公开(公告)号：US11658079B2

公开(公告)日：2023-05-23

申请号：US16250683

申请日：2019-01-17

Applicant: Intel Corporation

Inventor： Hyoung Il Kim ,  Yi Xu ,  Florence Pon

IPC: H01L21/66 ,  H01L25/065 ,  H01L23/538 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L22/32 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L24/09 ,  H01L24/17 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L2924/381

Abstract: Embodiments described herein are directed to a temporary interconnect for use in testing one or more devices (e.g., one or more dies, inductors, capacitors, etc.) formed in semiconductor package. In one scenario, a temporary interconnect acts an electrical bridge that electrically couples a contact pad on a surface of a substrate and the test pad. Coupling the contact pad and the test pad to each other enables the device(s) coupled the contact pad to be tested. Following testing, the temporary interconnect can be removed or severed so that an electrical break is formed in the conductive path between test pad and the contact pad.

公开(公告)号：US11599750B2

公开(公告)日：2023-03-07

申请号：US16146860

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Maruti Gupta Hyde ,  Florence Pon ,  Naissa Conde ,  Xue Yang ,  Wei Yee Koay

IPC: G06K9/62 ,  G06N20/00 ,  G06V10/00 ,  G06F21/62 ,  G06N3/08 ,  H04L9/40 ,  G06V10/94

Abstract: Edge devices utilizing personalized machine learning and methods of operating the same are disclosed. An example edge device includes a model accessor to access a first machine learning model from a cloud service provider. A local data interface is to collect local user data. A model trainer is to train the first machine learning model to create a second machine learning model using the local user data. A local permissions data store is to store permissions indicating constraints on the local user data with respect to sharing outside of the edge device. A permissions enforcer is to apply permissions to the local user data to create a sub-set of the local user data to be shared outside of the edge device. A transmitter is to provide the sub-set of the local user data to a public data repository.

公开(公告)号：US11036370B2

公开(公告)日：2021-06-15

申请号：US16141219

申请日：2018-09-25

Applicant: Intel Corporation

Inventor： Fatema Adenwala ,  Ankitha Chandran ,  Nageen Himayat ,  Florence Pon ,  Divya Vijayaraghavan

IPC: H04W4/44 ,  G06F3/0484 ,  G07C5/00 ,  H04W4/21 ,  H04W4/46 ,  G06F3/0481 ,  H04W4/02 ,  G05D1/00 ,  G05D1/02

Abstract: Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.

公开(公告)号：US11948917B2

公开(公告)日：2024-04-02

申请号：US16392295

申请日：2019-04-23

Applicant: Intel Corporation

Inventor： Florence Pon ,  Yi Xu ,  James Zhang ,  Yuhong Cai ,  Tyler Leuten ,  William Glennan ,  Hyoung Il Kim

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L25/50 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06586

Abstract: Embodiments described herein provide a semiconductor package comprising multiple dies encapsulated in multiple molding compounds. In one example, a semiconductor package comprises: a first die or die stack on a substrate; a first molding compound encapsulating the first die or die stack on the substrate; a second die or die stack on the first molding compound; and a second molding compound encapsulating the second die or die stack and at least one portion of the first molding compound. In this example, the first die or die stack is electrically coupled to the substrate using a first wire bond and the second die or die stack is electrically coupled to the substrate using a second wire bond. Additionally, the first molding compound encapsulates the first wire bond and the second molding compound encapsulates the second wire bond. Furthermore, a footprint of the second die overlaps a footprint of the first die.

公开(公告)号：US11652031B2

公开(公告)日：2023-05-16

申请号：US16219168

申请日：2018-12-13

Applicant: Intel Corporation

Inventor： Florence Pon ,  Yi Xu ,  Min-Tih Lai

IPC: H01L23/495 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/4952 ,  H01L23/373 ,  H01L23/4985 ,  H01L23/49524 ,  H01L24/06 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/04042

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a substrate an elastomer coupled to the substrate and a plurality of bondfingers on the elastomer. The substrate, the elastomer and the bondfingers are configured to cooperatively expand and retract.

公开(公告)号：US20190279954A1

公开(公告)日：2019-09-12

申请号：US16346438

申请日：2016-12-01

Applicant: Intel Corporation

Inventor： Min-Tih Lai ,  Florence Pon

IPC: H01L23/00 ,  H01L23/552 ,  H01L25/065 ,  H01L25/07

Abstract: A microelectronic device may be formed having at least one microelectronic die attached to a microelectronic substrate, wherein a ground shielding layer is formed over the microelectronic die and the microelectronic substrate. In one embodiment, both the microelectronic substrate and the first microelectronic die may have a signal bond pad and a ground bond pad. A bond wire may be used to form a connection between the microelectronic substrate signal bond pad and the first microelectronic die signal bond pad. A dielectric material layer may be formed on the microelectronic substrate and the first microelectronic die, and an electrically conductive material layer may be formed on the dielectric material layer, wherein the electrically conductive material layer extends through openings in the dielectric material layer to contact the microelectronic substrate ground bond pad and the first microelectronic die ground bond pad.

公开(公告)号：US20190079659A1

公开(公告)日：2019-03-14

申请号：US16141219

申请日：2018-09-25

Applicant: Intel Corporation

Inventor： Fatema Adenwala ,  Ankitha Chandran ,  Nageen Himayat ,  Florence Pon ,  Divya Vijayaraghavan

IPC: G06F3/0484 ,  G07C5/00 ,  H04W4/21 ,  H04W4/46 ,  H04W4/44 ,  G06F3/0481

Abstract: Apparatuses, methods and storage medium associated with computer-assisted or autonomous driving (CA/AD) vehicles are disclosed herein. In embodiments, CA/AD vehicles are members of a CA/AD vehicle social network (CASN) in which various CA/AD vehicles may form connections or relationships with one another. CA/AD vehicles that have an existing relationship or connection may share CASN information with one another. The CASN information may include authenticated and/or proprietary information. Other embodiments are also described and claimed.

公开(公告)号：US20190050683A1

公开(公告)日：2019-02-14

申请号：US16146860

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Maruti Gupta Hyde ,  Florence Pon ,  Naissa Conde ,  Xue Yang ,  Wei Yee Koay

IPC: G06K9/62 ,  G06N3/08 ,  G06F15/18 ,  G06F21/62

Abstract: Edge devices utilizing personalized machine learning and methods of operating the same are disclosed. An example edge device includes a model accessor to access a first machine learning model from a cloud service provider. A local data interface is to collect local user data. A model trainer is to train the first machine learning model to create a second machine learning model using the local user data. A local permissions data store is to store permissions indicating constraints on the local user data with respect to sharing outside of the edge device. A permissions enforcer is to apply permissions to the local user data to create a sub-set of the local user data to be shared outside of the edge device. A transmitter is to provide the sub-set of the local user data to a public data repository.