulb, the first bulb may extend in a direction away from the second plane and beyond the first plane, and the second bulb may extend in a direction away from the first plane and beyond the second plane.

公开(公告)号：US11963307B2

公开(公告)日：2024-04-16

申请号：US17216863

申请日：2021-03-30

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  Thomas W. Liang ,  Layne A. Berge ,  John R. Dangler ,  Jason J. Bjorgaard ,  Kyle Schoneck ,  Matthew A. Walther

IPC: B23K1/00 ,  B23K3/06 ,  B23K3/08 ,  H05K3/34 ,  B23K101/36

CPC classification number: H05K3/3478 ,  B23K1/0008 ,  B23K3/0623 ,  B23K3/08 ,  H05K3/3436 ,  B23K2101/36 ,  H05K2201/09136 ,  H05K2203/041 ,  H05K2203/082

Abstract: A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.