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公开(公告)号：US10340661B2
公开(公告)日：2019-07-02
申请号：US15800339
申请日：2017-11-01
发明人： Charles Caër , Lukas Czornomaz , Stefan Abel , Bert Jan Offrein
摘要： Embodiments of the disclosure are directed to a lateral current injection electro-optical device. The device comprises an active region with a stack of III-V semiconductor gain materials stacked along a stacking direction z. The active region may be formed as a slab having several lateral surface portions, each extending parallel to the stacking direction z. The device further comprises two paired elements, which include: a pair of doped layers of III-V semiconductor materials (an n-doped layer and a p-doped layer); and a pair of lateral waveguide cores. The two paired elements may be laterally arranged, two-by-two, on opposite sides of the slab. The elements distinctly adjoin respective ones of the lateral surface portions of the slab, so as for these elements to be separated from each other by the slab. The disclosure may be further directed to related silicon photonics devices and fabrication methods.
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公开(公告)号：US20190131772A1
公开(公告)日：2019-05-02
申请号：US15800339
申请日：2017-11-01
发明人： Charles Caër , Lukas Czornomaz , Stefan Abel , Bert Jan Offrein
CPC分类号： H01S5/2031 , H01S5/026 , H01S5/0424 , H01S5/0425 , H01S5/1014 , H01S5/1028 , H01S5/125 , H01S5/227 , H01S5/3054 , H01S5/343
摘要： Embodiments of the disclosure are directed to a lateral current injection electro-optical device. The device comprises an active region with a stack of III-V semiconductor gain materials stacked along a stacking direction z. The active region may be formed as a slab having several lateral surface portions, each extending parallel to the stacking direction z. The device further comprises two paired elements, which include: a pair of doped layers of III-V semiconductor materials (an n-doped layer and a p-doped layer); and a pair of lateral waveguide cores. The two paired elements may be laterally arranged, two-by-two, on opposite sides of the slab. The elements distinctly adjoin respective ones of the lateral surface portions of the slab, so as for these elements to be separated from each other by the slab. The disclosure may be further directed to related silicon photonics devices and fabrication methods.
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公开(公告)号：US09989703B2
公开(公告)日：2018-06-05
申请号：US15379523
申请日：2016-12-15
IPC分类号： G02B6/13 , H01L23/544 , G02B6/12
CPC分类号： G02B6/13 , G02B6/12004 , G02B6/131 , G02B6/132 , G02B6/136 , H01L23/544 , H01L2223/54426 , H01L2223/54453
摘要： A semiconductor structure and a method for manufacturing the semiconductor structure are provided. The semiconductor structure includes a processed semiconductor substrate. The processed semiconductor substrate includes active electronic components. The semiconductor structure also includes a dielectric layer that covers, at least partially, the processed semiconductor substrate. An interface layer that is suitable for growing optically active material on the interface layer is bonded to the dielectric layer. An optical gain layer and the processed semiconductor substrate are connected through the dielectric layer by electric and/or optical contacts.
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公开(公告)号：US09213154B2
公开(公告)日：2015-12-15
申请号：US14222769
申请日：2014-03-24
CPC分类号： G02B6/4214 , G02B6/136 , G02B6/4204 , G02B6/43
摘要： An optoelectronic packaging assembly having an optical interposer and a method of same. The assembly includes a photonic and/or optoelectronic device; a planar optical interposer coupled to the photonic and/or optoelectronic device on a first side of the optical interposer and including an optical transmission element on a second side opposite to the first side; a deflecting element; and at least one optical waveguide on the first side, in-plane with the optical interposer. The waveguide is coupled at one end to the photonic and/or optoelectronic device and at another end to the deflecting element. The deflecting element is configured to enable optical transmission between the waveguide and the optical transmission element through the optical interposer. The optical interposer includes a material allowing for optical transmission between the deflecting element and the optical transmission element.
摘要翻译： 一种具有光学插入器的光电子封装组件及其方法。 该组件包括光子和/或光电子器件; 平面光学插入器，其耦合到所述光学插入器的第一侧上的所述光子和/或光电子器件，并且在与所述第一侧相对的第二侧上包括光学传输元件; 偏转元件; 以及第一侧上的至少一个光波导，与光学插入器成平面。 波导在一端耦合到光子和/或光电器件，另一端耦合到偏转元件。 偏转元件构造成能够通过光学插入件在波导和光传输元件之间实现光传输。 光学插入器包括允许偏转元件和光传输元件之间的光传输的材料。
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15.发明申请METHOD AND SPACER FOR ASSEMBLING FLEXIBLE OPTICAL WAVEGUIDE RIBBONS, AND ASSEMBLED STACK OF SUCH RIBBONS 有权用于组装柔性光波导的方法和间隔件，以及组装的这种罗盘的堆叠公开(公告)号：US20150346446A1
公开(公告)日：2015-12-03
申请号：US14820095
申请日：2015-08-06
IPC分类号： G02B6/44
CPC分类号： G02B6/448 , G02B6/10 , G02B6/3839 , G02B6/3861 , G02B6/3885 , G02B6/4404 , Y10T29/49826
摘要： A method and spacer for assembling flexible optical waveguide ribbons and assembled stack of such ribbons. The method includes the steps of: providing at least two optical waveguide ribbons and a spacer, which includes at least two calibrated spaces; positioning a ribbon stack in the spacer, where the ribbon stack includes the at least two optical waveguide ribbons stacked on top of each other; constraining positioned ribbon stack in one of the calibrated spaces; and fixing constrained ribbon stack in the calibrated spaces.
摘要翻译： 用于组装柔性光波导带的方法和间隔件以及这种带的组装堆叠。 该方法包括以下步骤：提供至少两个光波导带和间隔物，其包括至少两个校准空间; 将带状堆叠定位在间隔件中，其中所述带堆叠包括堆叠在彼此顶部的所述至少两个光波导带; 将定位的色带堆叠限制在其中一个校准空间中; 并将限制的带堆叠固定在校准空间中。
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公开(公告)号：US08870472B2
公开(公告)日：2014-10-28
申请号：US13676376
申请日：2012-11-14
IPC分类号： G02B6/36 , G02B6/13 , H05K1/18 , H05K1/02 , H05K13/00 , G02B6/43 , G02B6/42 , G02B6/38 , H05K3/34
CPC分类号： G02B6/42 , G02B6/13 , G02B6/3885 , G02B6/4214 , G02B6/43 , G02B2006/12166 , H05K1/0274 , H05K1/184 , H05K1/189 , H05K3/3405 , H05K13/00 , H05K2201/09081 , H05K2201/10121 , H05K2201/10674 , H05K2203/0195 , Y10T29/49002 , Y10T29/49037 , Y10T29/49124 , Y10T29/49826 , Y10T29/53
摘要： A computer program product for fabricating an optical assembly, having a computer readable storage medium having computer readable program code embodied therewith, the computer readable program code includes a first computer readable program code configured to horizontally position a flexible portion of a substrate including a waveguide, the waveguide exposed at one end edge of the substrate; a second computer readable program code configured to bend the flexible portion of the substrate to place the waveguide exposed end in approximately a vertical position; a third computer readable program code configured to vertically position a flip-chip bonder bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and a fourth computer readable program code configured to fixably mount the optical component to the substrate edge.
摘要翻译： 一种用于制造光学组件的计算机程序产品，具有计算机可读存储介质，其具有实施的计算机可读程序代码，所述计算机可读程序代码包括第一计算机可读程序代码，其被配置为水平地定位包括波导的基板的柔性部分， 所述波导在所述基板的一个端部边缘处暴露; 第二计算机可读程序代码，被配置为弯曲所述基板的柔性部分以将所述波导暴露端放置在大致垂直位置; 第三计算机可读程序代码，被配置为在所述波导暴露的基板边缘上垂直地定位包含光学部件的倒装焊接接合头，以将所述光学部件与所述暴露的波导光学匹配; 以及第四计算机可读程序代码，其被配置为将所述光学部件可固定地安装到所述基板边缘。
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公开(公告)号：US20130067733A1
公开(公告)日：2013-03-21
申请号：US13676351
申请日：2012-11-14
IPC分类号： G02B6/13
CPC分类号： G02B6/42 , G02B6/13 , G02B6/3885 , G02B6/4214 , G02B6/43 , G02B2006/12166 , H05K1/0274 , H05K1/184 , H05K1/189 , H05K3/3405 , H05K13/00 , H05K2201/09081 , H05K2201/10121 , H05K2201/10674 , H05K2203/0195 , Y10T29/49002 , Y10T29/49037 , Y10T29/49124 , Y10T29/49826 , Y10T29/53
摘要： A flip-chip bonder fabricates an optical assembly by horizontally positioning a flexible portion of a substrate including a waveguide with the waveguide exposed at one end edge of the substrate; bending a portion of the flexible substrate to place the waveguide exposed end in approximately a vertical position; vertically positioning a bond head containing an optical component upon the waveguide exposed substrate edge to optically mate the optical component with the exposed waveguide; and fixably mounting the optical component to the substrate edge.
摘要翻译： 倒装式连接器通过水平地定位包括波导的基板的柔性部分来制造光学组件，波导在基板的一个端部边缘处露出; 弯曲柔性基板的一部分以将波导暴露端放置在大致垂直的位置; 将包含光学部件的接合头垂直地定位在波导暴露的衬底边缘上以将光学部件与暴露的波导光学匹配; 并将光学部件可固定地安装到基板边缘。
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公开(公告)号：US20210303983A1
公开(公告)日：2021-09-30
申请号：US16830333
申请日：2020-03-26
发明人： Stefan Abel , Bert Jan Offrein , Antonio La Porta , Pascal Stark
摘要： An optical synapse comprises a memristive device for non-volatile storage of a synaptic weight dependent on resistance of the device, and an optical modulator for volatile modulation of optical transmission in a waveguide. The memristive device and optical modulator are connected in control circuitry which is operable, in a write mode, to supply a programming signal to the memristive device to program the synaptic weight and, in a read mode, to supply an electrical signal, dependent on the synaptic weight, to the optical modulator whereby the optical transmission is controlled in a volatile manner in dependence on programmed synaptic weight.
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公开(公告)号：US20210302653A1
公开(公告)日：2021-09-30
申请号：US16832082
申请日：2020-03-27
发明人： Folkert Horst , Roger F. Dangel , Bert Jan Offrein
摘要： A method, system, and computer program product for using photorefractive material for analog optic storage and other applications of optical neuromorphic systems. The method may include coupling electromagnetic radiation into a first optical input and a second optical input, where the first optical input and the second optical input are part of an integrated optical device, the integrated optical device including: a first optical mode coupler connected to a first pair of optical ports including a first optical input and output; a second optical mode coupler connected to a second pair of optical ports including a second optical input and output, and the first optical mode coupler connected to the second optical mode coupler using a pair of arms (including a photorefractive material). The method may also include obtaining an optical interference pattern in the photorefractive material of each arm of the integrated optical device.
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公开(公告)号：US20170097468A1
公开(公告)日：2017-04-06
申请号：US15379523
申请日：2016-12-15
IPC分类号： G02B6/13 , G02B6/12 , H01L23/544
CPC分类号： G02B6/13 , G02B6/12004 , G02B6/131 , G02B6/132 , G02B6/136 , H01L23/544 , H01L2223/54426 , H01L2223/54453
摘要： A semiconductor structure and a method for manufacturing the semiconductor structure are provided. The semiconductor structure includes a processed semiconductor substrate. The processed semiconductor substrate includes active electronic components. The semiconductor structure also includes a dielectric layer that covers, at least partially, the processed semiconductor substrate. An interface layer that is suitable for growing optically active material on the interface layer is bonded to the dielectric layer. An optical gain layer and the processed semiconductor substrate are connected through the dielectric layer by electric and/or optical contacts.
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