公开(公告)号：US20190305422A1

公开(公告)日：2019-10-03

申请号：US15942026

申请日：2018-03-30

Applicant: Intel Corporation

Inventor： Debabani Choudhury ,  Shuhei Yamada

IPC: H01Q3/44 ,  G01S13/93

Abstract: An antenna system including an antenna configured to emit an electromagnetic wave, and a beamwidth controller disposed on the antenna and configured to align with a magnetic or electric field direction of the electromagnetic wave, and when the electromagnetic wave at least partially or wholly propagates through the beamwidth controller, resonate and induce a magnetic field to interact with the electromagnetic wave to control a beamwidth of the electromagnetic wave based on a permittivity or permeability of the beamwidth controller.

公开(公告)号：US20240421465A1

公开(公告)日：2024-12-19

申请号：US18334201

申请日：2023-06-13

Applicant: Intel Corporation

Inventor： Tolga Acikalin ,  Tae Young Yang ,  Shuhei Yamada ,  Telesphor Kamgaing

IPC: H01Q1/22 ,  H01L23/15 ,  H01L23/538 ,  H01L25/065 ,  H01P3/08 ,  H01Q13/02

Abstract: Wireless interconnects in integrated circuit package substrates with glass cores are disclosed. An example apparatus includes a semiconductor die. The example apparatus further includes a package substrate supporting the semiconductor die. The package substrate includes a glass core. The example apparatus also includes an antenna within the glass core.

公开(公告)号：US11955732B2

公开(公告)日：2024-04-09

申请号：US18089220

申请日：2022-12-27

Applicant: Intel Corporation

Inventor： Erkan Alpman ,  Arnaud Lucres Amadjikpe ,  Omer Asaf ,  Kameran Azadet ,  Rotem Banin ,  Miroslav Baryakh ,  Anat Bazov ,  Stefano Brenna ,  Bryan K. Casper ,  Anandaroop Chakrabarti ,  Gregory Chance ,  Debabani Choudhury ,  Emanuel Cohen ,  Claudio Da Silva ,  Sidharth Dalmia ,  Saeid Daneshgar Asl ,  Kaushik Dasgupta ,  Kunal Datta ,  Brandon Davis ,  Ofir Degani ,  Amr M. Fahim ,  Amit Freiman ,  Michael Genossar ,  Eran Gerson ,  Eyal Goldberger ,  Eshel Gordon ,  Meir Gordon ,  Josef Hagn ,  Shinwon Kang ,  Te Yu Kao ,  Noam Kogan ,  Mikko S. Komulainen ,  Igal Yehuda Kushnir ,  Saku Lahti ,  Mikko M. Lampinen ,  Naftali Landsberg ,  Wook Bong Lee ,  Run Levinger ,  Albert Molina ,  Resti Montoya Moreno ,  Tawfiq Musah ,  Nathan G. Narevsky ,  Hosein Nikopour ,  Oner Orhan ,  Georgios Palaskas ,  Stefano Pellerano ,  Ron Pongratz ,  Ashoke Ravi ,  Shmuel Ravid ,  Peter Andrew Sagazio ,  Eren Sasoglu ,  Lior Shakedd ,  Gadi Shor ,  Baljit Singh ,  Menashe Soffer ,  Ra'anan Sover ,  Shilpa Talwar ,  Nebil Tanzi ,  Moshe Teplitsky ,  Chintan S. Thakkar ,  Jayprakash Thakur ,  Avi Tsarfati ,  Yossi Tsfati ,  Marian Verhelst ,  Nir Weisman ,  Shuhei Yamada ,  Ana M. Yepes ,  Duncan Kitchin

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q5/47 ,  H01Q21/24 ,  H03L7/14 ,  H04B1/3827 ,  H04B7/0456 ,  H04B7/06 ,  H04B15/04

CPC classification number: H01Q9/0414 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q5/47 ,  H01Q21/24 ,  H03L7/145 ,  H04B1/3827 ,  H04B7/0482 ,  H04B7/0639 ,  H04B15/04

Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.