公开(公告)号：US20250016930A1

公开(公告)日：2025-01-09

申请号：US18895796

申请日：2024-09-25

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Luis Alvarez Mata ,  Jia Yan Go ,  Smit Kapila ,  Chaitra Kotehal ,  Jeff Ku ,  Shantanu Kulkarni ,  Kari Mansukoski ,  Surya Pratap Mishra

IPC: H05K1/18

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for inductors of voltage regulators that are built into and/or around mounting holes of a printed circuit board. An example apparatus includes a printed circuit board that includes a plurality of layers and a mounting hole extending through the plurality of layers, and an inductor at least partially in the mounting hole between two or more of the plurality of layers.

公开(公告)号：US20250008685A1

公开(公告)日：2025-01-02

申请号：US18216049

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Nirmala Bailur ,  Min Suet Lim ,  Tongyan Zhai ,  Chee Chun Yee ,  Ruander Cardenas ,  Lance Lin ,  Eng Huat Goh ,  Javed Shaikh ,  Jun Liao ,  Kavitha Nagarajan ,  Tin Poay Chuah ,  Martin M. Chang ,  Shantanu D. Kulkarni ,  Telesphor Kamgaing

IPC: H05K7/20 ,  F04D19/00 ,  F04D29/52 ,  G06F1/20

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for cooling electronic devices. An example apparatus includes a fan module for an electronic device. The fan module includes a first cover; a second cover; an input/output (IO) board adjacent the second cover, the second cover and IO board beneath the first cover; and a fan between the first cover and the second cover, the fan to operate above the second cover and a portion of the IO board.

公开(公告)号：US20240324144A1

公开(公告)日：2024-09-26

申请号：US18189428

申请日：2023-03-24

Applicant: Intel Corporation

Inventor： Juha Tapani Paavola ,  Christopher Moore ,  Jeff Ku ,  Prakash Kurma Raju

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20336 ,  G06F1/203 ,  H05K7/20154

Abstract: Cooling systems with heat pipes for electronic devices are disclosed herein. An example cooling system includes a heat pipe having a top wall and a bottom wall. The heat pipe contains a fluid. The cooling system includes a wick disposed in the heat pipe and a stiffener coupled to the wick. The stiffener contacts the top wall and the bottom wall of the heat pipe.

公开(公告)号：US20240314921A1

公开(公告)日：2024-09-19

申请号：US18121297

申请日：2023-03-14

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Baomin Liu ,  Cora Nien ,  Min Suet Lim ,  Tongyan Zhai

IPC: H05K1/02 ,  F16K31/50 ,  H05K7/20

CPC classification number: H05K1/0209 ,  F16K31/504 ,  H05K7/20254 ,  H05K2201/0209

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to cool electronic devices. An example thermal solution to cool an electronic device Includes a first cooling plate at a first side of a printed circuit board and a second cooling plate at a second side of the printed circuit board, the second side opposite the first side. The second cooling plate is fluidically coupled with the first cooling plate.

公开(公告)号：US11907022B2

公开(公告)日：2024-02-20

申请号：US18306706

申请日：2023-04-25

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Tim Liu ,  Yihua Lai ,  Lance Lin ,  Gavin Sung

IPC: G06F1/16 ,  G06F3/02 ,  G06F3/0354

CPC classification number: G06F1/1662 ,  G06F1/1616 ,  G06F1/1647 ,  G06F1/1681 ,  G06F3/0213 ,  G06F3/03547

Abstract: Apparatus, systems, articles of manufacture, and methods are disclosed for physical keyboards with multi-display computing devices. An example keyboard includes a plurality of keys and a translucent backplate having a first side and a second side. The example keyboard also includes a coating between the first side of the backplate and the plurality of keys, the coating to pass light to illuminate the plurality of keys, and the coating to obscure the plurality keys when viewed from the second side of the backplate.

公开(公告)号：US11899502B2

公开(公告)日：2024-02-13

申请号：US17626750

申请日：2019-09-10

Applicant: Intel Corporation

Inventor： Vincent Hung ,  Jeff Ku ,  Andy B. Wang ,  Duck Young Kong ,  Chunlin Bai

IPC: G06F1/16

CPC classification number: G06F1/1656 ,  G06F1/1618 ,  G06F1/1679 ,  G06F1/1686

Abstract: Laptop computers with a movable accessory housing are described herein. An example laptop computer incudes a base, a lid moveably coupled to the base, a display carried by the lid, an arm pivotably coupled to the lid, and an accessory housing carried by the arm. The arm is pivotable to move the accessory housing between a first position in which the accessory housing is disposed along a bottom edge of the lid and a second position in which the accessory housing is disposed along a top edge of the lid.

公开(公告)号：US20230333604A1

公开(公告)日：2023-10-19

申请号：US18306706

申请日：2023-04-25

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Tim Liu ,  Yihua Lai ,  Lance Lin ,  Gavin Sung

IPC: G06F1/16 ,  G06F3/02 ,  G06F3/0354

CPC classification number: G06F1/1662 ,  G06F3/0213 ,  G06F1/1616 ,  G06F1/1647 ,  G06F1/1681 ,  G06F3/03547

Abstract: Apparatus, systems, articles of manufacture, and methods are disclosed for physical keyboards with multi-display computing devices. An example keyboard includes a plurality of keys and a translucent backplate having a first side and a second side. The example keyboard also includes a coating between the first side of the backplate and the plurality of keys, the coating to pass light to illuminate the plurality of keys, and the coating to obscure the plurality keys when viewed from the second side of the backplate.

公开(公告)号：USD1001797S1

公开(公告)日：2023-10-17

申请号：US29724751

申请日：2020-02-19

Applicant: Intel Corporation

Designer： Jeff Ku ,  Juha Paavola ,  Mark Carbone ,  Shantanu Kulkarni ,  Mikko Makinen ,  Gustavo Fricke

Abstract: FIG. 1 is a bottom, front, right, perspective view of a computer;
FIG. 2 is a bottom, front, right, perspective view thereof in a first alternate configuration of use; and,
FIG. 3 is a bottom, right, front perspective view thereof in a second alternate configuration of use.
The even dashed broken lines in the drawings represent portions of the computer that form no part of the claimed design. The dot-dash broken lines represent boundaries that separate the unclaimed center portion of the screen from the rest of the computer. The keyboard shown in even dash broken lines in FIGS. 1-2 represents environment. None of the broken lines form part of the claimed design.

公开(公告)号：US20230020484A1

公开(公告)日：2023-01-19

申请号：US17955205

申请日：2022-09-28

Applicant: Intel Corporation

Inventor： Feroze Khan ,  Arnab Sen ,  Jeff Ku ,  Samarth Alva

IPC: H05K7/20

Abstract: Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.

公开(公告)号：US20220186716A1

公开(公告)日：2022-06-16

申请号：US17561605

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Mark J. Gallina ,  Min Suet Lim ,  Jianfang Zhu

IPC: F03G7/06 ,  H02N10/00

Abstract: Particular embodiments described herein provide for a flexible vapor chamber with shape memory material for an electronic device. In an example, the electronic device can include a flexible vapor chamber and shape memory material coupled to the shape memory material. When the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber to a position that helps with heat dissipation of heat collected by the flexible vapor chamber.