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    Film-covered open-cavity sensor package
    12.
    发明授权
    Film-covered open-cavity sensor package 有权
    薄膜覆盖的开放式传感器封装

    公开(公告)号：US09153706B2

    公开(公告)日：2015-10-06

    申请号：US13900949

    申请日：2013-05-23

    Applicant: Infineon Technologies AG

    Inventor： Klaus Elian ,  Helmut Wietschorke

    IPC: H01L21/70 ,  H01L21/56 ,  H01L29/84 ,  H01L23/00

    CPC classification number: H01L29/84 ,  G01L5/0004 ,  G01L19/147 ,  H01L23/04 ,  H01L23/24 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/13099 ,  H01L2924/00

    Abstract: Techniques for covering open-cavity integrated-circuit packages in a batch process are disclosed. In an example method, a plurality of open-cavity packages are molded on a single batch leadframe or substrate, each open-cavity package comprising a floor and a plurality of walls arranged around the floor to form a cavity, each of said the walls having a bottom end adjoining said floor and having a top side opposite the bottom end. At least one semiconductor device is attached to the floor and within the cavity of each of the open-cavity packages, and a single flexible membrane is affixed to the top sides of the walls of the plurality of open-cavity packages, so as to substantially cover all of the cavities. The flexible membrane is then severed, between the packages.

    Abstract translation: 公开了一种用于在间歇过程中覆盖开放式集成电路封装的技术。 在一个示例性方法中，多个开放式空腔包装被模制在单个批量引线框架或基板上，每个开放式空腔封装包括地板和布置在地板周围的多个壁，以形成空腔，每个所述壁具有 底端邻接所述底板并且具有与底端相对的顶侧。 至少一个半导体器件附接到每个开口腔封装的地板和空腔内，并且单个柔性膜固定到多个开放式腔封装的壁的顶侧，从而基本上 覆盖所有的空腔。 然后在包装之间切断柔性膜。

    Magnetic-sensor device and method for producing same
    13.
    发明授权
    Magnetic-sensor device and method for producing same 有权

    公开(公告)号：US11536781B2

    公开(公告)日：2022-12-27

    申请号：US17301795

    申请日：2021-04-14

    Applicant: Infineon Technologies AG

    Inventor： Horst Theuss ,  Klaus Elian ,  Helmut Wietschorke

    IPC: G01R33/038 ,  G01R33/07

    Abstract: The present disclosure relates to a magnetic-sensor device comprising a circuit board made of an electrically insulating material and having conductor tracks, and comprising a permanent magnet surface-mounted on the circuit board, and a magnetic-field sensor connected to the conductor tracks of the circuit board. An SMD component for populating a circuit board is also proposed, which SMD component comprises a permanent magnet and a magnetic-field sensor.

    Pressure Sensor Package with Integrated Sealing
    15.
    发明申请
    Pressure Sensor Package with Integrated Sealing 有权
    压力传感器封装，集成密封

    公开(公告)号：US20150090042A1

    公开(公告)日：2015-04-02

    申请号：US14039706

    申请日：2013-09-27

    Applicant: Infineon Technologies AG

    Inventor： Mathias Vaupel ,  Horst Theuss ,  Helmut Wietschorke

    IPC: G01L9/00 ,  B81C1/00 ,  B81B7/00

    CPC classification number: G01L9/0045 ,  B81B7/0048 ,  B81B2201/0264 ,  B81C1/00325 ,  G01L9/0042 ,  G01L9/0054 ,  G01L19/0007 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

    Abstract: A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side of the die. The die is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The package further includes an electrical conductor connecting the terminal to the lead, a molding compound encasing the electrical conductor, the die and part of the lead, a cavity in the molding compound exposing the diaphragm, and a sealing ring disposed on a side of the molding compound with the cavity. The sealing ring surrounds the cavity and has a lower elastic modulus than the molding compound. Alternatively, the sealing ring can be a ridge of the molding compound that protrudes from the side of the molding compound with the cavity and surrounds the cavity. A package manufacturing method is also provided.

    Abstract translation: 压力传感器封装包括引线和与引线间隔开的半导体管芯，并且包括设置在管芯第一侧的端子和隔膜。 模具被配置成响应于横跨隔膜的压差而改变电参数。 该封装还包括将端子连接到引线的电导体，封装电导体，模具和引线的一部分的模制化合物，暴露隔膜的模制化合物中的空腔，以及设置在该导体的侧面上的密封环 与空腔成型。 密封环围绕腔体并具有比模塑料更低的弹性模量。 或者，密封环可以是模制化合物的脊，其从模制化合物与空腔的侧面突出并且包围空腔。 还提供了一种封装制造方法。

    Film-Covered Open-Cavity Sensor Package
    18.
    发明申请
    Film-Covered Open-Cavity Sensor Package 有权
    薄膜覆盖开孔传感器封装

    公开(公告)号：US20140346623A1

    公开(公告)日：2014-11-27

    申请号：US13900949

    申请日：2013-05-23

    Applicant: Infineon Technologies AG

    Inventor： Klaus Elian ,  Helmut Wietschorke

    IPC: H01L29/84 ,  H01L23/00

    CPC classification number: H01L29/84 ,  G01L5/0004 ,  G01L19/147 ,  H01L23/04 ,  H01L23/24 ,  H01L24/16 ,  H01L24/48 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/13099 ,  H01L2924/00

    Abstract: Techniques for covering open-cavity integrated-circuit packages in a batch process are disclosed. In an example method, a plurality of open-cavity packages are molded on a single batch leadframe or substrate, each open-cavity package comprising a floor and a plurality of walls arranged around the floor to form a cavity, each of said the walls having a bottom end adjoining said floor and having a top side opposite the bottom end. At least one semiconductor device is attached to the floor and within the cavity of each of the open-cavity packages, and a single flexible membrane is affixed to the top sides of the walls of the plurality of open-cavity packages, so as to substantially cover all of the cavities. The flexible membrane is then severed, between the packages.

    Abstract translation: 公开了一种用于在间歇过程中覆盖开放式集成电路封装的技术。 在一个示例性方法中，多个开放式空腔包装被模制在单个批量引线框架或基板上，每个开放式空腔封装包括地板和布置在地板周围的多个壁，以形成空腔，每个所述壁具有 底端邻接所述底板并且具有与底端相对的顶侧。 至少一个半导体器件附接到每个开口腔封装的地板和空腔内，并且单个柔性膜固定到多个开放式腔封装的壁的顶侧，从而基本上 覆盖所有的空腔。 然后在包装之间切断柔性膜。

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